• Title/Summary/Keyword: Differential scanning calorimetry (DSC)

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Electrical and mechanical properties of elastomer epoxy by addition of liquid elastomer (엘라스토머 첨가량에 의한 탄성에폭시의 기계 및 전기적 특성)

  • Kim, Eung-Kwon;Yoon, Byeong-Don;Kang, Chun-Gi;Park, Dae-Hee;Song, Joon-Tae;Lee, Kwan-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.259-260
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    • 2008
  • In this paper, we fabricated elastomer epoxy specimens by added liquid elastomer to improve the mechanical and electrical properties instead of previous high-voltage epoxy materials. As increased additive contents, glass transient temperature (Tg) was continually decreased in DSC (differential scanning calorimetry). Among specimens, 15 phr sample showed the mechanical and electrical properties similar of high-voltage epoxy in modulus, break-down and arc test. From the optimized condition of elastic epoxy, we confirmed a chance of application for high-voltage materials and power electrical instruments.

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Resist characteristics and molecular structure control of polystyrene by plasma polymerization method (플라즈마중합법에 의한 폴리스티렌의 분자구조 제에 및 레지스트 특성 조사)

  • 박종관;김영봉;김보열;임응춘;이덕출
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.45 no.3
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    • pp.438-443
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    • 1996
  • The effect of plasma polymerization conditions on the structure of the plasma polymerized styrene were investigated by using Fourier Transform Infrared Ray(FT-IR), Differential Scanning Calorimetry (DSC), Gel Permeation Chromatography(GPC). Plasma polymerized thin film was prepared using an interelectrode inductively coupled gas-flow-type reactor. We show that polymerization parameters of thin film affect sensitivity and etching resistance of plasma polymerized styrene is 1.41~3.93, and deposition rate of that are 32~383[.angs./min] with discharge power. Swelling and etching resistance becomes more improved with increasing discharge power during plasma polymerization. (author). 11 refs., 10 figs., 1 tab.

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Miscibility in Binary Blends of Poly(vinyl phenol) and Poly(n-alkylene 2,6-naphthalates)

  • Lee, Joon-Youl;Han, Ji-Young
    • Macromolecular Research
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    • v.12 no.1
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    • pp.94-99
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    • 2004
  • We have performed Fourier transform infrared (FTIR) spectroscopy and differential scanning calorimetry (DSC) studies on blends of poly(vinyl phenol) (PVPh) with poly(n-alkylene 2,6-naphthalates) containing alkylene units of different lengths. The results indicate that each poly(ethylene 2,6-naphthalate) (PEN) and poly(trimethylene 2,6-naphthalate) (PTN) blend with PVPh is immiscible or partially miscible, but blends of poly(butylene 2,6-naphthalate) (PBN) with PVPh are miscible over the whole range of compositions in the amorphous state. FTIR spectroscopic analysis confirmed that significant degree of intermolecular hydrogen bonding occurs between the PBN ester carbonyl groups and the PVPh hydroxyl groups. The large difference in the degree of mixing in these blend systems is described in terms of the effect that chain mobility has on the accessibility of the ester carbonyl functional groups toward the hydroxyl groups of PVPh, which in turn impacts the miscibility of these blends.

Fatigue Characterization of NiTiCu Shape Memory Alloys (NiTiCu 형상기억합금의 피로특성)

  • Han, Ji-Won;Park, Sung Bum
    • Journal of the Korean Society of Safety
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    • v.29 no.4
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    • pp.28-33
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    • 2014
  • Recently, the actuator worked by the driving recovery-force of the thermo elastic martensitic transformation of shape memory alloys(SMA) has been studied. This paper presents a study on the fatigue life of shape memory alloy (SMA) actuators undergoing thermally induced martensitic phase transformation under various stress levels. shape memory recoverable stress and strain of Ti-44.5at.%Ni-8at.%Cu alloys were by means of constant temperature tensile tests. Differential scanning calorimetry (DSC) was employed in order to investigate the transformation characteristics of the alloy before the tests. the results were summarized as follows. The martensite inducing stress incerased with the increasing of the Cu-contents. The fatigue life decreased with the increasing of the test load and the Cu-content. The data acquired will be very useful during the design process of an SMA NiTiCu element as a functional part of an actuator.

Properties of Gel-like Compounds Containing Flammable Solvents (Gel형 인화성 용제 Compound의 특성)

  • 강영구;김정훈
    • Journal of the Korean Society of Safety
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    • v.18 no.3
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    • pp.94-100
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    • 2003
  • Gel-like compounds containing flammable solvents were prepared to use fur cleaning agents in field of innovative industries and general purposes. And experiments were conducted to improve the defects of liquified flammable solvents from the view point of safety and health hazards. Flammable solvents used in this study were several single component flammable solvents(turpentine oil, N-methyl-2-pyrrolidone(NMP), d-limonene) and multi component flammable solvent(gasoline and ethanol). For gelation of flammable solvents, commercially Known as Aerosil(equation omitted) 200 fumed silica and triethanolamine(TEA) were used as gelation agent dispersant. The analyses on properties of gel-like compounds was studied by gelation and viscosity test pH test, volatility test and differential scanning calorimetry(DSC) measurement. The experimental results indicate that gel-like compounds containing flammable solvents have pH stability, high viscosity, volatile organic compounds(VOC) control by the decrease of volatility and odor component generation, fluidity control etc. From the experimental values, it can be predicted that the safety in the working place is improved by manufacturing flammable solvents into gel-like compounds.

Thermal stabilities and dynamic mechanical properties of dielectric materials for thermal imprint lithography (임프린트 공법적용을 위한 절연재료의 열적, 기계적 성질)

  • Cho, Jae-Choon;Ra, Seung-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.220-221
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    • 2007
  • Recently, imprint lithography have received significant attention due to an alternative technology for photolithography on high performance microelectronic devices. In this work, we investigated thermal stabilities and dynamic mechanical properties of dielectric materials for thermal imprint lithography. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various curing agent and spherical filler were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), rheometer and universal test machine(UTM).

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Assessment of material analysis for TR CNCE-W (수트리억제 충실 전력 케이블(TR CNCE-W)의 재료에 대한 평가 기술)

  • Soh, Jin-Joong;Shim, Dae-Sub;Kim, Ku-Sub
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.221-222
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    • 2007
  • The test method on materials of electrical power cable are used in accordance with 18 specifications of IEC, ICEA, KS and KEPCO Spec. The validation of test methods were checked and established by solving the problems occurred during the test. These tests are tensile strength, hot creep, shrink back, environmental stress cracking, flammability, oxygen index, absorption coefficient, differential scanning calorimetry, amount of ion in semiconductor, void, amber, contaminant and water tree etc. The performance test of power cable made by A, B, C, D company were evaluated and compared.

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Toughnening of Dielectric Material by Thermoplastic Polymer

  • Lee, Jung-Woo;Cho, Jae-Choon;Ra, Seung-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.207-208
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    • 2007
  • Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), and Universal Test Method (INSTRON).

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Studies on Cure Behaviors, Dielectric Characteristics and Mechanical Properties of DGEBA/Poly(ethylene terephthalate) Blends

  • Park, Soo-Jin
    • Macromolecular Research
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    • v.17 no.8
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    • pp.585-590
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    • 2009
  • The cure behaviors, dielectric characteristics and fracture toughness of diglycidylether of bisphenol-A (DGEBA)/poly(ethylene terephthalate) (PET) blend system were investigated. The degree of conversion for the DGEBA/PET blend system was measured using Fourier transform infrared (FTIR) spectroscopy. The cure kinetics were investigated by measuring the cure activation energies ($E_a$) with dynamic differential scanning calorimetry (DSC). The dielectric characteristic was examined by dielectric analysis (DEA). The mechanical properties were investigated by measuring the critical stress intensity factor ($K_{IC}$), critical strain energy release rate ($G_{IC}$), and impact strength test. As a result, DGEBAIPET was successfully blended. The Ea of the blend system was increased with increasing PET content to a maximum at 10 phr PET. The dielectric constant was decreased with increasing PET content. The mechanical properties of the blend system were also superior to those of the neat DGEBA. These results were attributed to the increased cross-linking density of the blend system, resulting from the interaction between the epoxy group of DGEBA and the carboxyl group of PET.

The Effect of Diol Unit on the Thermal Properties of Copolyester (Diol Unit가 Copolyester의 열적 성질에 미치는 효과)

  • Lee, Sun-Hee;Shim, Mi-Ja;Kim, Sang-Wook
    • Applied Chemistry for Engineering
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    • v.3 no.3
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    • pp.464-470
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    • 1992
  • The copolyester was prepared by melt polycondensation varying the amount of ethylene glycol(EG) and pentanediol from terephthalic acid(TPA), EG and pentanediol isomers were. used as the third monomer. The chemical structure and the compositions of the copolyester were determined by nuclear magnetic resonance spectroscopy. Thermal properties were investigated with the aid of differential scanning calorimetry and thermogravimetric analyzer.

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