• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2000.11a
• /
• pp.42-45
• /
• 2000

The properties of thermosetting resins are dependent on the degree of cure and consolidation quality. Since the consolidation process of thermosetting resin matrix fiber composites is much dependent on the viscosity of resin in the composites, in this study, the dissipation factor which is a function of viscosity was measured by the newly developed Lacomtech dielectrometry apparatus and sensors. Using the measured dissipation factors, the relationship between the dissipation factor and degree of cure with respect to environmental temperature was investigated.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2001.05a
• /
• pp.110-113
• /
• 2001

Dielectrometry has been used to monitor the cure of epoxy resin using composite matrix. In this investigation, physical properties of the mixture of epoxy resin(LY564), bisphenol A type, and cycloaliphatic hardener(HY 2954) were observed. Activation energy at maximum tan $\delta$ and gelation point was determined during isothermal scanning. From IonViscosity data, it was found that vitrification peak after gelation was appeared on slow heating rate. It was also measured that the duration time for full cure was necessary and it was about 24 hr at $145^{\circ}C$. Therefore, epoxy resin used in this research is required the extended time for full cure.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2001.10a
• /
• pp.43-48
• /
• 2001

To overcome the disadvantages of conventional excavation technology, various trenchless (or excavation free, or no-dig) repair-reinforcement technologies have been developed and tried. But trenchless technologies so fat developed have some brawbacks such as high cost and inconvenience of operation. In this study, a repairing-reinforcing process for underground pipes with glass fiber fabric polymer composites using VARTM(Vacuum Assisted Resin Transfer Molding) has been developed. The developed process requires shorter operation time and lower cost with smaller and simpler operating equipments than those of the conventional trenchless technologies. For the reliable operation of the developed method, a simple method to apply pressure and vacuum to the reinforcement was devised and flexible mold technology was tried. Also, resin filling and cure status during RTM process were monitored with a commercial dielectrometry cure monitoring system, LACOMCURE. From the investigation, it has been found that the developed repairing-reinforcing technology with appropriate process variables and on-line cure monitoring has many advantages over conventional methods.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2001.04a
• /
• pp.32-36
• /
• 2001

Recently, reaction injection molding has been used broadly for rapid prototyping, because of its convenience and versatility. Since the properties of molded products are dependent on the process variables and the production is very short(less than 2minutes), the control of process variables is important. Generally, the two significant process variables are degree of cure and temperature of the reactants. In this paper, the relation between the degree of cure and the temperature of reactants was investigated to find the optimal curing condition of reaction injection molding for rapid prototyping. The degree of cure during reaction injection molding was measured by the Lacomtech sensor and dielectrometry equipment employing Wheatstone bridge type circuit.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.4
• /
• pp.83-87
• /
• 2022

Recently, as the thickness of the semiconductor package becomes thinner, warpage has become a major issue. Since the warpage is caused by differences in material properties between package components, it is essential to precisely evaluate the material properties of the EMC(Epoxy molding compound), one of the main components, to predict the warpage accurately. Especially, the cure shrinkage of the EMC is generated during the curing process, and among them, the effective cure shrinkage that occurs after the gelation point is a key factor in warpage. In this study, the gelation point of the EMC was defined from the dissipation factor measured using the dielectric sensor during the curing process similar with actual semiconductor package. In addition, DSC (Differential scanning calorimetry) test and rheometer test were conducted to analyze the dielectrometry measurement. As a result, the dielectrometry was verified to be an effective method for monitoring the curing status of the EMC. Simultaneously, the strain transition of the EMC during the curing process was measured using the FBG (Fiber Bragg grating) sensor. From these results, the effective cure shrinkage of the EMC during the curing process was measured.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.23 no.5
• /
• pp.409-417
• /
• 2003

Cure monitoring can be used to improve the quality and productivity of thermosetting resin matrix composite products during their manufacturing process. In this work, the sensitivity of dielectrometry was improved by adequate separation the efforts of sensor and externals on the measured signal. A new algorithm to obtain the degree of cure during dielectric cure monitoring of glass/polyester and glass/epoxy composites was developed by employing a function of both temperature and dissipation factor, in which five cure monitoring parameters were used to calculate the degree of cure. The decreasing pattern of dissipation factor was compared with the relationships between the degree of cure and the resin viscosity. The developed algorithm might be employed for the in situ cure monitoring of thermosetting resin composites.

• Composites Research
• /
• v.16 no.4
• /
• pp.51-58
• /
• 2003

Since the reliability of adhesively bonded joints is much dependent on the curing status of thermosetting adhesive, the on-line cure monitoring during the cure of adhesively joints could improve the quality of adhesively bonded joints. In this work, the dielectric method which measures the dissipation factor of the adhesive during the cure of joints and converts it into the degree of cure of the adhesive was devised. The relation between the dissipation factor and the degree of cure of adhesive was investigated, which could eliminate the temperature effect on the dissipation factor that is a strong function of the degree of cure and temperature of adhesive. From the investigation, it was found that the dissipation factor showed a trend similar to the cure rate of the adhesive.

• Composites Research
• /
• v.30 no.3
• /
• pp.202-208
• /
• 2017

Resin transfer molding (RTM) is a mass production process that allows the fabrication of composites ranging in size from small to large. Recently, fast curing resins with a curing time of less than about 10 minutes have been used in the automotive and aerospace industries. The viscosity of resin is bound up with the degree of cure, and it can be changed rapidly in the fast-cure resin system during the mold filling process. Therefore, it is advantageous to experimentally measure and evaluate the degree of cure because it requires much effort to predict the flow characteristics and cure of the fast curing resin. DMA and dielectric technique are the typical methods to measure the degree of cure of composite materials. In this paper, the resin flow and degree of cure were measured through the multi-channel dielectric system. A total of 8 channels of dielectric sensors were used and resin flow and degree of cure were measured and compared with each other under various pressure conditions.

• Proceedings of the KSME Conference
• /
• 2001.11a
• /
• pp.797-803
• /
• 2001

The on-line cure monitoring of fiber reinforced thermosetting resin matrix composite material was performed for the better quality and productivity during manufacturing. Since the dissipation factor measured by dielectrometry method is dependent on the degree of cure and temperature of resin, in this study, a new method to obtain the degree of cure during on-line cure monitoring for glass/polyester composites was developed by employing a combination function of the temperature and the dissipation factor. Two sensor signals from a K-type thermocouple and an interdigitated dielectric sensor were processed during curing process under various cure cycles. The DSC (Differential Scanning Calorimetry) data was also used for the reference of degree of cure.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.19 no.7
• /
• pp.1563-1572
• /
• 1995

The on-line cure monitoring during the cure process of fiber reinforced resin matrix composite material is important for the better quality and productivity. Among several cure monitoring methods, the dielectrometry that uses electrodes as its sensor is known to be the most promising method. In this study, the sensitivity of the dielectric sensor for the on-line cure monitoring was analyzed by finite element method and compared to the experimental results. Using the analytical results, the equation for the capacitance of the sensor was derived. Also, the optimal sensor design method was suggested after analyzing several different sensor shapes.