• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.04b
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• pp.92-95
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• 2000

The $(Sr_{1-x}Ca_x)TiO_3$(SCT) thin films are deposited on Pt-coated electrode(Pt/TiN/$SiO_2$/Si) using RF sputtering method with substitutional contents of Ca. The maximum grain of thin films is obtained at SCT15 thin film. The dielectric constant was increased with increasing the substitutional contents of Ca, while it was decreased if the substitutional contents of Ca exceeded over 15[mol%]. The dielectric constant changes almost linearly in temperature ranges of -80~+90$[^{\circ}C]$. The temperature properties of the dielectric loss have a stable value within 0.02 independent of the substitutional contents of Ca. All SCT thin films used in this study show the phenomena of dielectric relaxation with the increase of frequency, and the relaxation frequency is observed above 200[kHz].

• Proceedings of the KIEE Conference
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• 1992.07b
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• pp.747-749
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• 1992

In this study, $0.45Pb(Fe_{1/2}Nb_{1/2})O_3-(0.55-x)Pb(Fe_{2/3}W_{1/3})O_3-xPb(Mg_{1/3}Nb_{2/3})O_3(x=0.20, 0.25, 0.30)$ (x=0.20, 0.25, 0.30) ceramics were fabricated by the mixed oxide method. The sintering temperature and time were 950-990[$^{\circ}C$], 2[hr], respectively. The dielectric and structural properties with the composition and sintering temperature were investigated for the application as multilayer ceramic capacitors. To improve the dielectric loss, specimens doped with $MnO_2$, (0$\sim$2.0 [mol%] ) were fabricated and their dielectric properties were studied. With increasing the amount of $MnO_2$, dielectric constant was decreased and transition temperature was increased. Dielectric constant and dielectric loss of the 0.45PFN-0.30PFW-0.25PMN+$MnO_2$(1.0[mol.%]specimen(970[$^{\circ}C$]) had a good properties of 11,227, 1.3[%].

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.5 no.4
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• pp.394-399
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• 1995

Dielectric properties and crystal structure changes with temperature were observed on $(Na_{0.5}Sr_{0.5})(Ti_{0.5}Nb_{0.5})O_{3}$ which had a superstructure due to oxygen octahedron tilting. Dielectric loss peak observed at 380 K was found to have a relation with a primitive cell change from tetragonal to cubic, however, in this case, dielectric constant variation was not observed. Therefore it was found that the dielectric loss was more senstive than the dielectric constant for detecting the structure change. After the structure change of primitive cell from tetragonal to cubic, X-ray diffraction peaks of superstructure, which completely disappear above 500 K, were still observed. And no dielectric property variations were found with the disappearence of superstucture.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.8
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• pp.852-858
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• 2004

An alkoxide-based sol-gel method was used to fabricate $Ba_{0.6}Sr_{0.4}TiO_{3}$thin films doped by Bi from 5 to 20 mol% on a Pt/Ti/$SiO_2$/Sisubstrate. The structural and dielectric properties of BST thin films were investigated as a function of Bi dopant concentration. The dielectric properties of the Bi doped BST films were strongly dependent on the Bi contents. The dielectric constant and dielectric loss of the films decreased with increasing Bi content. However, the leakage current density of the 10 mol% Bi doped $Ba_{0.6}Sr_{0.4}TiO_{3}$ thin film showed the lowest value of 5.13$\times 10^{-7} A/{cm}^2$ at 5 V. The figure of merit (FOM) reached a maximum value of 32.42 at a 10 mol% Bi doped $Ba_{0.6}Sr_{0.4}TiO_{3}$thin films. The dielectric constant, loss factor, and tunability of the 10 mol% Bi doped $Ba_{0.6}Sr_{0.4}Tio_{3}$ thin films were 333, 0.0095, and 31.1%, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.565-568
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• 2004

An alkoxide-based sol-gel method was used to fabricate $Ba_{0.6}Sr_{0.4}TiO_3$ thin films doped by Bi from 5 to 20 mol% on a Pt/Ti/SiO2/Si substrate. The structural and dielectric properties of BST thin films were investigated as a function of Bi dopant concentration. The dielectric properties of the Bi doped BST films were strongly dependent on the Bi contents. The dielectric constant and dielectric loss of the films decreased with increasing Bi content. However, the leakage current density of the 10 mol% Bi doped $Ba_{0.6}Sr_{0.4}TiO_3$ thin film showed the lowest value of 5.13 10-7 at 5 V. The figure of merit (FOM) reached a maximum value of 32.42 at a 10 mol% Bi doped $Ba_{0.6}Sr_{0.4}TiO_3$ thin films. The dielectric constant, loss factor, and tunability of the 10 mol% Bi doped $BBa_{0.6}Sr_{0.4}TiO_3$ thin films were 333,0.0095, and 31.1%, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.776-779
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• 2004

The dielectric and electrical characteristics of Ce doped (Ba0.6Sr0.4)TiO3 (BST) thin films were investigated as a function of Ce content. Both atomic force microscopy (AFM) and x-ray diffraction (XRD) analysis showed that increasing the Ce doping ratio causes the decrease in grain size while the surface remains smooth and crack-free. The dielectric properties of the Ce doped BST films were found to be strongly dependent on the Ce contents. The dielectric constant and dielectric loss of the BST films decreased with increasing Ce content. However, it was also found that, compared with undoped films, the increase of Cecontent improves the leakage-current characteristics. The improvement of the electrical properties of Ce-doped BST films may be related to the decrease in the concentration of oxygen vacancies. The figure of merit (FOM) reached the maximum value of 48.9 at the 1 mol % of Cedoping. The dielectric constant, loss factor, and tunability of the 1 mol% Ce doped Ba0.6Sr0.4TiO3 thin films were 320, 0.011, and 46.3%, respectively.

• Journal of the Korean Ceramic Society
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• v.49 no.2
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• pp.179-184
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• 2012

The size of various alumina ceramics used in semiconductor and display industry is required to increase with increase in wafer and panel size. In this research, large alumina ceramics were fabricated by uniaxial pressing, cold isostatic pressing and filter pressing with commercial powder and thereafter sintering at $1600^{\circ}C$ in gas furnace. The large alumina ceramics exhibited dense microstructure corresponding to 98.5% of theoretical density and 99.8% of high purity. The impurities and microstructural defects of the alumina were found to influence the resistance and dielectric properties. The volume resistances in these four aluminas were almost the same while the pure alumina was higher value. The dielectric constant, dielectric loss and dielectric strength of aluminas were placed within the range of 10.3~11.5, 0.018~0.036, and 10.1~12.4 kV/mm, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.18-21
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• 2004

An alkoxide-based sol-gel method was used to fabricate $Ba_{0.6}Sr_{0.4}TiO_3$ thin films doped by Bi from 5 to 20 mol% on a $Pt/Ti/SiO_2/Si$ substrate. The structural and dielectric properties of BST thin films were investigated as a function of Bi dopant concentration. The dielectric properties of the Bi doped BST films were strongly dependent on the Bi contents. The dielectric constant and dielectric loss of the films decreased with increasing Bi content. However, the leakage current density of the 10 mol% Bi doped $Ba_{0.6}Sr_{0.4}TiO_3$ thin film showed the lowest value of $5.13{\times}10^{-7}\;A/cm^2$ at 5 V. The figure of merit (FOM) reached a maximum value of 32.42 at a 10 mol% Bi doped $Ba_{0.6}Sr_{0.4}TiO_3$ thin films. The dielectric constant, loss factor, and tunability of the 10 mol% Bi doped $Ba_{0.6}Sr_{0.4}TiO_3$ thin films were 333, 0.0095, and 31.1%, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.288-291
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• 2002

An alkoxide-based sol-gel method was used to fabricate $(Pb_{x},Sr_{1-x})$TiO3 (PST) thin films on a Pt/Ti/SiO2/Si substrate, and the dielectric properties of the PST thin films were investigated as a function of the Pb/Sr composition for use in tunable microwave device applications. The dielectric properties of the PST films were strongly dependent on the Pb/Sr ratio. The dielectric constant and dielectric loss of the PST films increased with increasing Pb content, and the figure of merit (FOM) reached a maximum value of 27.5 at a Pb/Sr ratio of 4:6. The tunability increased with increasing Pb content. The dielectric constant, loss factor, and tunability of PST (50/50) thin films were 404, 0.023, and 51.73%, respectively. From the result, the PST films with good dielectric properties are useful candidates for tunable microwave device.

• Polymer(Korea)
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• v.33 no.1
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• pp.39-44
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• 2009

Polymer substrates were fabricated by using poly (phenylene ether) as a base resin, N,N'-m-phenylenedimaleimide (PDMI) as a crosslinking agent and decabromodiphenylethane as a flame retardant. The effects of crosslinking agent and flame retardant on physical properties such as dielectric property of the substrate were investigated. Thermal curing feature of PDMI with or without an initiator was analyzed by DSC, and then, PPE-PDMI test compositions were designed based on this result. Composite sheets were cast by film coater, laminated under vacuum and pressure, and then, the changes of dielectric constant, dielectric loss, peel strength, solder heat resistance and inflammability according to increasing amount of PDMI and flame retardant were evaluated, Dielectric constant and dielectric loss showed increasing trend with increasing amount of PDMI and flame retardant, but solder heat resistance and inflammability were improved. Peel strength was obtained higher than 1 kN/m when PDMI above 10 wt% was added, but slightly decreased as the amount of flame retardant increased. From the measured gel contents, the reaction mechanism of PPE-PDMI system was deduced to the formation of network structure by crosslinking PDMI with PPE rather than the formation of semi-IPN structure. In conclusion, the polymer composite substrate materials with dielectric constant of 2.52$\sim$2.65 and dielectric loss below 0.002 at 1 GHz were obtained and they will be proper for high frequency applications.