• ETRI Journal
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• 제27권3호
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• pp.337-340
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• 2005

A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit(PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.

• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.9-16
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• 2012

Currently due to increasing integration of various electronic devices and need of multi-functions, more and more heat is produced and for electronic devices to achieve maximum performance with optimum life time, heat dissipation is critical. A solution to such problems is use of high heat dissipative insulating sheet. In this paper status of current products are introduced and several technology aspects to meet the demand of increased heat dissipation needs is introduced.

• Earthquakes and Structures
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• 제24권3호
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• pp.183-192
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• 2023

It is essential to properly understand the seismic behavior of reinforced concrete (RC) columns confined by stirrups that experience different corrosion rates. The current study investigated the effect of seismic performance indicators such as strength loss, energy dissipation rate, ductility and hysteresis damping on specimens and models for different stirrup corrosion rates. Analysis revealed the adverse effects of corrosion on the bond performance between the concrete and steel bars which affected the seismic performance of the columns. It was found that with increasing corrosion rate, ductility and energy dissipation of the specimens decreased. Compared with the uncorroded specimen, the ductility factor and energy dissipation decreased observably, by 22.89% and 60.64%, respectively. An attenuation relationship is proposed for the corrosion rate of the stirrups for different stirrup yield strengths, concrete compressive strengths, concrete covers and stirrup spacing.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2009년도 추계학술대회 논문집
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• pp.335-338
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• 2009

In this study, in order to investigate the thermal and electrical properties of ZnO arrester block against 60[Hz] AC voltage, the changes in leakage current were measured. The temperature distribution appearing on the ZnO arrester blocks was observed using a forward looking infrared camera. In particular, the correlation between the thermal and electrical properties of a ZnO arrester block was analyzed experimentally. From this analysis, the thermal phenomena resulting from the heat generation and dissipation of the ZnO arrester block were interpreted. The degradation and thermal runaway phenomena of ZnO arrester block are closely related to the temperature limit of the ZnO arrester block. The installation of an additional metal electrode has resulted in the decrease of the leakage current due to the heat dissipation.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 학술대회 논문집 전문대학교육위원
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• pp.125-127
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• 2007

Presented increase and so on of switch stress and switching dissipation and EMI that is happened in general PWM converter and in this study to solve problem the resonance energy return to life rate and new active snubber PWM converter because do maximization. Active snubber PWM converter that try adds auxiliary switch and resonance capacitor, diode to existing converter under all switching conditions turn on/off Minimised switching dissipation that occur. Reduced harmonic components absorbing station recovery electric current that happen to snubber diode inserting diode and resistance. And decreased peak current that is happened in auxiliary switch arranging resonance capacitor and inductor properly, Certified effect that efficiency rises about 2.5[%] more than existent PWM converter in rated load through an experiment.

• 대한전기학회논문지:전기기기및에너지변환시스템부문B
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• 제50권7호
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• pp.338-346
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• 2001

In this paper, dc link currents for the three-phase diode rectifiers and PWM inverters are analyzed and an algorithm of estimating the life of dc link electrolytic capacitors using the analyzed ripple current is presented. Since the capacitor life is dependent on the operating temperature, the power dissipation in capacitors should be calculated. For this, the ESR(equivalent series resistance) model of the capacitor is derived and ripple currents through the capacitor are analyzed. Relating the power dissipation and the heat transfer equation, the internal operating temperature is calculated. Then, the capacitor life can be predicted by using Arrhenius's equation. An example for applications is given for the practical system.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2018년도 추계학술대회
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• pp.36-38
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• 2018

As the battery capacity requirement increases, battery cells are connected in a parallel configuration. However, the sharing current of each battery cell becomes unequal due to the imbalance between cell's impedance which results the mismatched states of charge (SOC). The conventional fixed-resistance balancing methods have a limitation in battery equalization performance and system efficiency. This paper proposes a battery equalization method based on dynamic resistance technique, which can improve equalization performance and reduce the loss dissipation. Based on the SOC rate of parallel connected battery cells, the switches in the equalization circuit are controlled to change the equivalent series impedance of the parallel branch, which regulates the current flow to maximize SOC utilization. To verify the method, operations of 4 parallel-connected 18650 Li-ion battery cells with 3.7V-2.6Ah individually are simulated on Matlab/Simulink. The results show that the SOCs are balanced within 1% difference with less power dissipation over the conventional method.

• 한국전기전자재료학회논문지
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• 제30권5호
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• pp.270-275
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• 2017

Current progress in the development of semiconductor technology in applications involving high electron mobility transistors (HEMT) and power devices is hindered by the lack of adequate ways todissipate heat generated during device operation. Concurrently, electronic devices that use gallium nitride (GaN) substrates do not perform well, because of the poor heat dissipation of the substrate. Suggested alternatives for overcoming these limitations include integration of high thermal conductivity material like diamond near the active device areas. This study will address a critical development in the art of GaN on diamond (GOD) structure by designing for ideal heat dissipation, in order to create apathway with the least thermal resistance and to improve the overall ease of integrating diamond heat spreaders into future electronic devices. This research has been carried out by means of heat transfer simulation, which has been successfully demonstrated by a finite-element method.

• 한국안전학회지
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• 제20권1호
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• pp.87-93
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• 2005

In this paper, we analyzed ignition characteristics of combustible material and the waveform of power dissipation, voltage and current by poor contact. And the surface structure of plug by poor contact was analyzed. In the results of experiment, the heat generated by poor contact and ignited the combustible material on power cord sets. The insulation material was molten and carbonized by the heat conduction though plug pit and voids were formed inside of insulation material. The waveform of voltage and power dissipation distorted because of a growth of oxidation by poor contact. In particular, in case that load was big load, the waveform of voltage and power dissipation severely distorted as with the passage of time. The surface of plug pin was changed from erosion mark to welding mark according to big load. The results will be applied to the cause analysis of electrical disaster.

• Journal of Electrical Engineering and Technology
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• 제9권5호
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• pp.1471-1481
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• 2014

This paper presents the new power dissipation model of individual switching device in a high-level modular multilevel converter (MMC), which can be mostly used in voltage sourced converter (VSC) based high-voltage direct current (HVDC) system and flexible AC transmission system (FACTS). Also, the voltage balancing method based on sorting algorithm is newly proposed to advance the MMC functionalities by effectively adjusting switching variations of the sub-module (SM). The proposed power dissipation model does not fully calculate the average power dissipation for numerous switching devices in an arm module. Instead, it estimates the power dissipation of every switching element based on the inherent operational principle of SM in MMC. In other words, the power dissipation is computed in every single switching event by using the polynomial curve fitting model with minimum computational efforts and high accuracy, which are required to manage the large number of SMs. After estimating the value of power dissipation, the thermal condition of every switching element is considered in the case of external disturbance. Then, the arm modeling for high-level MMC and its control scheme is implemented with the electromagnetic transient simulation program. Finally, the case study for applying to the MMC based HVDC system is carried out to select the appropriate insulated-gate bipolar transistor (IGBT) module in a steady-state, as well as to estimate the proper thermal condition of every switching element in a transient state.