• Applied Chemistry for Engineering
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• v.7 no.2
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• pp.387-392
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• 1996

Natural zeolite/epoxy resin composites were prepared and the cure kinetics was studied by dynamic DSC analysis. With the increments of natural zeolite content, the reaction starting temperature and the exothermic peak temperature were decreased. When diglycidyl ether of bisphenol A(DGEBA)/4,4'-methylene dianiline(MDA)/malononitrile(MN, 10phr) was filled with 20phr of zeolite, DSC thermogram had one peak and when it was filled with 30phr of zeolite, a shoulder appeared on the DSC thermogram. With the filling of 40phr of zeolite, DSC thermogram was separated into two peaks and the activation energy of the first peak, $Ea_1$ was 12.30 kJ/mol and that of the second peak, $Ea_2$ was 12.70 kJ/mol.

• Polymer(Korea)
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• v.25 no.5
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• pp.691-698
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• 2001

Nanocomposites based on epoxy acid nanoclay were prepared employing organically modified mica type silicate (OMTS), diglycidyl ether of bisphenol A (DGEBA) type epoxy. curing agent (dicyandiamide; DICY), and catalyst (benzyl dimethyl amine; BDMA). Both melt mixing and solution mixing were und for the sample preparation and structural developments with curing reaction were analyzed using X-ray diffractometer (XRD) and small angle X-ray scattering (SAXS). Because of the different curing rate between extra-gallery and intra-gallery reactions of epoxy mixtures, only intercalated structure was observed for the sample prepared by melt mixing while fully exfoliated structure was observed for the sample prepared by solution mixing. Mechanical properties of exfoliated epoxy nanocomposite were investigated using a dynamic mechanical analyzer (DMA). The dynamic storage modulus of the nanocomposite in both glass and rubbery plateau regions were increased with increasing OMTS contents, but glass transition temperatures ($T_g$) remained unchanged. Thermal properties of epoxy nanocomposite were investigated using thermogravimetric (TGA) and limit oxygen index (LOI) methods. Thermal decomposition onset points and LOI values were increased with increasing OMTS contents due to barrier effects of OMTS sheets.

• Polymer(Korea)
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• v.37 no.2
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• pp.240-248
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• 2013

The curing behaviors of diglycidyl ether of bisphenol A (DGEBA) with mercaptan hardener were studied by the comparison with amine-adduct type hardener. Curing behaviors were evaluated by DSC at dynamic and isothermal conditions. In the DSC, the dynamic experiments were based on the method of Kissinger's equation, and the isothermal experiments were fitted to the Kamal's kinetic model. Activation energy of epoxy/amine-adduct type hardener was ca. 40 kcal/mol. As the functional group of mercaptan hardener, -SH increased, on epoxy/mercaptan hardeners, the activation energies decreased from 28 to 19 kcal/mol. Epoxy/amine-adduct type hardener was initiated at $90^{\circ}C$ or higher. However, epoxy/mercaptan hardeners reduced the initiation temperatures below $80^{\circ}C$ and shortened the durations of curing reaction within 10 min. We found out that the reaction kinetics of epoxy with mercaptan hardener followed the autocatalytic reaction models, and the maximum reaction rates were shown at the conversions of 20~40%.

• Applied Chemistry for Engineering
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• v.25 no.4
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• pp.352-356
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• 2014

PDMS modified epoxy resin with epoxy group (EMPDMS) was prepared from the reaction of ${\alpha},{\omega}$-aminopropylpolydimethylsiloxane and diglycidyl ether of bisphenol-A (DGEBA) based epoxy resin, and PDMS modified epoxy hybrid compound (EMPDMSH) was prepared by introducing alkylesteraminopropyl alkoxy silane to EMPDMS. Their structures were characterized using FT-IR, $^1H$-NMR and $^{29}Si$-NMR. Coating materials were prepared by mixing EMPDMSH base and solvent. Physical properties of the coating materials coated on epoxy/glass fiber composite film were measured according to the content of PDMS in EMPDMSH. Contact angle of coating film was increased 30 to 71 degree. Adhesive property of coating film was 5B degree better then epoxy or acrylate coating materials, and surface roughness was decreased as increasing in EMPDMSH.

• Korean Journal of Materials Research
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• v.3 no.1
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• pp.95-100
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• 1993

Abstract Fourier transform infrared (FT -IR) instrument was used to st.udy the thermoset behavior of DGEBA/MDA system with succinonit.rile. That was experimented with the samples which were cured from 8$0^{\circ}C$ to 17$0^{\circ}C$ every 3$0^{\circ}C$ for 1 hour and uncured with different SN content. respect.ively. It was known that prImary amine hydrogen reacted wit.h epoxide group, secondary amine hydrogen with epoxide group and hydroxyl with epoxide group. In addition. the reaction of primary amine hydrogen with nitrile gorup of SN and of hydroxyl group with nitrile group of SN came about. These t.wo reactions made chain bond length longer between main chains.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1222-1223
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• 2008

Nanocomposites of a epoxy resin are synthesized and evaluated. the present study investigated the effect of nanoclay additives on the properties of diglycidyl ether or bisphenol A(DGEBA) epoxy resin. DGEBA was mixed with 3$\sim$7 wt% organically modified layered silicate, Cloisite 30B for three hours. The average grain size of the specimens decreased with adding Cloisite 30B. The dielectric constant showed between 3.2$\sim$3.5 and the dielectric loss showed between 3.2$\sim$5.7 % in all specimens. Dielectric strength showed a best valu of 20.8 kV/mm at added with Cloisite 30B 5 wt%.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.257-258
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• 2009

Nanocomposites of a epoxy resin are synthesized and evaluated the present study investigated. The effect of nanoclay additives on the properties of diglycidyl ether or bisphenol A(DGEBA) epoxy resin. DGEBA was mixed with 3~7 wt% organically modified layered silicate, Cloisite 30B for three hours. The average grain size of the specimens decreased with adding Cloisite 30B. The dielectric constant showed between 3.2 ~ 3.5 and the dielectric loss showed between 3.2 ~ 5.7 % in all specimens.

• Transactions on Electrical and Electronic Materials
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• v.13 no.4
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• pp.204-207
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• 2012

Epoxy nanocomposite was synthesized through the exfoliation of organoclay in an epoxy matrix, which was composed of diglycidyl ether of bisphenol A (DGEBA), 4,4'-methylene dianiline (MDA) and malononitrile (MN). Organoclay was prepared by treating the montmorillonite with octadecyl trimethyl ammonium bromide (ODTMA). The exfoliation of the organoclay was estimated by wide angle X-ray diffraction (WAXD) analysis. In order to measure the cure rate of DGEBA/MDA (30 phr)/MN (5 phr)/organoclay (3 phr), differential scanning calorimetry (DSC) analysis was performed at various heating rates, and the data were interpreted by Kissinger equation. Thermal degradation kinetics of the epoxy nanocomposite were studied by thermogravimetric analysis (TGA), and the data were introduced to the Ozawa equation. The activation energy for cure reaction was 45.8 kJ/mol, and the activation energy for thermal degradation was 143 kJ/mol.

• Applied Chemistry for Engineering
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• v.5 no.4
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• pp.737-742
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• 1994

The fracture energy of glass fiber/carbon fiber/epoxy resin hybrid composite system was investigated in the aspect of fracture mechanism. Epoxy resin matrix was DGEBA-MDA-SN-HQ system. On the interface of glass fiber and matrix, post debone friction energy provided a major contribution to the fracture energy, and debonding energy and pull-out energy were of the similar value. In the case of fracture on the interface of carbon fiber and matrix, pull-out energy was the major contributor.

• Korean Journal of Materials Research
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• v.3 no.3
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• pp.215-222
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• 1993

Malononitrile(MN) as a reactive additive was added to Diglycidyl ether of bisphenol A (DGEBA)/Methylene dianiline (MDA) system in order to modify a thermosetting epoxy resin. Cure ki. netics and cure mechanism of this modified system were investigated by using DSC(differential scanning calorimetry) and FT-IR(fourier transform infrared spectrometry). Cure kinetics gave an information that the DGEBA/MDA system modified with MN should cure at over $110^{\circ}C$ after curing at about $80^{\circ}C$ for the complete curing. The activation energy of the first cure was nearly constant and that of the second cure was increased as the MN content was increased. Cure mechanism for the system was investigated with the samples cured every $30^{\circ}C$, from $80^{\circ}C$ to $170^{\circ}C$, for Ihr. It was known that the cure reactions of the epoxy-diamine system were composed of PA -E, SA - E and E-OH reactions. Beside these three reactions, in the DGEBA/MDA/MN system PA-CN and CN-OH reaction was found.