• Title/Summary/Keyword: Double cantilever beam(DCB)

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Measurement of Interfacial Crack Length by Ultrasonic Attenuation Coefficients on Adhesively Bonded Components (접착부재의 초음파 감쇠계수에 의한 계면균열 길이의 측정)

  • 정남용;박성일
    • Transactions of the Korean Society of Automotive Engineers
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    • v.12 no.1
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    • pp.130-137
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    • 2004
  • The ultrasonic attenuation coefficients were measured by interfacial crack length in the adhesive components of double-cantilever beam(DCB). The energy release rate, G, was obtained by the experimental measurement of compliance. The numerical analysis by the boundary element method(BEM) and Ripling's equation was investigated. The experimental results represent that the relation between interfacial crack length for the ultrasonic attenuation coefficient and energy release rate is increased proportionally. A measurement method of the interfacial crack length by the ultrasonic attenuation coefficient was proposed and discussed.

Measurement of Crack Length by Ultrasonic Attenuation Coefficient (초음파 감쇠계수에 의한 균열길이의 측정)

  • Chung, Nam-Yong;Park, Sung-Il
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.4
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    • pp.386-393
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    • 2004
  • In this paper, the ultrasonic attenuation coefficient was measured by variation of crack length for double-cantilever beam(DCB) specimen. The energy release rate, G, was obtained by the experimental measurement of compliance. The experimental results represents that the crack length for the ultrasonic attenuation coefficient and energy release rate is increases proportionally From the experimental results, we proposed a detecting method of the crack length by the ultrasonic attenuation coefficient and discussed it.

A Study on the Surface Treatment of Prepreg with $Ar^+$ Ion to Increase Mode I Fracture Characteristics of Fiber-Reinforced Composites (섬유강화 적층복합재의 열림모드 파괴특성 향상을 위해 $Ar^+$ 이온도움반응법을 적용한 프리프레그의 표면처리 연구)

  • Lee, Gyeong-Yeop;Ji, Chang-Heon;Yang, Jun-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.11
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    • pp.2771-2776
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    • 2000
  • In this work, the effect of surface treatment of prepreg on the mode I fracture behavior was studied. Unidirectional (0-deg) double cantilever beam (DCB) specimens were used for fracture tests. Two groups of DCB specimens were made: the first group was made of prepregs surface-treated by Ar(sup)+ ion beam under oxygen environment and the second group was made of regular prepregs. For both groups, fracture resistance curve (R-curve) was determined and compared to each other, Results showed that resistance behavior of the first group is better than that of the second group. That is, mode I fracture toughness, G(sub)Ic of the first group is 24% larger than that of the second group. SEM examination shows that the improvement of G(sub)Ic is due to the increase of interfacial strength between plies.

The Evaluation of Interlaminar Fracture Toughness and AE Characteristics in a Plain Woven CFRP Composite with DCB Specimen (DCB 시험편의 평직 CFRP 복합재 층간파괴인성 및 AE 특성 평가)

  • Yun Yu-Seong;Kwon Oh-Heon
    • Journal of the Korean Society of Safety
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    • v.20 no.1 s.69
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    • pp.49-54
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    • 2005
  • Recently, many kinds of advanced composite materials have been used in various industry fields. Among them, fabric CFRP composites are being used as primary structural components in many applications because of their superior properties. However, the complexity of the fabric structure makes understanding of their failure behavior very difficult. The mechanical strength and crack propagation of plain woven carbon fiber fabric laminate composites are examined by acoustic emission(AE) method. AE signals are acquired during the tensile test and fracture tests. Thus, the relationship between AE signal and mechanical behavior curves and crack extension length are shown. Also the interlaminar fracture toughness in terms of AE characteristics are discussed in viewpoint of crack propagation behavior.

A Study on Mode I Interlaminar Fracture Toughness of Foam Core Sandwich Structures

  • Sohn, Se-Won;Kwon, Dong-Ahn;Hong, Sung-Hee
    • International Journal of Precision Engineering and Manufacturing
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    • v.2 no.3
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    • pp.47-53
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    • 2001
  • This paper investigates the characteristics of interlaminar fracture toughness of foam core sandwich structures under opening mode by using the double cantilever beam (DCB) specimens which are Carbon/Epoxy and foam core composites. Instead of using a DCB specimen of symmetric geometry, a non-symmetric DCB specimen was used to calculate the interlaminar fracture toughness. Three approaches for calculating the energy release rate(G$\sub$IC/) were used and fracture toughness of foam core sandwich structures made by autoclave, vacuum bagging and hotpress were compared. Experiment, analysis using nonlinear beam bending theory, and numerical work by FEM methods were performed. Bonding surface compensation and equivalent moment of inertia were used to calculate the energy release rate in nonlinear analytical work. Conclusions of experimental, nonlinear analytical and FEM methods were compared. It is, also, shown that the vacuum bagging forming can substitute the method of autoclave without serious loss of Mode I energy release rate(G$\sub$I/).

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A Study on Analysis of Mode I interlaminar Fracture Toughness of Foam Core Sandwich Structures (FOAM CORE SANDWICH 구조재의 Mode I 층간분리 파괴인성의 해석에 관한 연구)

  • Son, Se-Won;Gwon, Dong-An;Hong, Seong-Hui
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.9
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    • pp.81-86
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    • 2000
  • This paper was carried out to investigate the characteristics of interlaminar fracture toughness of foam core sandwich structures under opening loading mode by using the double cantilever beam (DCB) specimens in Carbon/Epoxy and foam core composites. instead of using symmetric geometry of DCB specimen non-symmetric DCB specimen was used to calculate the interlaminar fracture toughness. Three approaches for calculating the energy release rate({{{{ {G }_{IC } }}}}) were compared. Fracture toughness of foam core sandwich structures by autoclave vacuum bagging and hotpress were compared and analyzed. Experiment nonlinear beam bending FEM method were performed. Suggested bonding surface compensation and equivalent area inertia moment was used to calculate the energy release rate in nonlinear analytical results. The conclusions among experimental nonlinear analytical and FEM results was observed. The vacuum bagging method was shown to be able to substitute method in stead of autoclave without serious loss of Mode I energy release rate({{{{ {G }_{IC }}}}}) to be able to substitute method in stead of autoclave without serious loss of Mode I energy release rate({{{{ {G }_{IC }}}}}).

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Effect of Ta/Cu Film Stack Structures on the Interfacial Adhesion Energy for Advanced Interconnects (미세 배선 적용을 위한 Ta/Cu 적층 구조에 따른 계면접착에너지 평가 및 분석)

  • Son, Kirak;Kim, Sungtae;Kim, Cheol;Kim, Gahui;Joo, Young-Chang;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.1
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    • pp.39-46
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    • 2021
  • The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.

Experimental investigation of interlaminar mechanical properties on carbon fiber stitched CFRP laminates

  • Iwahori, Yutaka;Ishikawa, Takashi;Watanabe, Naoyuki;Ito, Akira;Hayashi, Yoichi;Sugimoto, Sunao
    • Advanced Composite Materials
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    • v.16 no.2
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    • pp.95-113
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    • 2007
  • Experimental investigations of interlaminar mechanical properties for carbon fiber reinforced plastic (CFRP) laminates were carried out using aramid fiber ($Kevlar^{(R)}$-29 1000d) and carbon fiber (TR40-1K 612d, Mitsubishi Rayon) stitching. Various carbon fiber (CF) stitch densities were used to prepare a number of CF stitched CFRP laminates for double cantilever beam (DCB) tests. An insert tongue-type loading fixture, developed by the Japan Aerospace Exploration Agency (formerly the National Aerospace Laboratory of Japan), was also employed in the DCB test. Interlaminar tension tests were carried out under an out-of-plane directional loading using a single CF stitch thread in the CFRP laminates. The DCB test results clarified that the relationship between the volume fractions of the CF stitch thread ($V_{ft}$) and mode I critical energy release rate ($G_{Ic}$) showed a mostly linear function with a higher gradient than that of the $Kevlar^{(R)}$ stitched CFRP laminates. The CF stitched CFRP tension test results indicated that the consumption energy per unit area ($E_i$) was larger than that of $Kevlar^{(R)}$ stitched CFRP laminates.

Measurement of EMC/PCB Interfacial Adhesion Energy of Chip Package Considering Warpage (휨을 고려한 칩 패키지의 EMC/PCB 계면 접합 에너지 측정)

  • Kim, Hyeong Jun;Ahn, Kwang Ho;Oh, Seung Jin;Kim, Do Han;Kim, Jae Sung;Kim, Eun Sook;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.101-105
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    • 2019
  • The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.

Finite Element Analysis and Validation for Mode I Interlaminar Fracture behavior of Woven Fabric Composite For a Train Carbody Using CZM(Cohesive Zone Model) (CZM(Cohesive Zone Model)을 이용한 철도차량용 직물 복합재의 모우드 I 층간파괴의 해석적 연구)

  • Kim, Seung-Chul;Kim, Jung-Seok;Yoon, Hyuk-Jin;Seo, Seung-Il
    • Proceedings of the KSR Conference
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    • 2009.05a
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    • pp.239-246
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    • 2009
  • The Mode I interlaminar fracture toughness of woven fabric carbon/epoxy and glass/epoxy composites for a train carbody was measured and FEM analysis was conducted. The woven fabric epoxy composite manufactured by hand lay-up, has high stiffness and strength, good resistance for impact, fatigue, corrosion and in-plane failure. The DCB(Double Cantilever Beam) specimen made of woven fabric epoxy composite had the size of 180mm $\times$ 25mm $\times$ 5mm and the insert of 65mm. The Mode I interlaminar toughness of specimen was measured according to ASTM 5528-01. The crack propagation behavior of the DCB specimen was simulated using FEA with cohesive elements that model the adhesive layer between woven fabric plies.

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