• Proceedings of the KWS Conference
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• 2002.10a
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• pp.487-492
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• 2002

The growth kinetics of intermetallic compound layers formed between eutectic Sn-58Bi solder and (Cu, electroless Ni-P/Cu) substrate were investigated at temperature between 70 and 120 C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energies of Cu$_{6}$Sn$_{5}$ and Ni$_3$Sn$_4$ intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P were 127.9 and 81.6 kJ/mol, respectively.ely.

• Progress in Superconductivity and Cryogenics
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• v.7 no.4
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• pp.1-3
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• 2005

Superconducting $MgB_2$ fibers are in-situ grown by a diffusion method. The fibers are prepared by exposing B filaments to Mg vapor inside a folded Ta foil over a wide range of temperature and growth time. The materials are sealed inside a quartz tube by gas welding. The as - grown fibers are characterized by scanning electron microscopy and energy dispersive x - ray analysis. The fibers have a diameter of about $110{\mu}m$. Surface morphology of the fibers looks dependent on growth temperature and mixing ratio of Mg and B. Radial distribution of Mg ions into B is observed and analyzed over the cross - sectional area. Transport properties of the $MgB_2$ fibers are examined by a physical property measurement system. The $MgB_2$ fibers grown at $900^{\circ}C$ for 2 hours show a superconducting transition at 39.8K with ${\Delta}T_c<$ 2.0 K. Resistance at room temperature $MgB_2$ is 3.745 $\Omega$ and residual resistivity ratio (RRR) is estimated as 4.723.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.262-264
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• 2005

$Bi_{2}Sr_{2}CaCu_{2}O_{x}$(Bi-2212) and $Bi_{2}Sr_{2}Ca_{2}Cu_{3}O_{y}$(Bi-2223) high-$T_{c}$ superconductor(HTS) coating have been prepared by plasma spraying and heaat treatment. The Bi-2212 HTS coating later is synthesized through the peritectic reaction between Sr-Ca-Cu oxide coating layer and Bi-Cu oxide coating later, and $Bi_{2}Sr_{2}CaCu_{2}O_{y}$(Bi-2212) superconducting phase grow by partial melting process. The superconducting characteristic depends strongly on the conditions of the partial melting process. the Bi-2212 HTS layer consists of the whiskers grown in the diffusion direction. Above the 2212 layer, Bi-2223 phase and secondary phase was observed. The secondary phase is distributed uniformly over the whole surface. This is caused to the microcrack on the coatings surface. Despite everything, the film shows superconducting with an onset $T_{c}$ of about 115K. There are two changes steps. One changes (1step) at 115K is due to the diamagnetism of the Bi-2223 phase and the other changes (2step) at 78K is due to the diamagnetism of the Bi-2212 phase.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.25-27
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• 2005

Sn-9Zn solder balls were bonded to Cu and ENIG (Electroless Nickel/Immersion Gold) pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Sn-9Zn/ENIG, the shear strength remained nearly constant in spite of aging for 1000 hours at $150^{\circ}C$. On the other hand, in the case of the Sn-9Zn/Cu, the shear strength significantly decreased after aging at $150^{\circ}C$ for 100hours and then remained constant by further prolonged aging. Therefore, the protective plating layer such as ENIG must be used to ensure the mechanical reliability of the Sn-9Zn/Cu joint.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.10
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• pp.1367-1375
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• 2010

In this study, optimization of the process parameters of the resistance spot welding of a sheet of aluminum-coated boron alloyed steel, 22MnB5, used in hot stamping has been performed by a Taguchi method to increase the strength of the weld joint. The process parameters selected were current, electrode force, and weld time. The heating temperature and heating time of 22MnB5 are considered to be noise factors. It was known that the variation in the thickness of the intermetallic compound layer between the aluminum-coated layer and the substrate, which influences on the formation of nugget, was generated due to the difference of diffusion reaction according to heating conditions. From the results of spot weld experiment, the optimum weld condition was determined to be when the current, electrode force, and weld time were 8kA, 4kN, and 18 cycles, respectively. The result of a test performed to verify the optimized weld condition showed that the tensile strength of the weld joint was over 32kN, which is considerably higher than the required strength, i.e., 23kN.

• Proceedings of the KWS Conference
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• 1996.05a
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• pp.186-189
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• 1996

A study was made to examine the characteristics of base metal and stress relief cracking(SRC) of heat affected zone(HAZ) for HY-100 and Cu-bearing HSLA-100 steels. The Gleeble thermal/mechanical simulator was used to simulate the SRC/HAZ. The details of mechanical properties of base plate and SRC tested specimens were studied. The specimens were aged at $650^{\circ}C$ for HSLA-100 steel and at 66$0^{\circ}C$ for HY-100 steel and thermal cycled from 135$0^{\circ}C$ In $25^{\circ}C$ with a cooling time of $\Delta$ $t_{800^{\circ}50}$ $0^{\circ}C$/=21sec. corresponds to the heat input of 30kJ/cm. The thermal cycled specimens were stressed to a predetermined level of 248~600MPa and then reheated to the stress relief temperatures of 570~62$0^{\circ}C$. The time to failure( $t_{f}$) at a given stress level was used as a measure of SRC susceptibility. The strength, elongation and impact toughness of base plate were greater in HSLA-100 steel than in HY-100 steel. The time to failure was decreased with increasing temperature and/or stress. HSLA-100 steel was more susceptible to stress relief cracking than HY-100 steel under same conditions. It is thought to be resulted from the precipitation of $\varepsilon$-Cu phase by dynamic self diffusion of solute atoms. Therefore, greater strain concentration at grain boundary of HSLA-100 steel results in the increased SRC susceptibility.y.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.86-86
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• 2018

볼트, 너트 등의 파스너는 건축 재료나 기계부품을 고정하는 데 사용하는 기계요소로, 건축, 철도, 조선 등 전 산업분야에 걸쳐 사용되고 있다. 그 중 스테인리스 소재의 볼트, 너트는 뛰어난 내식성과 저렴한 가격으로 널리 사용되고 있는데, 소재의 특성 및 작업현장의 상황, 온도의 변화 등의 원인에 의해 고착현상(galling)이 발생한다. 고착현상이란 성분 혹은 표면경도가 비슷한 금속의 나사산을 조이는 과정에서 발생하는 압력의 증가 및 마찰력에 의해 냉간 용접(cold welding)이 일어나는 것으로 나사산의 표면이 눌어붙게 된다. 이러한 고착현상은 스테인리스 소재에서 많이 발생하는데, 한번 발생한 후에는 비파괴 해소가 불가능한 상태가 되어 경제적 손실을 야기한다. 이러한 고착현상의 해소를 위해 본 연구에서는 주석과 알루미늄을 사용한 새로운 열 확산 코팅 기술을 개발하고 이를 304 스테인리스강에 적용하여 열처리 온도에 따른 특성변화를 확인하였다. 열 확산 코팅을 위해 팩 세멘테이션 방법을 이용하여 아르곤 분위기 하에서 열처리 하였고, 온도는 $200{\sim}250^{\circ}C$에서 코팅을 수행하였다. 이에 따른 코팅 전과 후의 표면 및 단면 분석을 통해 성공적으로 코팅층이 형성됨을 확인하였고, 온도가 증가함에 따라 코팅성분의 양이 증가하는 현상을 보임을 알 수 있었다. 또한, 고착방지성능을 확인하기 위하여 ASTM G196-08 시험을 통해 코팅조건에 따른 고착현상을 분석하였으며, 그 결과 기존에 코팅되지 않은 304 스테인리스강보다 고착현상이 개선됨을 확인하였다. 따라서 304 스테인리스강 소재의 볼트, 너트 제품에 주석-알루미늄 코팅층을 적용시키면 기존의 고착현상을 개선하고 서비스 품질을 향상시킬 수 있을 것으로 판단된다.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.450-455
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• 2002

Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of $\beta$-Sn, Ag$_3$Sn, ad Cu$_{6}$Sn$_{5}$ phases was confirmed in the solder, and the η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer was found to form at the interface between the solder and the Cu pad. By conducting shear tests, it was found that the BGA joint using Cu-cored solder ball could prevent the degradation of joint strength during aging at 423K because of the slower growth me of η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer formed at the solder, pad interface. Furthermore, Cu-cored multi-component Sn-Ag-Bi balls were fabricated by sequentially coating the binary Sn-Ag and Sn-Bi solders on Cu balls. The reflow property of these solder balls was investigated. Melting of these solder balls was clarified to start at the almost same temperature as that of Sn-2Ag-0.75Cu-3Bi solder. A microstructure composing of (Sn), Ag$_3$Sn, Bi and Cu$_{6}$Sn$_{5}$ phases was found to form in the solder ball, and a reaction layer containing primarily η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ was found at the interface with Ni/Au coated Cu pad after reflow soldering. By conducting shear test, it was found that the BGA joints using this Cu-core solder balls hardly degraded their joint shear strength during aging at 423K due to the slower growth rate of the η'-(Au, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer at the solder/pad interface.he solder/pad interface.