• Korean Journal of Materials Research
• /
• v.19 no.5
• /
• pp.288-292
• /
• 2009

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

• Journal of Korea Foundry Society
• /
• v.19 no.5
• /
• pp.410-418
• /
• 1999

To overcome the undesirable deformation, peeling off and geometrical restrictions which were mainly caused by differences in thermal expansion coefficients during the cladding of aluminum strip and stainless strip, new processing method based on vacuum die casting is designed and implemented in fabricating Fe-17wt%Cr steel (stainless steel). To increase cast-bonding ability, the surface of Fe-17wt%Cr steel is electrochemical etched to have optimum pit size (above 0.2 mm) and pit density (above 30%). The implementation of vacuum die casting by using surface treated stainless steel (Fe-17wt%Cr Steel) produces good trial products having acceptable cast-bonding ability. The enabling conditions for cast-bonding are pouring temperature $690^{\circ}C$, filling speed 30 m/sec and casting pressure $800\;kg/cm^2$. The microscopic observation of cast-bonded Al/Fe-17wt%Cr steel does not show any evidence of intermetallic compounds. The bonding strength of trial products is $150-400\;kg/cm^2$ and this is stronger than conventionally cladded metal having $30-70\;kg/cm^2$.

• Journal of the Korea Institute of Military Science and Technology
• /
• v.11 no.4
• /
• pp.83-91
• /
• 2008

The development of the equal channel angular pressing(ECAP) process in metals has recently provided a feasible solution to produce ultra-fine or nano-grained bulk materials with tailored material properties. However, ECAP process is difficult to scale up commercially due to requirements of an excessive load. In this paper, a new Hybrid-ECAP process with torsional die is considered to obtain materials of ultra-fine grain structure under low forming load. An upper bound analysis and numerical simulation (DEFORM 3D, a commercial FEM code) are carried out on the torsional die. By the upper bound analysis, analytical expression for the compression force and rotation speed are obtained. By the FEM analysis, the distribution of strain, stress and deformation are obtained. These results show that the Hybrid-ECAP is a useful process because this process can obtain the homogeneous deformations with relatively low forming load. Additionally, due to decreased forming load, die life can be improve.

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.2
• /
• pp.79-84
• /
• 2016

A flexible electronic device deformed by external force causes the failure of a semiconductor die. Even without failure, the repeated elastic deformation changes carrier mobility in the channel and increases resistivity in the interconnection, which causes malfunction of the integrated circuits. Therefore it is desirable that a semiconductor die be placed on a neutral line where the mechanical stress is zero. In the present study, we investigated the effects of design factors on the position of neutral line by finite element analysis (FEA), and expected the possible failure behavior in a flexible face-down packaging system assuming flip-chip bonding of a silicon die. The thickness and material of the flexible substrate and the thickness of a silicon die were considered as design factors. The thickness of a flexible substrate was the most important factor for controlling the position of the neutral line. A three-dimensional FEA result showed that the von Mises stress higher than yield stress would be applied to copper bumps between a silicon die and a flexible substrate. Finally, we suggested a designing strategy for reducing the stress of a silicon die and copper bumps of a flexible face-down packaging system.

• Korean Journal of Metals and Materials
• /
• v.56 no.12
• /
• pp.861-869
• /
• 2018

To determine the origin of the inhomogeneous microstructure and texture observed in drawn and annealed high purity copper wires, two kinds of drawing process conditions and their influence was investigated. The regular condition, based on a symmetric die, and a condition designed intentionally to produce an inhomogeneous shear deformation using an asymmetric die were employed. The difference in intensity of <111>-<100> distributed texture between the two wires confirmed that the wire drawn under the asymmetric die condition experienced a higher amount of shear deformation. The extensive shear strain in the wire drawn under the asymmetric die condition gave rise to inhomogeneous primary and secondary recrystallization behavior. After annealing at $200^{\circ}C$, grains with <100> texture, which were larger than the surrounding recrystallized grains, were extensively present on one half circle of the wire drawn under the asymmetric die condition, while larger grains with <100> were sparsely observed around the middle region of the wire drawn under the regular condition. Interestingly, the area where the larger grains with <100> texture existed was identical to the area where the high shear strain occurred during drawing in both wires. During annealing at $400^{\circ}C$, grains with <112> texture started to grow abnormally at the center of both wires as a result of secondary recrystallization. After annealing at $900^{\circ}C$ grains with <112> due to secondary recrystallization occupied the entire region of the wire drawn under the regular condition. On the other hand, in the wire drawn under the asymmetric die condition and then annealed at $900^{\circ}C$, the <100> oriented grains as a result of the normal grain growth of the larger <100> grains which were observed after annealing at $200^{\circ}C$, coexisted with the abnormally grown <112> grains. These results indicate that dynamic recrystallization induced by the shear strain during drawing plays an important role in the inhomogeneity of the microstructure and texture of wires after annealing.

• Design & Manufacturing
• /
• v.8 no.1
• /
• pp.23-26
• /
• 2014

The injection molding is used in more than 70% of total production of plastic products. Weld line in injection molded part is one of the defects in injection molding process. Weld line deteriorates not only appearance quality but also mechanical property. In this study weld quality has been examined according to the injection processing temperature, materials and mold designs. We selected four different materials such as PA, PP, ABS and PS as experimental materials. Weld quality increased as injection processing temperature increases. It was more dependent on materials flow ability. As a result, weld quality incase of rectangular core is better than circular core.

• Transactions of Materials Processing
• /
• v.3 no.1
• /
• pp.3-17
• /
• 1994

The semi-solid metal forming for vigorously agitated semi-solid alloys has been widely studied over the last decade. Metal forming processes are now being developed using alloys in the semi-solid state, among them are rolling, forging, extrusion, and die casting. Some of these are now employed commercially to produce a components and are also used to fabricate metal matrix composites. The semi-solid materials can be processed either directly during solidification and for this purpose mechanical stirring was demonstrated to produce a highly solidification. This paper is concerned with the influence of processing parameters on limitations of semi-solid forming.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.16 no.4
• /
• pp.119-126
• /
• 2007

Generally, the machinability of materials that have a good mechanical properties is poor. The material having a high strength, high toughness in high temperature and wear resistance, it is difficult to remove a chip from workpiece. STD11 and NAK80 are kinds of these materials and these materials can be used in many industrial fields. But it is limited in use because of high cost and poor machinability. In this experimental study, the cutting of STD11 and NAK80 were used to decide the machinability and the tool shape of CBN ball end mill. From the results, the CBN ball end mill is verified that the estimated cutting edge shape of rake angle 30 degree has consistent effect on the tool wear and cutting force.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.6 no.6
• /
• pp.560-565
• /
• 2005

This paper deals with the development of manually operated die used for the manufacture of octagonal boxes into two sets of automated die. In particular, theoctagonal boxes are used fur the switch boxes intended fur the cable conduit of buildings or f3r wiring connection. Manufacturing these boxes requires forming the materials using the primary press before they undergo 2nd through 6th processing by the press machine including the four sides of the octagonal outlet box and bending. Such complicated process hikes up labor cost, slows down production, and results in defect rate of $10\%$ or higher; hence the overall rise in manufacturing cost. Moreover, workers avoid this type of work due to the roar and vibration coming from the press and the risk of accident. To eliminate such phenomenon, a CAM die made by integrating five sets of die into one set of die and an automatic conveyor system were developed. As a result, unmanned work was realized with only two units of press and two sets of die; thus solving the problem of work being avoided and saving on manufacturing cost.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.14 no.12
• /
• pp.6060-6065
• /
• 2013

Minimizing the height of the die roll is very important for maximizing the size of effective shear planes. In this study, the die roll change was investigated for the change in the amounts and clearance of the V-ring indentation. Shear analysis and experiments were conducted with the V-ring distance fixed to 2mm. Fine blanking die was applied to the die insert with different clearances. Several specimens were analyzed about the height of the die roll. As a result, the pressure of V-ring effectively inhibited the flow of materials. And the height of the die roll was lowest when the clearance between the die and punch was 1% of the material thickness.