• Transactions of the Korean Society of Mechanical Engineers
• /
• v.19 no.9
• /
• pp.2154-2164
• /
• 1995

In this study, a dielectric cure monitoring system which consists of an electric circuit, a sensor and a personal computer was developed to on-line monitor the dielectric properties of carbon fiber epoxy composite materials. Also, the kinetic model of carbon fiber epoxy composite materials was developed by curve fitting of differential scanning calorimetry data. The start and end points of cure and the relationship between the dissipation factor and the degree of cure were obtained by comparing the dissipation factor from the dielectric properties with the degree of cure from the DSC data. The relationship between the dissipation factor and the degree of cure was tested under various temperature profiles.

• Proceedings of the KSME Conference
• /
• 2001.11a
• /
• pp.797-803
• /
• 2001

The on-line cure monitoring of fiber reinforced thermosetting resin matrix composite material was performed for the better quality and productivity during manufacturing. Since the dissipation factor measured by dielectrometry method is dependent on the degree of cure and temperature of resin, in this study, a new method to obtain the degree of cure during on-line cure monitoring for glass/polyester composites was developed by employing a combination function of the temperature and the dissipation factor. Two sensor signals from a K-type thermocouple and an interdigitated dielectric sensor were processed during curing process under various cure cycles. The DSC (Differential Scanning Calorimetry) data was also used for the reference of degree of cure.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2001.05a
• /
• pp.219-223
• /
• 2001

The on-line cure monitoring during the cure process of composite materials is important for better quality and productivity. The dielectric sensor for cure monitoring consists of base film and electrodes. Because the characteristic of dielectric sensor for the on-line cure monitoring is dependent on the base material, width and number of electrode, etc, the dielectric sensor should be standardized. And the selection of base film material of sensor is very important. In order to prevent the measuring errors generated from the increase of environmental temperature, the base film material should have stable dielectric constant with respect to environmental temperature. In this study, the newly developed dielectric sensor for cure monitoring was designed and the dissipation factor which is function of degree of cure was measured using the sensor. The relationship between the dissipation factor and degree of cure with respect to environmental temperature was investigated.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2000.11a
• /
• pp.22-28
• /
• 2000

The fiber reinforced composite materials is widely used in aircraft, space structures and robot arms because of high specific strength and high specific modulus. The on-line cure monitoring during the cure process of the composite materials has become an important research area for the better quality and productivity. In this paper, the dielectric circuit of the wheatstone bridge type for measuring the dissipation factor was designed and manufactured. Also, the dielectric sensor for the cure monitoring of the high temperature composites was developed. The residual thermal stresses of the dielectric sensor were analyzed by the finite element method and its dielectric characteristics under high temperature were evaluated. The on-line cure monitoring of the BMI resin was performed using the wheatstone bridge type circuit and developed high-temperature dielectric sensor.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1993.11a
• /
• pp.85-89
• /
• 1993

Silicone oil exhibits the properies of both organic and inorganic substances and, thus, it has many superior properties such as higher thermal resistance and lower thermal oxidation level when compared to other dielectric liquids. In order to investigate the dielectric characteristics, dielectric liquids of viscosity 1 [cSt] is chosen as the specimen and experiment is performed in the temperature range of 20∼65 [$^{\circ}C$] and frequency range of 30∼1${\times}$10$\^$6/ [Hz] respectively. As a result, the observed linear decrease in dissipation factor at the frequency range below 3 [kHz] is due to the influence of frequency, whereas the increase in dissipation factor at higher frequency range is contributed by electrode's resistance. At a fixed frequency of 30 [kHz], increasing temperature results in higher peak value and wide width of the absorption curve. This is due to the increase in dipole and viscosity. As temperature increases, dipole moment is decreased from 0.98 to 0.64 [debye]. The activation energy which causes the relaxation and loss of dielectric is obtained about 15 [kcal/mole].

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1991.10a
• /
• pp.73-78
• /
• 1991

In this study of stacked type film chip capacitor, the important parameters are heat-treated temperature, pressure and time. We measured the temperature dependence of dielectric properties and dissipation factor and the frequency dependence of dielectric properties, dissipation factor, ESR(Equivalent Series Resistance) and impedance in stacked type film capacitor. As a result, the best conditions of heat-treated temperature, pressure and time were proved to be 130$^{\circ}C$, 10kg/$\textrm{cm}^2$ and 3hrs, respectively.

• The Transactions of the Korean Institute of Electrical Engineers
• /
• v.33 no.2
• /
• pp.83-87
• /
• 1984

Influence of the metallization during the manufacturing of the ceramic multilayer capacitor on the dielectric properties was studied as a change of the capacity and the dissipation factor. Due to the change of the relative dielectric constant as a function of the measuring temperature the influence of the metallization could be obtained and the change of the dissipation factor as a function of the measuring frequency was anaysed. In order to investigate the boundary effect between the metallization and the dielectric a kind of microstructure model at the internal Grain and Grain Boundary was constructed and tried to analyse the change of the dielectric properties.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.53 no.11
• /
• pp.561-565
• /
• 2004

SiO₂ thin films are fabricated using sol-gel method and dipping method. Gelation time is faster according to increasing the amount of H₂O except H₂O/Si(OC₂H/sub 5/)₄=4. Initial viscosity is highest at H₂O/Si(OC₂H/sub 5/)₄=6. Gelation time is faster according to increasing the amount of CH₃COOH. The relative dielectric constant of thin films decreases a little according to increasing the measuring frequency. The dielectric dissipation factor of thin films increases a little below 100kHz and it increases rapidly over 100kHz.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.13 no.2
• /
• pp.137-142
• /
• 2000

The sintering and electrical properties of YMnO3 bulk ceramics were investigated with Y/Mn ratios(Mn rich ;0.80/1.20, 0.90/1.10, 0.95/1.05, and Y rich ; 1.00/1.00, 1.05/0.95, 1.10/0.90). The crystal structure of samples showed a hexagonal structure, and the sample of Y/Mn = 0.95/1.05 indicated higher c-axis oriented peak than other samples. In the case of Mn rich samples, the grain sizes were about 7.8${\mu}{\textrm}{m}$ and they showed 95% of theoretical density. Whereas, in the case of Y rich samples, the grain sizes were about 2.3${\mu}{\textrm}{m}$ and they showed 86%. The dielectric constant and dissipation factor of the Mn rich samples were smaller than those of the Y rich samples. The samples of Y/Mn = 0.90/1.10 showed the lowest a dissipation factor, and their dielectric constant, dissipation factor and Curie temperature were 36, 0.0136 and 68$0^{\circ}C$, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.05b
• /
• pp.7-10
• /
• 2004

This paper presents the electrical properties of PTFE nozzle for a electrical apparatus. In the arcing environment in a electrical apparatus, radiation is considered to be the major energy transport mechanism from the arc to the wall. The fraction of the radiation power is emitted out of the arc and reaches the nozzle wall, causing ablation at the surface and in the depth of the wall. The energy concentration in the material leads to the depolymerization and eventually leads to the generation of decomposed gas as well as some isolated carbon particles. Adding some fillers into PTFE is expected to be efficient for improving the endurability against radiation. In this experiment, three kinds of fillers that have endurance in the high temperature environment were added into PTFE. Light reflectance of fillers was investigated. Dielectric constan and dissipation factor of PTFE composites were investigated. Dielectric constant and dissipation factor of the PTFE composites increased with increasing contents of the fillers.