• Journal of Welding and Joining
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• 제32권4호
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• pp.10-14
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• 2014

Laser aided Direct Metal Tooling(DMT) process is a kind of Additive Manufacturing processes (or 3D-Printing processes), which is developed for using various commercial steel powders such as P20, P21, SUS420, H13, D2 and other non-ferrous metal powders, aluminum alloys, titanium alloys, copper alloys and so on. The DMT process is a versatile process which can be applied to various fields like the mold industry, the medical industry, and the defense industry. Among of them, the application of DMT process to the mold industry is one of the most attractive and practical applications since the conformal cooling channel core of injection molds can be fabricated at the slightly expensive cost by using the hybrid fabrication method of DMT technology compared to the part fabricated with the machining technology. The main objectives of this study are to provide various characteristics of the parts made by DMT process compared to the same parts machined from bulk materials and prove the performance of the injection mold equipped with the conformal cooling channel core which is fabricated by the hybrid method of DMT process.

• 전기화학회지
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• 제11권1호
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• pp.16-21
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• 2008

직접메탄올 연료전지 (DMFC)의 핵심 구성 요소 중에서 하나는 고분자 전해질막과 촉매층 (연료극과 공기극)으로 구성된 전해질/전극 접합체 (MEA)이다. 그중에서 촉매층은 브러싱법, 전시법, 스프레이 코팅법, 스크린 프린팅법과 같은 다양한 방법을 사용하여 carbon paper나 carbon cloth등과 같은 전극 지지체 위에 코팅한다. 그러나 이러한 촉매 코팅방법들은 전극 지지체 위에 촉매를 균일한 두께로 코팅하기 어렵고, 촉매의 손실이 많으며, 또한 코팅 시간이 많이 필요하다는 단점들이 있다. 본 연구에서는 DMFC용 MEA의 전극층을 바코팅 방법 (bar-coating method)을 사용하여 한 번에 원하는 양의 촉매가 코팅되도록 제조하였다. 이렇게 제조한 전극 촉매층 표면과 단면의 형태를 SEM을 사용하여 관찰하였다. 제조한 MEA의 성능과 저항은 단위전지와 임피던스 분석기를 사용하여 측정하였다.

• 한국기계가공학회지
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• 제13권2호
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• pp.21-27
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• 2014

Recently, various biochip environments have been presented. In this study, a novel transparent film with porous membrane windows, which is an essential component in a co-cultured biochip environment, is fabricated using spin-coating, 3D printing, and electrospinning processes. In detail, a transparent polystyrene film was fabricated by means of the spin-coating process followed bywindow cutting, after which apolycaprolactone-chloroform solution was deposited along the window edge to introduce an adhesion layer between the PS film and the PCL nanofibers. Nanofibers were electrospun into the window region using a direct-write electrospinning method. Consequently, it was demonstrated that the fabricated window film could be used in a co-culture biochip environment.

• The Journal of Advanced Prosthodontics
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• 제12권4호
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• pp.218-224
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• 2020

PURPOSE. The objectives of this study were to evaluate the fracture strength and fracture patterns of provisional crowns fabricated from different materials and techniques after receiving stress from a simulated oral condition. MATERIALS AND METHODS. A monomethacrylate-based resin (Unifast Trad) and a bis-acryl-based (Protemp 4) resin were used to fabricate provisional crowns using conventional direct technique. A milled monomethacrylate resin (Brylic Solid) and a 3D-printed bis-acrylate resin (Freeprint Temp) were chosen to fabricate provisional crowns using the CAD/CAM process. All cemented provisional crowns (n=10/group) were subjected to thermal cycling (5,000 cycles at 5°-55℃) and cyclic occlusal load (100 N at 4 Hz for 100,000 cycles). Maximum force at fracture was tested using a universal testing machine. RESULTS. Maximum force at fracture (mean ± SD, N) of each group was 657.87 ± 82.84 for Unifast Trad, 1125.94 ± 168.07 for Protemp4, 953.60 ± 58.88 for Brylic Solid, and 1004.19 ± 122.18 for Freeprint Temp. One-way ANOVA with Tamhane post hoc test showed that the fracture strength of Unifast Trad was statistically significantly lower than others (P<.01). No statistically significant difference was noted among other groups. For failure pattern analysis, Unifast Trad and Brylic Solid showed less damage than Protemp 4 and Freeprint Temp groups. CONCLUSION. Provisional crowns fabricated using the CAD/CAM process and the conventionally fabricated bis-acryl resins exhibited significant higher fracture strength compared to conventionally fabricated monomethacrylate resins after the aging regimen. Therefore, CAD/CAM milling and 3D printing of provisional restorations may be good alternatives for long term provisionalization.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.176-176
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• 2007

Flat-panel direct conversion detectors used in compound substance of semiconductor are being studied for digital x-ray imaging. Recently, such detectors are deposited by physical vapor deposition(PVD) generally. But, most of materials (HgI2, PbI2, TlBr, PbO) deposited by PVD have shown difficult fabrication and instability for large area x-ray imaging. Consequently, in this paper, we propose applicable potentialities for screen printing method that is coated on a substrate easily. It is compared to electrical properties among semiconductors such as $HgI_2$, $PbI_2$, PbO, HgBrI, InI, and $TlPbI_3$ under investigation for direct conversion detectors. Each film detector consists of an ~25 to $35\;{\mu}m$ thick layer of semiconductor and was coated onto the substrate. Substrates of $2cm{\times}2cm$ have been used to evaluate performance of semiconductor radiation detectors. Dark current, sensitivity and physics properties were measured. Leakage current of $HgI_2$ as low as $9pA/mm^2$ at the operation bias voltage of ${\sim}1V/{\mu}m$ was observed. Such a value is not better than PVD process, but it is easy to be fabricated in high quality for large area x-ray Imaging. Our future efforts will concentrate on optimization of growth of film thickness that is coated onto a-Si TFT array.

• 보존과학회지
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• 제34권6호
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• pp.471-479
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• 2018

선운사 대웅전의 훼손된 단청문화재를 대상으로 3차원(3D) 스캐닝을 활용한 간접전사방식을 통해 단청 문양에 직접 손을 대지 않고 1:1 비율로 모사도를 제작하였다. 기존 단청문양의 모사방법은 트레싱지를 단청 위에 대고 핀을 고정한 이후에 네임펜을 사용해서 아웃라인을 그리고 아웃라인을 사용해서 전체적인 비율로 모사도를 제작하고 있다. 때문에 대상 단청에 직접전사하는 수작업 방식으로 대상물의 손상 우려와 조사자 개인의 치수 오차가 항상 내재되어 있다. 본 연구는 기존의 단청문화재 모사도 제작 과정 방식에서 오는 여러 가지 문제점의 대안으로 3D 스캐닝을 통한 간접전사방식을 제안하여 형상의 왜곡이나 치수 오차의 발생을 감소시키고 훼손을 방지할 수 있었다. 연구 결과 비교적 객관적이고 정밀한 실제 비율의 모사도를 제작하였고 제작 과정에 관한 관련 데이터를 구축할 수 있었다. 또한 모사도 및 복원도의 제작뿐만 아니라 3D 원본데이터, 가공 3D 데이터, 부재도면 등의 다양한 자료들을 폭넓게 이용 가능하며 3D 컨텐츠 제작으로 새로운 가상 박물관의 운용 또한 가능할 것으로 생각된다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.913-918
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• 2005

It is expected that the inkjet technology offers prospect for reliable and low cost manufacturing of FPD (Flat Panel Display). This inkjet technology also offers a more simplified manufacturing process for various part of the FPD than conventional process. For example, recently the novel manufacturing processes of color filter (C/F) in LCD, or RGB patterning in OLED by inkjet printing method have been developed. This elaborates will be considered as the precious point of manufacturing process for the mass production of enlarged-display panel with a low price. On this point of view, we would like to review the status of inkjet technology in FPD, with some results on forming micro line by inkjet patterning of suspension type silver nano ink as below. We have studied the inkjet patterning of synthesized aqueous silver nano-sol on interface-controlled ITO glass substrate. Furthermore, we designed the conductive ink for direct inkjet patterning on bare ITO glass substrate. The first, the highly concentrated polymeric dispersant-assisted silver nano sol was prepared. The high concentration of batch-synthesized silver nano sol was possible to 40 wt%. At the same time the particle size of silver nanoparticles was below $10{\sim}20nm$. The second, the synthesized silver nano sol was inkjet - patterned on ITO glass substrate. The connectivity and width of fine line depended largely on the wettability of silver nano sol on ITO glass substrate, which was controlled by surfactant. The relationship was understood by wetting angle. The line of silver electrode as fine as $50{\sim}100\;{\mu}m$ was successfully formed on ITO glass substrate. The last, the direct inkjet-patternable silver nano sol on bare ITO glass substrate was designed also.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.374-374
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• 2014

의료용 X-ray는 과거 analog 방식과, 연구가 진행 중이며 현재 많이 사용되고 있는 digital 방식으로 나누어진다. 최근, 광도전체와 형광체 기반의 flat panel X-ray detector의 발전에 따른 상용화가 이루어지고 있으며, 많은 발전 가능성이 제기되고 있다. flat panel X-ray detector 검출방식은 direct method (직접 방식)와 indirect method (간접 방식)로 나누어진다. 본 연구는 일반적으로 상용화 되어있는 amorphous seleinum (비정질 셀레늄)의 큰 일함수에 의한 저 해상력이라는 단점을 보완하기 위해, 작은 일함수를 가지는 물질을 사용하여, 영상을 얻을 시에 높은 해상력으로 표현할 수 있도록 하고, 원자번호가 높은 물질을 사용하여 X-ray 흡수율을 높일 수 있도록 기존 direct method에 많이 사용되고 있는 amorphous seleinum 기반 digital X-ray detector가 아닌, 이러한 장점을 충족시킬 수 있는 PbI2 물질 층을 사용하여 시편을 제작 하였다. PbI2를 같은 두께로 올린 후, 물질 층 상부에 Au 전극 면적을 다른 size로 제작한 시편으로 X-ray에 노출 시켰다. 이는 상부 전극 size 차이에 따른 신호 차이를 측정하여 전기적 특성을 평가하기 위한 것이다. 전도성을 띠고 있는 ITO (Indium - Tin - Oxide) glass를 이용하여 screen printing 방법으로 제작하였다. PbI2층을 약 160~180 um두께, $3cm{\times}3cm$ size로 5개 제작하였으며, 상부 전극으로는 Au를 진공 증착 시켰다. 상부 전극 size는 각각 시편 5개에 $0.5cm{\times}0.5cm$, $1cm{\times}1cm$, $1.5cm{\times}1.5cm$, $2cm{\times}2cm$, $2.5cm{\times}2.5cm$로 PbI2 물질 층 중앙에 증착 시켰다. 이러한 설정으로 X-ray 노출 시 관찰할 수 있는 PbI2의 전기적인 특성을 평가할 수 있었다. 관전압을 40 kVp, 60 kVp, 80 kVp, 100 kVp, 120 kVp, 140 kVp로 설정하고, 관전류는 100 mA로 설정하였으며, Dark current, Sensitivity를 측정하였다. Dark current와 Sensitivity를 측정한 뒤, 그 값을 이용하여 SNR (신호 대 잡음 비)값을 구해보았다.실험 결과 단위면적당 signal과 SNR을 분석할 수 있었다. 80 kVp로 기준을 잡고 결과 값을 보면 $0.5cm{\times}0.5cm$ 시편에서 2.92 nC/cm2, $2.5cm{\times}2.5cm$ 시편에서 0.84 nC/cm2로 상부 전극 크기가 작을수록 더 좋은 신호를 측정할 수 있었다. 똑같은 기준에서 SNR을 계산 해 보았을 때, $0.5cm{\times}0.5cm$ 시편에서 6.46, $2.5cm{\times}2.5cm$ 시편에서 1.91로 SNR역시 상부 전극 크기가 작을수록 더 큰 값을 확인할 수 있었다. 이러한 결과는 edge-effect의 영향으로 인해 나온 결과라고 할 수 있다. 이러한 실험 결과, detector 제작 시, 같은 물질을 사용하여 더 높은 효율을 내기 위해서는 큰 size의 상부 전극 보다는 작은 size의 상부 전극을 증착 시키는 것이 전기적 특성을 더욱 효율적으로 평가할 수 있을 것이라고 사료된다.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2009년도 추계학술대회 논문집
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• pp.421-426
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• 2009

This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• 한국소음진동공학회논문집
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• 제19권12호
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• pp.1322-1328
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• 2009

This paper presents vibration analysis of maskless exposure module in printed circuit board(PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the finite element analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.