• JSTS:Journal of Semiconductor Technology and Science
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• 제4권1호
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• pp.27-31
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• 2004

Models and simulations of gate tunneling current for thinoxide MOSFETs and Double-Gate SOIs are discussed. A guideline in design of leaky MOS capacitors is proposed and resonant gate tunneling current in DG SOI simulated based on quantum-mechanicalmodels. Gate tunneling current in fully-depleted, double-gate SOI MOSFETs is characterized based on quantum-mechanical principles. The simulated $I_G-V_G$ of double-gate SOI has negative differential resistance like that of the resonant tunnel diodes.

• JSTS:Journal of Semiconductor Technology and Science
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• 제9권3호
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• pp.136-147
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• 2009

In this paper we analyze the influence of source/drain (S/D) extension region design for minimizing short channel effects (SCEs) in 25 nm gate length single and double gate Silicon-on-Insulator (SOI) and Germanium-on-Insulator (GOI) MOSFETs. A design methodology, by evaluatingm the ratio of the effective channel length to the natural length for the different devices (single or double gate FETs) and technology (SOI or GOI), is proposed to minimize short channel effects (SCEs). The optimization of non-overlapped gate-source/drain i.e. underlap channel architecture is extremely useful to limit the degradation in SCEs caused by the high permittivity channel materials like Germanium as compared to that exhibited in Silicon based devices. Subthreshold slope and Drain Induced Barrier Lowering results show that steeper S/D gradients along with wider spacer regions are needed to suppress SCEs in GOI single/double gate devices as compared to Silicon based MOSFETs. A design criterion is developed to evaluate the minimum spacer width associated with underlap channel design to limit SCEs in SOI/GOI MOSFETs.

• JSTS:Journal of Semiconductor Technology and Science
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• 제13권3호
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• pp.237-244
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• 2013

A continuous, explicit drain-current equation for short-channel double-gate (DG) MOSFETs has been derived based on the explicit surface potential equation. The model is physically derived from Poisson's equation in each region of operation and adopted in the unified regional approach. The proposed model has been verified with numerical solutions, physically scalable with channel length and gate/oxide materials as well as oxide/channel thicknesses.

• 대한전자공학회논문지SD
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• 제40권6호
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• pp.379-383
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• 2003

Double-Gate MOSFET의 TSi변화에 따른 subthreshold 특성을 비교 분석하였다. Lightly-doped asymmetrical 소자의 경우에 symmetrical 소자에 비하여 subthreshold current가 TSi에 따라 급격하게 증가하는 현상을 발견하였으며 이는 낮은 depletion charge 때문에 TSi내의 전압분포가 linear한 특성을 갖는 것에 기인함을 밝혔다. 또한 이러한 현상을 설명할 수 있는 analytical equation을 유도하였으며 analytical equation 결과와 device simulation 결과를 비교하여 그 정확도를 검증하였다.

• 대한전자공학회논문지SD
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• 제46권10호
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• pp.16-24
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• 2009

Independent-Gate-Mode Double-Gate(IGM-DG) MOSFET는 기존의 DG-MOSFET의 3-terminal 소자구조가 갖고 있는 한계에서 벗어나 front-gate와 back-gate를 서로 다른 전압으로 구동하는 것이 가능하다. IGM-DG를 이용함으로써 4번째 단자의 자유도에 의해 회로설계가 간단해 질 뿐 아니라, 집적도를 향상시킬 수 있는 장점을 가진다. 본 논문에서는 IGM-DG MOSFET를 사용하여 RF 수신단을 설계하였고, HSPICE 시뮬레이션을 통해 회로성능을 검증하고 소자의 특성변화에 따른 최적의 회로설계 방향을 제시하였다.

• 대한전자공학회논문지SD
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• 제39권7호
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• pp.1-6
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• 2002

본 연구에서는 나노 스케일 SOI 소자의 최적 설계를 위하여 multi-gate 구조인 Double 게이트, Triple 게이트, Quadruple 게이트 및 새로이 제안한 Pi 게이트 SOI 소자의 단채널 현상을 시뮬레이션을 통하여 분석하였다. 불순물 농도, 채널 폭, 실리콘 박막의 두께와 Pi 게이트를 위한 vertical gate extension 깊이 등을 변수로 하여 최적의 나노 스케일 SOI 소자는 Double gate나 소자에 비해 단채널 특성 및 subthreshold 특성이 우수하므로 채널 불순물 농도, 채널 폭 및 실리콘 박막 두께 결정에 있어서 선택의 폭이 넓음을 알 수 있었다.

• 대한전자공학회논문지SD
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• 제41권8호
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• pp.17-24
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• 2004

Density-gradient 방법을 이용하여 게이트의 양자효과가 double-gate MOSFET의 단채널 효과에 미치는 영향을 2차원으로 분석하였다. 게이트와 sidewall 산화막 경계면에서 발생하는 2차원 양자공핍 현상에 의하여 게이트 코너에 큰 전하 다이폴이 형성되며 subthreshold 영역에서 다이폴의 크기가 증가하고 classical 결과에 비하여 전자 농도와 전압 분포가 매우 다름을 알 수 있었다. Evanescent-nude분석을 통하여 게이트의 양자효과가 소자의 단채널 효과를 증가시키며 이는 기판에서의 양자효과에 의한 영향보다 크다는 것을 확인하였다. 양자효과에 의하여 게이트 코너에 형성되는 전하 다이폴이 단채널 효과를 증가시키는 원인임을 밝혔다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.691-694
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• 2003

Density gradient method is used to analyze the quantum effect in MOSFET, Quantization effect in the poly gate leads to a negative threshold voltage shift, which is opposed to the positive shift caused by quantization effect in the channel. Quantization effects in the poly gate are investigated using the density gradient method, and the impact on the short channel effect of double gate device is more significant.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권2호
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• pp.170-177
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• 2008

In the present work a methodology to minimize short channel effects (SCEs) by modulating the effective channel length is proposed to design 25 nm single and double gate-source/drain underlap MOSFETs. The analysis is based on the evaluation of the ratio of effective channel length to natural/ characteristic length. Our results show that for this ratio to be greater than 2, steeper source/drain doping gradients along with wider source/drain roll-off widths will be required for both devices. In order to enhance short channel immunity, the ratio of source/drain roll-off width to lateral straggle should be greater than 2 for a wide range of source/drain doping gradients.

• JSTS:Journal of Semiconductor Technology and Science
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• 제10권2호
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• pp.107-117
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• 2010

An analytical subthreshold swing model is presented for symmetric double-gate (DG) MOSFETs with Gaussian doping profile in vertical direction. The model is based on the effective conduction path effect (ECPE) concept of uniformly doped symmetric DG MOSFETs. The effect of channel doping on the subthreshold swing characteristics for non-uniformly doped device has been investigated. The model also includes the effect of various device parameters on the subthreshold swing characteristics of DG MOSFETs. The proposed model has been validated by comparing the analytical results with numerical simulation data obtained by using the commercially available $ATLAS^{TM}$ device simulator. The model is believed to provide a better physical insight and understanding of DG MOSFET devices operating in the subthreshold regime.