• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.28 no.8
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• pp.337-342
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• 2016

A marine SCR System is emerging as an alternative to comply with NOx Tier III Emission standards, a restriction on greenhouse gas from vessels implemented by the International Maritime Organization. The system is greatly affected by the uniformity of the fluid flowing into the catalyst, so the performance of the catalyst of an SCR system needs to be guaranteed. This study conducted research on a mixed evaporator of an SCR system, which is one of the factors affecting the uniformity of the fluid. When the angle of the mixed evaporator is set to $90^{\circ}$, the fluid uniformity is at its highest at 83%, under the condition that the length of the mixed evaporator be 3.5 D. When the length was 3.5 D and less, the fluid uniformity had a tendency to improve relative to the case without a bent pipe. However, a longer mixed evaporator results in a more perfect liquidity development in the pipe with a liquidity distribution similar to the case where no curved pipe is formed in front of the catalyst. A lower angle for the mixed evaporator results in a lower flow uniformity, and a longer length of the mixed evaporator results in a lower difference in the flow uniformity caused by the angle. The flow uniformity can be improved by 6% with a mixed evaporator, which confirmed that all factors applied to an SCR system have a close relationship with the efficiency.

• Journal of agriculture & life science
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• v.52 no.6
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• pp.111-125
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• 2018

In this study, we evaluated the uniformity of deposition rate and particle size distributions of the variable rate application technique using the unmanned rotorcraft by measuring the spray pattern according to path location in the range of spraying flight. The coefficient of variation (CV) of the lateral coverage rate for the overlapped distribution with the spray swath of 3.6 m in both guidance and auto-pilot flight modes maintaining constant flight speed was about 30% and the CV of the coverage rate by the flight path location was extremely small. Therefore, it was assessed that the variable rate application technology compensating for the variation of ground speed was superior in terms of spray uniformity. In addition, the droplet size distributions in both volume median diameter(VMD) and number median diameter(NMD) were adequate for aerial application and uniform in terms of lateral distribution. Thereafter, we intend to contribute to a precise application on small-scaled fields using the unmanned agricultural rotorcraft by the variable rate application.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.6
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• pp.647-653
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• 1988

A rapid thermal annealing system using tungsten halogen lamp has been designed and assembled. A control scheme where the temperature control is executed with calculated wafer temperature by considering the thermocouple delay rather than measured thermocouple temperature,is proposed. This control scheme gives more accurate control of the wafer temperature. In addition, the distribution of transmitted light power to the wafer in the system has been simulated, and lamp interval modification has been able to give more uniform light power distribution. Considering incident light spectrum, absorption, reflection, radiation of silicon, etc., temperature profile has been simulated. When the light power uniformity on the 3" wafer is below 1%, the temperature uniformity is about 2%.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.278-283
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• 2003

Analysis has been carried out to investigate the temperature variation and the uniformity of the temperature distribution of the glass panel by infrared radiant heating. Halogen lamps are used to heat the panel and located near the top and bottom of the rectangular chamber. The thermal energy is transfered only by radiation and the radiation exchange occurs only on the solid surfaces and is considered by using the view factor. The results show that the uniformity of the temperature distribution of the panel is improved but the time for heating increases as the wall reflectivity is large. The temperature difference reaches a maximum in the early stage of the heating process and then decreases until it reaches the uniform steady-state value.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.58-58
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• 2009

Uniformity related issues in chemical mechanical polishing (CMP) are within wafer non-uniformity (WIWNU), wafer to wafer non-uniformity (WTWNU), planarity and dishing/erosion. Here, the WIWNU that originates from spatial distribution of independent variables such as temperature, sliding distance, down force and material removal rate (MRR) during CMP, relies to spatial dependency. Among various sources of spatial irregularity, hardness and modulus of pad and surface roughness in sources for pad uniformity are great, especially. So, we investigated the spatial variation of pad surface characteristics using pad measuring system (PMS) and roughness measuring system. Reduced peak height ($R_{pk}$) of roughness parameter shows a strong correlation with the removal rate, and the distribution of relative sliding distance onwafer during polishing has an effect on the variation of $R_{pk}$ and WIWNU. Also, the results of pad wear profile thorough developed pad profiler well coincides with the kinematical simulation of conditioning, and it can contribute for the enhancement of WIWNU in CMP process.

• Progress in Superconductivity and Cryogenics
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• v.14 no.2
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• pp.16-19
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• 2012

The influence of current distribution on the transport current loss in vertically stacked high-$T_c$ superconductor (HTS) tapes was evaluated. AC loss was analyzed as a function of current distribution by introducing a current distribution parameter through a numerical method (finite element analysis). AC loss under non-uniform current distribution is always higher than that for a uniformly distributed transport current in a conductor. Although the effect of non-uniformity is relatively insignificant in low transport current, AC loss increases substantially in high transport current regions as non-uniformity is enlarged. The results verify that non-uniform current distribution causes extra loss by examining the cross-sectional view of current densities in stacked conductor.

• Clean Technology
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• v.18 no.4
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• pp.410-418
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• 2012

The performance of the ammonia injection gun (AIG) used for maximizing the utilization of reducing agent in the selective catalytic reduction (SCR) system is decided by several parameters such as the pattern of flow distribution, geometry of the air distribution manifold (ADM) and the array and geometry of nozzles. In the study, the uniformity of jet flows from the nozzles in AIG was analyzed statistically by using the computational fluid dynamics (CFD) method to evaluate the role of design parameters on the performance of the SCR system. The uniformity of jet flows from the nozzles is being deteriorated with increasing the supplying flow rate to the AIG. Distribution rates to each branch pipe become lower with decreasing distance to the header, and flow rates from nozzle are also reduced with decreasing distance to the header. The uniformity of jet flows from nozzles becomes stable significantly when the ratio of summative area of nozzles to each sectional area of the branch pipe is below 0.5.

• Journal of Biosystems Engineering
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• v.39 no.2
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• pp.87-95
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• 2014

Purpose: The purpose of this study was to design a variable frequency LED light system for plant factory which combined red, blue, green, white, and UV lights and controlled the ratio of the light wavelength. In addition, this study evaluated the performance of each combination of LED to verify the applicability. Methods: Four combinations of LED (i.e. Red+Blue, Red+Blue+Green, Red+Blue+White, Red+Blue+UV) were designed using five types of LED. The system was designed to control the duty ratio of each wavelength of LED by 1% interval from 0~100%, the pulse by 1Hz interval from 1~20kHz. Response characteristics of the control system, spectral distribution of each combination, light uniformity and uniformity ratio were measured to test the performance of the system. Results: Clean waveforms were measured from 10Hz to 10kHz regardless of duty ratio. Frequency distortion was observed within 5% of inflection point at frequencies above 10kHz regardless of duty ratio, but it was judged negligible. Spectra showed a normal distribution, and maximum PPF with duty ratio of 100% was $271.4{\mu}mol{\cdot}m^{-2}{\cdot}s^{-1}$ for the Red+Blue combination. PPF of the Red+Blue+Green combination was $258.9{\mu}mol{\cdot}m^{-2}{\cdot}s^{-1}$, and that of the Red+Blue+White combination was $273.9{\mu}mol{\cdot}m^{-2}{\cdot}s^{-1}$. PPF of the Red+Blue+UV combination was $267.7{\mu}mol{\cdot}m^{-2}{\cdot}s^{-1}$. Uniformity ratio for the area excepting border showed 0.90 for the Red+Blue and Red+Blue+White combinations, 0.87 for the Red+Blue+Green combination, and 0.88 for the Red+Blue+UV combination. The light was irradiated evenly at the area excepting border, so it was suitable for plant growing. Conclusions: From the results of this study, response characteristics of the control system, spectral distribution of each combination, light uniformity and uniformity ratio were suitable for applying into the plant factory.

• Journal of the Korean Vacuum Society
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• v.11 no.2
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• pp.113-118
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• 2002

We developed engineering methods to control gas flow in a plasma reactor in order to achieve good etch depth uniformity for large area GaAs etching. Finite difference numerical method was found quite useful for simulation of gas flow distribution in the reactor for dry etching of GaAs. The experimental results in $BCl_3/N_2/SF_6/He$ ICP plasmas confirmed that the simulated data fitted very well with real data. It is noticed that a focus ring could help improve both gas flow and etch uniformity for 150 mm diameter GaAs plasma etch processing. The simulation results showed that optimization of clamp configuration could decrease gas flow uniformity as low as $\pm$ 1.5% on an 100 mm(4 inch) GaAs wafer and $\pm$ 3% for a 150 m(6 inch) wafer with the fixed reactor and electrode, respectively. Comparison between simulated gas flow uniformity and real etch depth distribution data concluded that control of gas flow distribution in the chamber would be significantly important in order or achieve excellent dry etch uniformity of large area GaAs wafers.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.4
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• pp.373-378
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• 2002

This paper presents the results of an electromagnetic field uniformity of a triangular reverberation chamber that can be used alternatively for analysis and measurement of electromagnetic interference and immunity test. Equilateral triangular reverberation chamber and Schroeder diffusers were designed and fabricated for this purpose. FDTD simulation method was applied to analyze the field distribution inside of two different types of reverberation chambers. As a result, the electromagnetic field uniformity was improved inside of triangular reverberation chambers, and the measured field uniformity was improved by 1 ∼4 ㏈ compared to the ones without diffusers.