• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.31-36
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• 2001

Dielectric material which is suitably designed for the application of the high-temperature electrostatic chucks(HTESCS) has been developed. Electrical resistivities and dielectric constants of the dielectric layer satisfy the demands for the proper operation of HTESC, and coefficient of thermal expansion(CTE) of the dielectric material matches well that of the bottom insulator so that it secures stable structure. In order to minimize particle contaminations, borosilicate glass(BSG) is selected as a bonding layer between dielectric layer and bottom insulator, and silver is used as a electrode. BSG is solidly bonded between upper dielectric and bottom insulator, and no diffusions or reactions are observed among silver electrode, dielectric, and glass layers. The chucking characteristics of the fabricated HTESC are found to be superior to those of the commercialized one.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.1
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• pp.70-78
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• 1995

In order to implement broadband RAM's(Radar Absorbing Materials) made up of multiple dielectricl layers, the design variables such as the dielectrci constaints, the depths and the loss tangents of dielectric are optimized. The wave impedances regarding the reflective wave are found in dielectrics, input impedances and reflection coefficients with multiple dielectric layers are derived from the transmission line circuit theory. Finally, minimum average reflective power and optimum design variables are obtained by applying the numerical technique, called modified Powell method. In case of four dielectric layers with inequality constraints in design variables, a quite favourable and feasible result with the total depth of 1.1 cm, the average reflective power of 0.85% over the bradband frequency range is obtained for a specific example.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.33-38
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• 2006

Aerosol slurry composed of dielectric materials, distilled water, and deflocculants was sprayed on the substrates, through a high-pressure spray gun as an aerosol. The coated layers were cofired together with $Al_{2}O_{3}$ substrates and green sheets on which the inner connectors were printed. Although the coating rate of coated layers strongly depended on slurry viscosity, spray shape, and the pressure of the spray gun, the coated density was not changed. Buried conductors were maintained as printed by high pressure spray coating method, because the pressing process was not used. At the optimum condition of air controller step 3-4 and slurry viscosity c.p 2000-4000, dense and uniform layers could be achieved. Comparing with conventional lamination process using green sheets, spray coating method enabled thin dielectric layers of $20{\sim}50{\mu}m$.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.11
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• pp.44-51
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• 1995

Homogeneous, compositionally graded, and superlattice-like silicon oxynitride(SiON) dielectric layers, with the refractive index varying from 1.46 to 2.05 as a function of film thickness, were grown by computer-controlled plasma-enhanced chemical vapor deposition (PECVD) using silane, nitrogen, and nitrous oxide reactant gases. An antireflection(AR) coating and thin-film electroluminescent(TFEL) devices with multiple dielectrics were designed and fabricated using real time control of reactant gases of the PECVD system.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.62-62
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• 1999

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.16 no.2
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• pp.87-92
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• 2016

In this paper, the solutions of TE(transverse electric) scattering problems by a conductive strip grating over two dielectric layers are analyzed by applying the PMM(point matching method) known as a numerical method of electromagnetic field. The boundary conditions are applied to obtain the unknown field coefficients, the scattered electromagnetic fields are expanded in a series of Floquet mode functions, and the conductive boundary condition apply to analysis of conducting strip. The most normalized reflected and transmitted powers having a sharp variations are scattered in direction of the other angles except incident angle. The numerical results for the normalized reflected and transmitted powers are analyzed by according as the width and spacing of conductive strip, incident angles, and the relative permittivity and thickness of the two dielectric layers. To confirm the validity of this paper, the numerical results of presented structure are shown in good agreement compared to those of the existing papers.

• Journal of the Korean institute of surface engineering
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• v.57 no.4
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• pp.254-264
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• 2024

This paper reviews the dielectric breakdown resistance and behavior of anodic oxide films in air environment. It begins with a description of the dielectric breakdown mechanisms of dielectric materials. The paper then introduces different types of dielectric materials and compares them in terms of dielectric strength, thermal conductivity, mechanical strength and cost. Next, the paper summarizes various fabrication methods for dielectric aluminum oxide layers, discussing the advantages and disadvantages of each method. Finally, it provides an overview of current studies on the dielectric breakdown properties of anodic aluminum oxide films formed on different aluminum alloys in various electrolytes.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.125-125
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• 2006

We present a low temperature thermal process for the transparent dielectric layer, barrier rib, and white back dielectric layer on the soda-lime glass substrate of the PDP by the $TruNano^{TM}$ processor in combination with a compositional modification to the conventional dielectric pastes. By this method the firing temperature can be lowered by more than $100^{\circ}C$.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.8
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• pp.1187-1196
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• 1989

In this paper, a method for computing the capacitance parameter for a multi-interconnection line in a multilayered dielectric region is presented. The number of interconnection lines and the number of dielectric layers are arbitrary, and the interconnection lines are finite cross section or infinite cross section. The surface of lines and dielectric interface are divided into subsection. The surface charge density of each subsection is a constant step-pulse function for each subsection. After the solution of surface charge density is effected by the method of moments, capacitance parameter is calculated.

• Proceedings of the KIEE Conference
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• 1997.11a
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• pp.391-393
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• 1997

Two kinds of the calculation technique are Investigated with 3D triangular SCM for the arrangement of the dielectric sphere with different resistivity under a uniform electric field. The calculation error of Method I is small outside the sphere, but considerably high Inside. On the other hand, the accuracy is much Improved even Inside the solid dielectric by Method II, which uses double layers of triangular charges on the dielectric boundary.