• 제어로봇시스템학회:학술대회논문집
• /
• 2001.10a
• /
• pp.97.4-97
• /
• 2001

Recently, TFT LCD (thin film transistor liquid crystal display) manufacturing industry is more concerned with the ways of cleaning large TFT LCD´s with high pixed density than ever Ultrasonic cleaners with high frequencies like 1MHz (megasonic cleaners) are effective in removing very small particles without causing mechanical damage to the surface. In this study a megasonic cleaner for TFT LCD manufacturing process is developed and the performance is evaluated through experiments. The experimental results show that the developed magasonic cleaners is effective in removing very small particle from the LCD panel.

• Journal of the Semiconductor & Display Technology
• /
• v.22 no.1
• /
• pp.124-128
• /
• 2023

Semiconductor engineers have long sought to enhance the energy efficiency of mobile semiconductors by reducing their voltage. During the final stages of the semiconductor manufacturing process, the screening and evaluation of voltage is crucial. However, determining the optimal test start voltage presents a significant challenge as it can increase testing time. In the semiconductor manufacturing process, a wealth of test element group information is collected. If this information can be controlled to predict the test voltage, it could lead to a reduction in testing time and increase the probability of identifying the optimal voltage. To achieve this, this paper is exploring machine learning techniques, such as linear regression and ensemble models, that can leverage large amounts of information for voltage prediction. The outcomes of these machine learning methods not only demonstrate high consistency but can also be used for feature engineering to enhance accuracy in future processes.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.529-529
• /
• 2006

Several laboratories worldwide have demonstrated the feasibility of producing amorphous silicon thin film transistor (TFT) arrays at temperatures that are sufficiently low to be compatible with flexible foils such as stainless steel or high temperature polyester. These arrays can be used to fabricate flexible high information content display prototypes using a variety of different display technologies. However, several questions must be addressed before this technology can be used for the economic commercial production of displays. These include process optimization and scale-up to address intrinsic electrical instabilities exhibited by these kinds of transistor device, and the development of appropriate techniques for the handling of flexible substrate materials with large coefficients of thermal expansion. The Flexible Display Center at Arizona State University was established in 2004 as a collaboration among industry, a number of Universities, and US Government research laboratories to focus on these issues. The goal of the FDC is to investigate the manufacturing of flexible TFT technology in order to accelerate the commercialization of flexible displays. This presentation will give a brief outline of the FDC's organization and capabilities, and review the status of efforts to fabricate amorphous silicon TFT arrays on flexible foils using a low temperature process. Together with industrial partners, these arrays are being integrated with cholesteric liquid crystal panels, electrophoretic inks, or organic electroluminescent devices to make flexible display prototypes. In addition to an overview of device stability issues, the presentation will include a discussion of challenges peculiar to the use of flexible substrates. A technique has been developed for temporarily bonding flexible substrates to rigid carrier plates so that they may be processed using conventional flat panel display manufacturing equipment. In addition, custom photolithographic equipment has been developed which permits the dynamic compensation of substrate distortions which accumulate at various process steps.

• Journal of the Korean Society for Precision Engineering
• /
• v.27 no.7
• /
• pp.28-35
• /
• 2010

In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.17 no.2
• /
• pp.77-82
• /
• 2008

Rubbing-roller is used for manufacturing liquid crystal display, and static displacement of the rubbing-roller becomes bigger as length of the rubbing roller made of aluminum is getting longer. Therefore, material of the rubbing-roller is changed from aluminum to CFRP(Carbon Fiber Reinforced plastic). Recently thermal spraying is applied to manufacturing process of long rubbing-roller. The thermal spraying has disadvantages such as increment of manufacturing time and fraction defective caused by density of stainless steel particle. In this study, fitting process by drawing was suggested and FEM analysis with Tsai-Wu failure theory and fitting experiments are carried out to find adequate shrink allowance. The suggested shrink allowance gives proper adhesive force, and CFRP failure is not occurred. Furthermore, the fitting process is applied to long rubbing-roller and availability of the fitting process is studied by measurement of roundness, straightness and shear strength.

• Journal of Information Display
• /
• v.3 no.1
• /
• pp.27-34
• /
• 2002

POS446M and POS430Ti alloys were investigated for application to a Flatron rail instead of conventional 28 wt%Cr alloy in order to reduce material costs. It was found that the permeability decrement of materials could be successfully minimized by proper heat treatment, and that the beam landing drift of the Flatron was not overly affected by the permeability of materials. In addition, the Flatron manufacturing process using POS430Ti was also stabilized without glass cracking by the application of the modified process conditions, which were optimized through the design of the experiment method.

• Journal of the Semiconductor & Display Technology
• /
• v.7 no.2
• /
• pp.39-43
• /
• 2008

Productivity is one of the performance indices of the semiconductor equipment in manufacturing viewpoint. Among many ways tried and adopted for improvement of the productivity of the FAB equipment, variation of equipment configuration was considered and its effect on the throughput was analyzed. Parallel machine cycle charts that were generated based on the equipment log were used in the analysis. Efficiency of the equipment due to change of the structure and the probability of the usage in the manufacturing process were examined. The results showed that the modification of the control algorithm in the equipment and the redistribution of the process time for each process and transfer module along to the change in the structure enhance the throughput of the equipment.

• Journal of the Semiconductor & Display Technology
• /
• v.16 no.3
• /
• pp.20-24
• /
• 2017

For process improvement and cutting down on expenses in solar cell industry, it is necessary to improve recycling process of wafer manufacturing. In this research, a study is introduced to develop classifier which is for recycling of abrasive. First of all, recycling process of wafer manufacturing is analyzed. And then, 3 steps of experiments such as oil removal, impurities removal and classification were executed. For the classification of slurry, a classifier is designed and manufactured. From experiments, it is verified that ultra sound vibration and flux are very important factors for classification. By experiencing the recycling processes and making devices, the technique can be initiated industry if needed such as decreasing waste and cutting down on expenses.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2000.01a
• /
• pp.5-6
• /
• 2000

Fringe-field switching (FFS) technology exhibiting a high image quality has been developed. In this paper, one pixel concept, manufacturing process, materials, and electro-optic characteristics of FFS mode comparing with conventional in-plane switching mode, and its possible application to reflective type will be discussed.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2005.07b
• /
• pp.1225-1228
• /
• 2005

Barrier ribs in the plasma display panel(PDP) function to maintain the discharge space between the glass plates as well as to prevent optical crosstalk. Patterning of barrier ribs is one of unique processes for making PDP. In this work photosensitive barrier rib pastes were prepared by incorporating binder polymer, solvent, functional monomers photoinitiator, and barrier rib powder of which surface was treated with fumed silica particles. Study on the function of materials for the barrier rib paste were undertaken. After optimization of paste formulation and photolithographic process, it was found that photolithographic patterning of barrier ribs with photosensitive barrier rib green sheet could be used in the fabrication of high resolution PDP.