• Transactions of Materials Processing
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• v.27 no.1
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• pp.18-27
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• 2018

As one of the functional metal parts in steam turbine diaphragm assembly, the hollow-partitioned turbine nozzle (stator) has large and thick geometries, as well as an asymmetric configuration. Therefore it is hard to support a metal blank in the die cavity. To ease this situation and control posture and position of metal blank (workpiece), a blank support structure is newly introduced. The blank support structure is basically composed of enlarged arms from the blank, guide pins and linear bearings. It can help to control the intermediate blank without a critical sliding phenomenon. The operation mechanism of this blank support structure, during thick plate forming for the hollow-partitioned turbine nozzle stator, is first evaluated. A series of FEM-based numerical simulations, with respect to the width of the guide arm as geometric design parameters, are carried out to investigate its applicable range. As the results, it is observed the blank support structure for this thick plate forming can guide the workpiece to have stable posture during the plate forming process.

• Journal of Adhesion and Interface
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• v.6 no.4
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• pp.12-17
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• 2005

Natural fiber/phenolic biocomposites with chopped henequen fibers treated at various levels of electron beam irradiation (EBI) were made by means of a matched-die compression molding method. The interfacial property was explored in terms of interfacial shear strength measured by a single fiber microbonding test. The thermal properties were studied in terms of storage modulus, tan ${\delta}$, thermal expansion and thermal stability measured by dynamic mechanical analysis, thermomechanical analysis and thermogravimetric analysis, respectively. The result showed that the interfacial and thermal properties depend on the treatment level of EBI done to the henequen fiber surfaces. The present result also demonstrates that 10 kGy EBI is most preferable to physically modify the henequen fiber surfaces and then to improve the interfacial property of the biocomposite, supporting earlier results studied with henequen/poly (butylene succinate) and henequen/unsaturated polyester biocomposites.

• The Journal of Korean Academy of Prosthodontics
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• v.24 no.1
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• pp.33-43
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• 1986

The purpose of this study was to compare the wear resistance of heat pressure-cured microcomposite(SR-Isosit-N), photo-cured microcomposite(Dentalcolor), unfilled heat-cured resin(Thermojel) and that of human enmel. Specimens were made with specially designed die and finally polished with #3,000 diamond paste. After 100,000 strokes of tooth brushing at electric tooth-brushing machine, mean thickness loss of each specimen was measured by using surface profile and integration. The results were as follows 1. Mean thickness loss were $84.3{\pm}27.3{\mu}m$ in unfiled heat-cured resin, $9.4{\pm}2.5{\mu}m$ in photocured microcomposite, $7.6{\pm}2.1{\mu}m$ in heat.pressure-cured microcomposite and $0.97{\pm}0.42{\mu}m$ in enamel. 2. Heat.pressure-cured microcomposite and photo-cured microcomposite had no difference in mean thickness loss(p>0.05). 3. Unfilled resin and microcomposite had much differences in mean thickness loss (p<0.005). 4. ha resins used in this experiment had too much mean thickness loss as compared with enamel (p<0.005).

• Journal of Applied Reliability
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• v.16 no.1
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• pp.26-31
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• 2016

Purpose: The purpose of this study was to investigate the effect of grinding process and thickness on the fracture strength of silicon die used for semiconductor substrate. Method: Silicon wafers with different thickness from $200{\mu}m$ to $50{\mu}m$ were prepared by chemical mechanical polishing (CMP) and dicing before grinding (DBG) process, respectively. Fracture load was measured by point load test for 50 silicon dies per each wafer. Results: Fracture strength at the center area was lower than that at the edge area of the wafer fabricated by DBG process, while random distribution of the fracture strength was observed for the CMPed wafer. Average fracture strength of DBGed specimens was higher than that of the CMPed ones for the same thickness of wafer. Conclusion: DBG process can be more helpful for lowering fracture probability during the semiconductor fabrication process than CMP process.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.

• Journal of Fashion Business
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• v.23 no.6
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• pp.27-36
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• 2019

This study aimed to analyze the color differences by warp direction of textile mosaics by focusing on two representative textile wallcovering types, woven and string. Mosaics made of string can be expressed as having three-dimensionality based on color differences resulting from the warp direction of the string. String wallcoverings, unlike woven or non-woven wallcoverings, only have vertically oriented warp lamination on the backing paper without weft, and therefore, the reflection and backing color can be expressed differently depending on the angle of the mosaic. In this study, two identical wallcoverings were manufactured using the same materials but using different textile types, woven and string. The wallcoverings underwent die-cutting by each angle and were deployed in cube form. The analysis was based on ISO 5631-1:2015. The color difference between the two wallcoverings, woven and string, was shown as ΔE* 9.29. Based on the standard deviation of the color difference for each mosaic angle, woven ranged from ΔE* 0.09 to 0.94 and string ranged from ΔE* 1.92 to 3.74, showing a larger color difference. Thus, using the color differences of string to create a mosaic wallcovering improved dimensionality.

• Transactions of Materials Processing
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• v.13 no.7
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• pp.586-593
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• 2004

A terminal pin, which is a part of high-voltage capacitors, has a plate-shaped head section with thickness of 0.8mm. The current manufacturing process, in which the head section is welded on the body part, has given wide deviations of part qualities such as geometrical accuracy, mechanical strength and electrical stability. In this study, a cold forging process sequence was designed in order to produce the terminal pin as one piece. The plate-shaped head section requires an upsetting in the lateral direction of a cylindrical billet, which is followed by a blanking process. The deformed geometry of the lateral upsetting, however, could not be predicted precisely by intuition since metal flows of an axial and a lateral direction of the cylindrical billet would occur simultaneously. Therefore, in this study, three dimensional finite element analyses were applied to the lateral upsetting process in order to determine a proper diameter and height of the cylindrical billet. Once the geometry of the initial billet was determined, intermediate forging processes were designed by applying cold forging guidelines and the designed process sequence was verified by two dimensional finite element analysis. In addition, cold forging tryouts were conducted by using a die set, which was manufactured based on the designed process and finally we found that the part qualities were improved by the proposed cold forging process.

• Transactions of Materials Processing
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• v.24 no.3
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• pp.187-193
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• 2015

The objective of the current study is to determine cross-sectional profile of intermediate dies in order to improve the plastic strain homogeneity which directly affects not only the dimensional accuracy but also the mechanical properties of final product by redesigning the intermediate dies using the conventional electric field analysis (EFA) method. Initially, the multi-pass shape wire drawing was designed by using the equivalent potential lines from EFA. The area reduction ratio was calculated from the number of passes in multi-pass shape wire drawing but constrained by the capacity of the drawing machine and the drawing force. In order to compensate for a concentration of strain in a region of the cross section of the wire, the process for multi pass wire drawing from initial round material to an intermediate die was redesigned again using the electric field analysis. Both drawing process designs were simulated by the finite element method in which the strain distribution and standard deviation plastic strain of the cross section of drawn wires were examined.

• Transactions of Materials Processing
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• v.23 no.5
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• pp.317-322
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• 2014

Bursting during tube hydroforming is preceded by localized necking. The retardation of the initiation of necking is a means to enhance hydroformability. Since high strain gradients occur at the necking sites, a decrease in local strain gradients is an effective way to retard the initiation of necking. In the current study, the expansion at potential necking sites was intentionally restricted in order to reduce the strain gradient at potential necking sites. From the strain distribution obtained from FEM, it is possible to determine strain concentrated zones, which are the potential necking sites. Prior to the hydroforming of a trailing arm, an incompressible material(such as lead) is attached to the tube where the strain-concentrated zone would contact the die. Due to the incompressibility of lead, the tube expansion is locally restricted, and the resultant strain extends to adjacent regions of the tube during hydroforming. After the first stage of hydroforming, the lead is removed from the tube, and the hydroforming continues to the final targeted shape without any local restriction. This method was successfully used to fabricate a complex shaped automotive trailing arm that had previously failed during traditional hydroforming fabrication.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.10
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• pp.1971-1981
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• 2002

Two-dimensional solidification analysis during rheology forming process of semi-solid aluminum alloy has been studied. Two-phase flow model to investigate the velocity field and temperature distribution is proposed. The proposed mathematical model is applied to the die shape of the two types. To calculate the velocities and temperature fields during rheology forming process, the each governing equations correspondent to the liquid and solid region are adapted. Therefore, each numerical model considering the solid and liquid coexisting region within the semi-solid material have been developed to predict the defects of rheology forming parts. The Arbitrary Boundary Maker And Cell(ABMAC) method is employed to solve the two-Phase flow model of the Navier-Stokes equation. Theoretical model basis of the two-phase flow model is the mixture rule of solid and liquid phases. This approach is based on using the liquid and solid viscosity. The Liquid viscosity is pure liquid state value, however solid viscosity is considered as a function of the shear rate, solid fraction and power law curves.