• Design & Manufacturing
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• 제11권2호
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• pp.37-41
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• 2017

With light vehicle weight gradually becoming ever more importance due to tightened exhaust gas regulations, hot-stamping processing using boron alloyed steel is being applied more and more by major automobile OEMs since process assures both moldability and a high strength of 1.5 GPa. Although laser trimming is generally applied to the post-processing of the hot-stamped process with high strength, there have been many studies of in-die hot trimming using shear dies during the quenching of material in order to shorten processing times. As such, this study investigated the effects of the Shear rate and Shear mechanism on shear processes during the quenching process of hot-stamping material. In case of pad variable, padding force is very weak compared with shear force, so it does not affect the shear surface. In case of shear rate, the higher the shear at high temperatures and the higher the friction effect. As a result the rollover and the fracture distribution decreased, and the burnish distribution increased. Therefore, it is considered that the shear quality is guaranteed when high shear rate is applied in high temperature shear process.

• 대한기계학회논문집A
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• 제21권6호
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• pp.951-960
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• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.

• Elastomers and Composites
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• 제43권3호
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• pp.173-182
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• 2008

고무나 우레탄과 같은 고 탄성력을 이용하여 튜브를 임의의 형상으로 성형하는 고 탄성체 성형방법은 타 공정에 비해 높은 치수 정밀도와 생산 공정의 단축, 에너지 절감 등을 기대할 수 있는 차세대 성형기술이라 할 수 있다. 본 연구에서는 탄성체에 대한 소재 물성시험과 특성평가를 통해 고 탄성체 성형에 적합한 소재를 선정하고 시험으로 얻어진 응력-변형률을 이용하여 비선형 재료상수를 결정하여 성형해석에 필요한 물성 데이터를 확보하였다. 또한, 랙튜브에 대한 유한요소해석을 통해 탄성체의 두께변화에 따른 공정변수의 영향을 검토하였다.

• 한국정밀공학회지
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• 제20권7호
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• pp.147-154
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• 2003

An effective die-polishing robot system is developed. ATC (Automatic Tool Change), tool posture angle control, and robot program for polishing application are developed and integrated into a robotic system that consists of a robot, pneumatic grinding tool, and grinding abrasives (papers and special films). ATC is specifically designed to exchange whole grinding tool set for complete unmanned operation. A tool posture angle control system is developed for the tools to maintain a specified skew angle rather than right angle on the surface for best finishing results. A PC and the robot controller control ATC and tool posture angle. Also, there have been more considerations on enhancing the performance of the system. Elastic material is inserted between the grinding pad and the holder for better grinding contact. Robot path data are generated automatically from the NC data of previous machining process.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.69-73
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• 2008

본 연구에서는 리드-온-칩 패키징 기술을 이용한 반도체 제품에서 디바이스의 패드의 위치가 온도변화로 인한 신뢰성 문제에 대단히 중요하다는 것을 보여준다. 컴퓨터를 이용한 이론적 계산 및 실험을 통해 패시베이션 파손으로 대변되는 신뢰성 문제가 디바이스의 코너 부위에 위치한 패턴에서 가장 심하게 발생할 수 있다는 것을 보여준다. 따라서, 패시베시션 파손 등으로 인한 디바이스의 신뢰성 저하를 예방하기 위해서는 취약한 패드 부위는 다바이스의 테두리 부위보다는 중앙부위에 위치하도록 설계하는 것이 바람직하다는 것을 본 연구에서는 지적하고 있다.

• 마이크로전자및패키징학회지
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• 제28권3호
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• pp.1-7
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• 2021

본 논문에서는 Bare-die Chip 형태의 Drive amplifier를 Ajinomoto Build-up Film (ABF)와 FR-4로 구성된 PCB에 내장함으로써 28 GHz 대역 모듈에서 적용될 수 있는 내장형 능동소자 모듈을 구현하였다. 내장형 모듈에 사용된 유전체 ABF는 유전율 3.2, 유전손실 0.016의 특성을 가지고 있으며, Cavity가 형성되어 Drive amplifier가 내장되는 FR4는 유전율 3.5, 유전손실 0.02의 특성을 가진다. 제안된 내장형 Drive amplifier는 총 2가지 구조로 공정하였으며 측정을 통해 각각의 S-Parameter특성을 확인하였다. 공정을 진행한 2가지 구조는 Bare-die Chip의 패드가 위를 향하는 Face-up 내장 구조와 Bare-die Chip의 패드가 아래를 향하는 Face-down내장 구조이다. 구현한 내장형 모듈은 Taconic 사의 TLY-5A(유전율 2.17, 유전손실 0.0002)를 이용한 테스트 보드에 실장 하여 측정을 진행하였다. Face-down 구조로 내장한 모듈은 Face-up 구조에 비해 Bare-die chip의 RF signal패드에서부터 형성된 패턴까지의 배선 길이가 짧아 이득 성능이 좋을 것이라 예상하였지만, Bare-die chip에 위치한 Ground가 Through via를 통해 접지되는 만큼 Drive amplifier에 Ground가 확보되지 않아 발진이 발생한다는 것을 확인하였다. 반면 Bare-die chip의 G round가 부착되는 PCB의 패턴에 직접적으로 접지되는 Face-up 구조는 25 GHz에서부터 30 GHz까지 약 10 dB 이상의 안정적인 이득 특성을 냈으며 목표주파수 대역인 28 GHz에서의 이득은 12.32 dB이다. Face-up 구조로 내장한 모듈의 출력 특성은 신호 발생기와 신호분석기를 사용하여 측정하였다. 신호 발생기의 입력전력(P_in)을 -10 dBm에서 20 dBm까지 인가하여 측정하였을 때, 구현한 내장형 모듈의 이득압축점(P_1dB)는 20.38 dB으로 특성을 확인할 수 있었다. 측정을 통해 본 논문에서 사용한 Drive amplifier와 같은 Bare-die chip을 PCB에 내장할 때 Ground 접지 방식에 따라 발진이 개선된다는 것을 검증하였으며, 이를 통해 Chip Face-up 구조로 Drive amplifier를 내장한 모듈은 밀리미터파 대역의 통신 모듈에 충분히 적용될 수 있을 것이라고 판단된다.

• 한국염색가공학회지
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• 제23권4호
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• pp.304-311
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• 2011

For sound absorption and sound insulation in automobile industry, the sound absorption materials based on meltblown nonwovens were prepared by SMS (spunbond-meltblown-spunbond) technique. And the sound absorption coefficient (${\alpha}$) of the meltblown nonwoven, produced with isotatic-polypropylene(PP), was examined for the various processing conditions such as die-to-collector distance(DCD), nonwoven weight(GSM), and air suction conditions. The meltblown nonwoven for sound absorption materials was composed of bulky microfiber web, increasing with increases in weight and DCD. The sound absorption coefficient(${\alpha}$) was excellent as a sound absorption materials of PAD type composed of SMS(spunbond-meltblownspunbond) nonwovens.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.3-8
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• 2002

An intelligent polishing robot automation system is developed. Automatic Tool Change System(A.T.C.), Tool Posture Angle Control, and Robot Program for Polishing Application are developed and integrated into a robotic system that consists of a robot, pneumatic finding tool, and finding abrasives (papers and special films). A.T.C. is specifically designed to exchange whole grinding tool set for complete unmanned operation. Tool Posture Angle Control is developed to give a certain skew angle rather than right angle to tools on the surface for best finishing results. A.T.C. and Tool Posture Angle Control is controlled by a PC and the robot controller. Also, there have been some considerations on enhancing the performance of the system. Some elastic material is inserted between the grinding pad and the holder for better grinding contact. The robot path data is generated automatically from the NC data of previous machining process.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제54권7호
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• pp.315-318
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• 2005

The effect of plasma cleaning was examined on package delamination phenomena in the integrated circuit (IC) packaging process. Without plasma cleaning, delamination was observed for all three experimental treatments applied after the packaging step, which include bake of If, reflow, and bake of If followed by reflow However, no delamination was observed when the plasma cleaning was performed before and after the wire bonding step. Plasma cleaning was found to be a critical step to improve the reliability of the package by reducing the possibility of contact failure between die pad and bonding wire.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집A
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• pp.873-878
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• 2000

Semiconductor packaging technology is changed rapidly according to the trends of the micro miniaturization of multimedia and information equipment. For I/O limitation and fine pitch limitation, DIP and SOP/QFP are replaced by BGA/CSP. This is one of the surface mount technology(SMT). Solder ball is bumped n the die pad and connected onto mounting board. In ball bump formation, vacuum suction type ball alignment process is widely used, However this type has some problems such as ionization, static electricity and difficulty of fifo(first-input first-out) of solder balls. Seesaw type is reducing these problems and has a structural simplicity and economic efficiency. Ball cartridge velocity and ball aligned plate angle are Important variables to improve the ball alignment Process. In this paper, seesaw-type CSP solder ball loader is developed and the optimal velocity and plate angle are proposed.