• 센서학회지
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• 제11권2호
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• pp.84-92
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• 2002

국소 광적응 기능을 가지는 윤곽검출용 시각칩을 픽셀수 $32{\times}32$의 방사형 구조로 CMOS 공정기술을 이용하여 설계 및 제조하였다. 생체의 망막은 넓은 범위의 입력 광강도에 대해서 물체의 윤곽을 검출할 수 있다. 본 연구에서는 시세포, 수평세포, 쌍극세포로 이루어진 망막의 윤곽검출 기능을 모델링하여 윤곽검출용 인공시각칩을 설계하였다 국소 광적응을 위해 입력 광강도에 따라 수용야의 크기를 국소적으로 바뀌게 하였다. 아울러 단위셀을 방사형으로 배치함으로써 영상데이터의 양을 감소시킴과 동시에 칩의 중심부분으로 갈수록 해상도가 높아지도록 설계하였다. 설계된 칩은 $0.6\;{\mu}m$ double-poly triple-metal 표준 CMOS 공정기술을 이용하여 제조되었으며, HSPICE 시뮬레이션으로 성능을 최적화 시켰다.

• 한국위성정보통신학회논문지
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• 제7권2호
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• pp.18-24
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• 2012

본 논문에서는 ESD 방지를 위한 최적 방법론에 목표하여 확장된 드레인을 갖는 EDNMOS 소자의 더블 스냅백 현상 및 백그라운 도핑 농도 (BDC)의 영향을 조사하였다. 고전류 영역에서 낮은 BDC를 가진 EDNMOS 소자는 강한 스냅백으로 인해 취약한 ESD 성능과 높은 래치업 위험을 가지게 되나, 높은 BDC를 가진 EDNMOS 소자는 스냅백을 효과적으로 방지할 수 있음을 알 수 있었다. 따라서 BDC 제어로 안정적인 ESD 방지 성능과 래치업 면역을 구현할 수 있음을 밝혔다.

• 융합신호처리학회논문지
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• 제10권4호
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• pp.289-293
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• 2009

This study proposes a novel double-base log encoder (DBLE) for flash Analog-to-Digital converters (ADCs). Analog inputs of flash ADCs are represented in logarithmic number systems with bases of 2 and 3 at the outputs of DBLE. A look up table stores the sets of exponents of base 2 and 3 values. This algorithm improves the performance of a DSP (Digital Signal Processor) system that takes outputs of a flash ADC, since the double-base log number representation does multiplication operation easily within negligible error range in ADC. We have designed and implemented 6 bits DBLE implemented with ROM (Read-Only Memory) architecture in a $0.18\;{\mu}m$ CMOS technology. The power consumption and speed of DBLE are better than the FAT tree and binary ROM encoders at the cost of more chip area. The DBLE can be implemented into SoC architecture with DSP to improve the processing speed.

• Journal of electromagnetic engineering and science
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• 제8권3호
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• pp.91-95
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• 2008

This paper presents a direct-conversion I/Q up-mixer block, which supports $3{\sim}5$ GHz ultra-wideband(UWB) applications. It consists of a VI converter, a double-balanced mixer, a RF amplifier, and a differential-to-single signal converter. To achieve wideband characteristics over $3{\sim}5$ GHz frequency range, the double-balanced mixer adopts a shunt-peaking load. The proposed RF amplifier can suppress unwanted common-mode input signals with high linearity. The proposed direct-conversion I/Q up-mixer block is implemented using $0.18-{\mu}m$ CMOS technology. The measured results for three channels show a power gain of $-2{\sim}-9$ dB with a gain flatness of 1dB, a maximum output power level of $-7{\sim}-14.5$ dBm, and a output return loss of more than - 8.8 dB. The current consumption of the fabricated chip is 25.2 mA from a 1.8 V power supply.

• Journal of Astronomy and Space Sciences
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• 제29권3호
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• pp.315-320
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• 2012

We developed a mass-memory chip by staking 1 Gbit double data rate 2 (DDR2) synchronous dynamic random access memory (SDRAM) memory core up to 4 Gbit storage for future satellite missions which require large storage for data collected during the mission execution. To investigate the resistance of the chip to the space radiation environment, we have performed heavy-ion-driven single event experiments using Heavy Ion Medical Accelerator in Chiba medium energy beam line. The radiation characteristics are presented for the DDR2 SDRAM (K4T1G164QE) fabricated in 56 nm technology. The statistical analyses and comparisons of the characteristics of chips fabricated with previous technologies are presented. The cross-section values for various single event categories were derived up to ~80 $MeVcm^2/mg$. Our comparison of the DDR2 SDRAM, which was fabricated in 56 nm technology node, with previous technologies, implies that the increased degree of integration causes the memory chip to become vulnerable to single-event functional interrupt, but resistant to single-event latch-up.

• Current Optics and Photonics
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• 제2권6호
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• pp.576-581
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• 2018

A new approach for identification of a microwave frequency using an integrated optical waveguide chip, combined with a phase modulator (PM) and two microring resonators (MRRs), is proposed, theoretically deduced, and verified. By wavelength tuning to set the PM under the condition of a double side band (DSB), the measurement range can be started from the dc component, and the measurement range and response slope can be adjusted by designing the radius and transmission coefficient of the MRR. Simulations reveal that the amplitude comparison function (ACF) has a monotonic relationship from dc to 32.5 GHz, with a response slope of 5.15 dB under conditions of DSB modulation, when the radius values, transmission coefficients, and the loss factors are designed respectively as $R_1=400{\mu}m$, $R_2=600{\mu}m$, $t_1=t_2=0.63$, and ${\gamma}_1={\gamma}_2=0.66$. Theoretical calculations and simulation results both indicate that this new approach has the potential to be used for measuring microwave frequencies, with the advantages of compact structure and superior reconfigurability.

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권4호
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• pp.511-519
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• 2016

This paper proposes a CMOS 6-bit phase shifter with low RMS phase and amplitude errors for an X-band phased array antenna. The phase shifter combines a switched-path topology for coarse phase states and a switch-filter topology for fine phase states. The coarse phase shifter is composed of phase shifting elements, single-pole double-throw (SPDT), and double-pole double-throw (DPDT) switches. The fine phase shifter uses a switched LC filter. The phase coverage is $354.35^{\circ}$ with an LSB of $5.625^{\circ}$. The RMS phase error is < $6^{\circ}$ and the RMS amplitude error is < 0.45 dB at 8-12 GHz. The measured insertion loss is < 15 dB, and the return losses for input and output are > 13 dB at 8-12 GHz. The input P1dB of the phase shifter achieves > 11 dBm at 8-12 GHz. The current consumption is zero with a 1.2-V supply voltage. The chip size is $1.46{\times}0.83mm^2$, including pads.

• 한국위성정보통신학회논문지
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• 제8권2호
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• pp.36-43
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• 2013

본 논문에서는 고전압에서 동작하는 DDIC(display driver IC) 칩의 정전기 보호소자로 사용되는 GG_EDNMOS 소자의 고전류 특성 및 더블 스냅백 메커니즘이 분석되었다. 이온주입 조건을 달리하는 매트릭스 조합에 의한 수차례의 2차원 시뮬레이션 및 TLP 특성 데이타를 비교한 결과, BJT 트리거링 후에 더블 스냅백 현상이 나타났으나 웰(well) 및 드리프트(drift) 이온주입 조건을 적절히 조절함으로써 안정적인 ESD 보호성능을 얻을 수 있었다. 즉, 최적의 백그라운드 캐리어 밀도를 얻는 것이 고전압 동작용 정전기보호소자의 고전류 특성에 매우 중요한 영향을 주는 임계인자(critical factor)임을 알 수 있었다.

• Journal of Electrical Engineering and information Science
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• 제2권4호
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• pp.8-13
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• 1997

This paper describes a scalable systolic synchronous memory for digital signal processing and packet switching. The systolic synchronous memory consists of the 2-D array of small memory blocks which are fully pipelined and communicated in three directions with adjacent blocks. The maximum delay of a small memory block becomes the operation speed of the chip. The array configuration is scalable for the entire memory size requested by an application. it has the initial latency of N+3 cycles with NxN array configuration. We designed an experimental 200 MHz 4Kb static RAM chip with the 4x4 array configuration of 256 SRAM blocks. It was fabricated is 0.8$\mu\textrm{m}$ twin-well single-poly double-metal CMOS technology.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 신호처리소사이어티 추계학술대회 논문집
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• pp.103-106
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• 2003

An oscillatory neural network circuit has been designed and fabricated in an 0.5 ${\mu}{\textrm}{m}$ double poly CMOS technology. The proposed oscillatory neural network consists of 3 neural oscillator cells with excitatory synapses and a neural oscillator cell with inhibitory synapse. Simulations of a network of oscillators demonstrate cooperative computation. Measurements of the fabricated chip in condition of $\pm$ 2.5 V power supply is shown.