• 마이크로전자및패키징학회지
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• 제28권1호
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• pp.39-46
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• 2021

Cu 배선(interconnect) 적용을 위한 다층박막의 적층 구조에 따른 최적 계면접착에너지(interfacial adhesion energy, Gc) 평가방법을 도출하기 위해, Ta, Cu 및 tetraethyl orthosilicate(TEOS-SiO2) 박막 계면의 정량적 계면접착에너지를 double cantilever beam(DCB) 및 4-점 굽힘(4-point bending, 4-PB) 시험법을 통해 비교 평가하였다. 평가결과, Ta확산방지층이 적용된 시편(Cu/Ta, Cu/Ta/TEOS-SiO2)에서는 두 가지 평가방법 모두 반도체 전/후 공정에서 박리가 발생하지 않는 산업체 통용 기준인 5 J/㎡ 보다 높게 측정되었다. Ta/Cu 시편의 경우 DCB 시험에서만 5 J/㎡ 보다 낮게 측정되었다. 또한, DCB시험 보다 4-PB시험으로 측정된 Gc가 더 높았다. 이는 계면파괴역학 이론에 따라 이종재료의 계면균열 선단에서 위상각의 증가로 인한 계면 거칠기 및 소성변형에 의한 에너지 손실이 증가 하는것에 기인한다. 4-PB시험결과, Ta/Cu 및 Cu/Ta계면은 5 J/㎡ 이상의 높은 계면접착에너지를 보이므로, 계면접착에너지 관점에서는 Ta는 Cu배선의 확산방지층(diffusion barrier layer) 및 피복층(capping layer)으로 적용 가능할 것으로 생각된다. 또한, 배선 집적공정 및 소자의 사용환경에서 열팽창 계수 차이에 의한 열응력 및 화학적-기계적 연마 (chemical mechanical polishing)에 의한 박리는 전단응력이 포함된 혼합모드의 영향이 크므로 4-PB 시험으로 측정된 Gc와 연관성이 더 클 것으로 판단된다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 하계학술대회 논문집 C
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• pp.1442-1444
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• 1995

In this study, we confirmed that the crystallinity and the mechanical properties of polycrystalline Silicon(poly-Si) deposited on the poly-oxide are better than those of poly-Si on the conventional sacrificial layers that is CVD oxide layer or PSG. But the etch rate of poly-oxide is poor than that of the CVD oxide layer or PSG. Therefore, to make the best use of small stress and fast etch rate, we fabricated the double oxide layer; 10%-thick poly-oxide on 90%-thick CVD oxide or PSG. To estimate structure deformation by stress, we fabricated the test structures; cantilever. bridge and ring/beam structure and estimated by SEM. As the results, all structure is expressed the deformed structure by residual stress(tensile stress) and the deformation of the structure layer on the double oxide layer is small compared with that of the structure layer on the CVD oxide layer or PSG. And, the etch rate of the double oxide layer is enhanced compared with that of the poly-oxide.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.63-69
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• 2012

Adhesion and mechanical reliability of silicon/epoxy/polyimide interfaces are critical issues for flexible electronics. Bonds between these interfaces are mainly hydrogen bonds, so their adhesion is weaker than cohesive fracture toughness and vulnerable to moisture. In order to enhance adhesion and suppress moisture-assisted debonding, UV/Ozone treatment and innovative sol-gel derived hybrid layers were applied to silicon/epoxy/polyimide interfaces. The fracture energy and subcritical crack growth rate were measured by using a double cantilever beam (DCB) fracture mechanics test. Results showed that UV/Ozone treatment increased the adhesion, but was not effective for improving reliability against humidity. However, by applying sol-gel derived hybrid layers, adhesion increase as well as suppresion of moisture-assisted cracking were achieved.

• 한국세라믹학회지
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• 제31권10호
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• pp.1099-1106
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• 1994

It is suggested that the microstructural toughening process in the initial rising portion of R-curves observed in polycrystalline alumina should be different from the grain bridging mechanism identified in the long crack regime. Microcracking in the advancing crack front seems to be a prerequisite for the development of unbroken bridging ligaments behind the crack tip. In order to test such a proposition, attempts were made to identify experimentally the presence of microcracks in the frontal zone of propagating cracks. In-situ observation is made of crack growth in a miniature double cantilever beam specimen of a average grain size of 10 ${\mu}{\textrm}{m}$ alumina. Presence of a few microcracks was identified in front of crack tip on the propagating crack plane. The R-curves were re-evaluated based on the observation.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1998년도 춘계학술대회 논문집
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• pp.220-226
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• 1998

In this pater, a method of strength evaluation applying fracture mechanics in adhesively bonded joints of A1/A1 materials was investigated. Various adhesively bonded joints of double-cantilever beam with a interfacial crack in its adhesive layer were prepared for the fracture toughness test of comprehensive mixed mode conditions from nearly pure mode I to mode II. The experiment of fracture toughness was carried out under various mixed mode conditions with an interfacial crack and critical energy release rate, Gc by the experimental measurements of compliances was determined. From the results, fracture toughness on mixed mode with an interfacial crack is well characterized by strain energy release rate and a method of strength evaluation by the fracture toughness in adhesively bonded joints of A1/A1 materials was discussed.

• 한국자동차공학회논문집
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• 제14권2호
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• pp.67-75
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• 2006

In this paper, the compensation of ultrasonic scattering on interface crack depending on thickness variations of A1/Epoxy bonded dissimilar components was applied to improve measuring accuracy by using ultrasonic attenuation coefficient. The optimum conditions of theoretical value and experimental measuring accuracy by the ultrasonic method in A1/Epoxy bonded dissimilar components have been investigated. From the experimental results, the measurement method of interfacial crack lengths by using ultrasonic attenuation coefficient was proposed and discussed. After the ultrasonic scattering compensation depending on thickness variations of bonded dissimilar components was carried out, the measuring accuracy of interfacial crack length was improved by 5%.

• 한국안전학회지
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• 제20권1호
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• pp.49-54
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• 2005

Recently, many kinds of advanced composite materials have been used in various industry fields. Among them, fabric CFRP composites are being used as primary structural components in many applications because of their superior properties. However, the complexity of the fabric structure makes understanding of their failure behavior very difficult. The mechanical strength and crack propagation of plain woven carbon fiber fabric laminate composites are examined by acoustic emission(AE) method. AE signals are acquired during the tensile test and fracture tests. Thus, the relationship between AE signal and mechanical behavior curves and crack extension length are shown. Also the interlaminar fracture toughness in terms of AE characteristics are discussed in viewpoint of crack propagation behavior.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.25-30
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• 2004

In this paper, the compensation of interfacial scatter due to adhesive layer and adherend thickness ratio variation was applied to improve measuring precision by calculating ultrasonic attenuation coefficient in the Al/Epoxy dissimilar bonded components. The optimum condition of theoretical value and experimental measuring accuracy by the ultrasonic method in the Al/Epoxy dissimilar bonded components have been investigated. From the experimental results, we proposed a measurement method of the interfacial crack lengths by the ultrasonic attenuation coefficient and discussed it.

• 한국정밀공학회지
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• 제20권3호
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• pp.157-164
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• 2003

The pulse-echo method is one of the most widely used ultrasonic techniques for application of nondestructive evaluation. Particularly, quantitative nondestructive evaluation of defects has been considered more important to assure the reliability and the safety of structure. Frequency energy in adhesive joints is based on the ultrasonic wave analysis. The attenuation coefficient upon wave amplitude and the frequency energy that is expressed in the term of wave pressure amplitude were utilized for the primary wave experiment. By means of a control experiment, it was confirmed that the variation of the frequency energy in adhesive joints depends on transition by stress variation. In this paper, the ultrasonic characteristics were measured for single lap joint and Double Cantilever Beam specimen with different fracture modes that was subjected to stress. Consequently, the data that was obtained from the adhesive specimen was analytically compared to the fracture mechanics parameter

• 대한기계학회논문집A
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• 제33권5호
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• pp.474-481
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• 2009

Fracture models and criteria of adhesive with two parameters, namely $G_C$ and ${\sigma}_{max}$, have been developed to describe the fracture process of adhesive joints. Cohesive zone model(CZM) is a representative two parameter failure criteria approach. In CZM, ${\sigma}_{max}$ is a critical, limiting maximum value of the stress in the damage zone ahead of the crack and is assumed to have some physical significance in adhesive failure. Based on CZM and finite element analysis method, the relationship between fracture load and adhesive properties, as $G_{IC)$ and $({\sigma}_{max})_I$, was investigated in adhesively bonded joint tensile test and T-peel test. The two parameters in tensile mode loading were evaluated by using the relationship. The value of $G_{\IC}$ evaluated by proposed method showed close agreement with analytical solution for tapered double cantilever beam(TDCB) test which proposed in an ASTM standard.