• Title/Summary/Keyword: Die life

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A Study of Semi Fine-blanking Mold Analysis using Finite Element Method (유한요소법을 이용한 세미 파인-블랭킹 금형 해석에 관한 연구)

  • Lee, Sang-Hun;Song, Gi-Hwan;Son, Chang-Woo;Seo, Hyoung-Jin;Seo, Tae-Il
    • Design & Manufacturing
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    • v.10 no.1
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    • pp.51-54
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    • 2016
  • Metal sheet forming has been commonly used as the core technology in manufacturing parts of automobiles. It guarantees the highest production rate due to the process of mass production employing the press die. For precision of the product, the accuracy of the molds and its mechanic structures are considered as essential factors. One of these is fine blanking, which is utilized for the production of the metal sheet spring, with which clear sheer surfaces can be achieved in one operation from the materials. However, the current designs of press dies perform the forming analysis with the molds of rigid body, so they are focused on weight lightening by a rule of thumb. Therefore, this paper practice structural analysis about developing the semi fine-fine blanking technology. The semi fine-blanking can be run through the combination of the hydraulic cylinders and normal presses, so this paper analyze the amount of deformation according to the oil pressure. In addition, based on the plasticity of 50CrV4, the materials of the mold parts, the structural analysis and life analysis are proceeded, so they are expected to be useful as data for manufacturing the mold.

A Study on the Hybrid-ECAP Process to Produce Ultra-Fine Materials (초미세 결정립 조직을 만들기 위한 복합전단가공법에 관한 연구)

  • Lee, Ju-Hyun;Lee, Jin-Ho
    • Journal of the Korea Institute of Military Science and Technology
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    • v.11 no.4
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    • pp.83-91
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    • 2008
  • The development of the equal channel angular pressing(ECAP) process in metals has recently provided a feasible solution to produce ultra-fine or nano-grained bulk materials with tailored material properties. However, ECAP process is difficult to scale up commercially due to requirements of an excessive load. In this paper, a new Hybrid-ECAP process with torsional die is considered to obtain materials of ultra-fine grain structure under low forming load. An upper bound analysis and numerical simulation (DEFORM 3D, a commercial FEM code) are carried out on the torsional die. By the upper bound analysis, analytical expression for the compression force and rotation speed are obtained. By the FEM analysis, the distribution of strain, stress and deformation are obtained. These results show that the Hybrid-ECAP is a useful process because this process can obtain the homogeneous deformations with relatively low forming load. Additionally, due to decreased forming load, die life can be improve.

Friction Welding of Dissimilar Hot Die Punch materials and Its Creep Life Prediction(II)-Creep Life Prediction by ISM (열간 금형재의 이종재 마찰용접과 크리프 수명예측 (II) -크리프 수명예측)

  • 박일동;공유식;오세규;전태언
    • Journal of Ocean Engineering and Technology
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    • v.15 no.2
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    • pp.53-60
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    • 2001
  • It was confirmed that the life predictive equation by LMP and LMP-ISM are effective only up to 10$^2$hours and can not be used for long times of $10^3~10^5$ hours, but that by ISM can be used for long times creep life prediction with more reliability. The predictive creep life equation of ISM has better reliability than those by LMP and LMP-ISM, and its realizably is getting better for long time creep prediction($10^3~10^5$ h).

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An Analysis on the Thermal Shock Characteristics of Pb-free Solder Joints and UBM in Flip Chip Packages (플립칩 패키지에서 무연 솔더 조인트 및 UBM의 열충격 특성 해석)

  • Shin, Ki-Hoon;Kim, Hyoung-Tae;Jang, Dong-Young
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.5
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    • pp.134-139
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    • 2007
  • This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.

Friction Welding of Dissimilar Hot Die Punch Materials and Its Creep Life Prediction and Quality Evaluation by AE ( II )-Creep Life Prediction by ISM (열간 금형펀치 제작을 위한 이종재 마찰용접과 고온 크리프 실시간 예측 및 AE에 의한 품질평가 (II)-크리프 수명예측)

  • 박일동;오세규;공유식;전태언
    • Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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    • 2000.10a
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    • pp.26-32
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    • 2000
  • It was confirmed that the life predictive equation by LMP-ISM are effective only up to 10$^2$hours and can not be used for long times of 10$^3$~10$^{5}$ hours, but that by ISM can be used for long times creep life prediction with more reliability. The predictive creep life equation of ISM has better reliability than those by LMP and LMP-ISM, and its realizably is getting better for long time creep prediction(10$^3$~10$^{5}$ H).

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Experimental Study on the Mold Life of Fine Blanking Using Thick Plate Materials (후판 소재를 적용한 파인 블랭킹 금형 수명에 관한 연구)

  • Park, D.H.;Hyun, K.H.
    • Transactions of Materials Processing
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    • v.30 no.3
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    • pp.149-156
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    • 2021
  • Fine blanking is a high-precision process combining principles of metal stamping and cold forming. Unlike conventional metal stamping, fine blanking uses a special triple action such as V-ring force, counter force, shearing force. This study performed the effect of pocket-shaped compression molding on the mold life of the fine blanking using the 7.4mm thick SM45C material. In order to determine the lifespan of the punch and die in the fine blanking molds, a trial mold was manufactured and various punch materials were selected to perform the mold life test. A study on the life of a fine blanking mold by applying a thick plate material was experimentally performed through a mold test.

Development of a new injection mold structure for internal gears (새로운 내측기어 성형용 사출성형 금형구조의 개발)

  • Kwon, Youn Suk;Je, Deok Keun;Jeong, Yeong Deug
    • Design & Manufacturing
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    • v.8 no.1
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    • pp.40-44
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    • 2014
  • As a rotating machine element, plastic gears are more and more widely used in such as industrial machine element, since plastic gear is lighter, higher wear-resistance, and higher vibration absorbing ability than metal gears. When operating plastic parts, tooth breakage and fatigue life shortened due to increasing number of applying load and tooth flank temperature rising, such that accuracy of plastic gears is divided from allowable range to cause vibration and noise. On this study, a internal plastic gears are developed which improved the filling balance molding process by a new injection mold structure. The new mold structure called HR3P(hot runner type 3plate mold). As the result from this studies, we obtained a very accurate roundness internal gears by using design of experiment.

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A Study on the Effects of Package and PCB Materials on Thermal Characteristics of PDIP (패키지 및 PCB 재료가 PDIP 열특성에 미치는 영향에 관한 연구)

  • 정일용;이규봉
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.3
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    • pp.729-737
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    • 1994
  • A three-dimensional finite element model of a 20-pin plastic dual-in-line package(PDIP) plugged into a PCE has been developed by using the finite element code ANSYS. The model has been used for thermal characterization of the package during its normal operation under natural convection cooling. Temperature distributions in the package and PCB are obtained from numerical analysis and compared with experimentally measured data. Various cases are assumed and analyzed to study the effects of package and PCB materials on thermal characteristics of PDIP with and without aluminum heatspreader. Thermal dissipation capability of PDIP is greatly increased due to copper die pad/lead frame and heatspreader. However, thermally induced stresses in the package and fatigue life of chip are improved for PDIP with Alloy 42 die pad/lead frame and no heatspreader. It is also found that the role of PCB on thermal characteristics of PDIP is very imporatant.

A study on structural improvement in multi-cavity mold for ham can lids (햄 뚜껑 금형의 다수 캐비티 금형구조 개선에 관한 연구)

  • Lee, Eun-jong;Choi, Kye-kwang;Kim, Sei-hwan
    • Design & Manufacturing
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    • v.7 no.1
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    • pp.40-44
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    • 2013
  • My company develops, manufactures injection mold and produces thin-walled cosmetics and food containers. Without high quality and low production cost, it is hard to compete in the market. To be competitive, a company has to utilize mold with as many cavities as possible to lower manufacturing cost. Eject plate abrasion and deformation cut down mold lifespan, troubles during injection lower productivity and foreign substances in molds cause abrasion. This study focuses on how to improve mold life and productivity, and to slow down mold abrasion.

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