• Design & Manufacturing
• /
• 제14권1호
• /
• pp.1-7
• /
• 2020

In this study, the variation of the shrinkage in the thickness direction of the molded parts according to the gate size of the polymer core fabricated through the 3D printer using the SLS method was studied. The polymer cores are laser sintered and the powder material is nylon base PA2200. The polymer cores have lower heat transfer rate and rigidity than the metal core due to the characteristics of the material. Therefore, the injection molding test conditions are set to minimize the deformation of the core during the injection process. The resin used in the injection molding test is a PP material. The packing condition was set to 80, 90 and 100% of the maximum injection pressure for each gate size. The runner diameter used was ∅3mm, and the gates were fabricated in semicircle shapes with cross sections 1, 2, and 3 ㎟, respectively. Thickness measurement was performed for 10 points at 2.5 mm intervals from the point 2.5 mm away from the gate, and the shrinkage to thickness was measured for each point. The shrinkage rate according to the gate size tends to decrease as the cross-sectional area decreases as the maximum injection pressure increases. The average thickness shrinkage rate was close to 0% when the packing pressure was 90% for the gate area of 1mm2. When the holding pressure was set to 100%, the shrinkage was found to decrease by 3% from the standard dimension due to the over-packing phenomenon. Therefore, the smaller the gate, the more closely the molded dimensions can be molded due to the high pressure generation. It was confirmed that precise packing process control is necessary because over-packing phenomenon may occur.

• Design & Manufacturing
• /
• 제13권4호
• /
• pp.10-16
• /
• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• 대한기계학회논문집A
• /
• 제25권9호
• /
• pp.1438-1443
• /
• 2001

The significance of the casting/forging process for reducing the production cost of large components is being noted in these days. This casting/forging process is a method of forging a workpiece preformed by casting into the final shape. In this study, the casting/forging process has been applied in manufacturing a large aluminum flange in order to reduce press capacity and material cost. Firstly, a hot compression test was performed with cast cylindrical billets in order to determine the optimum forging condition of the aluminum flange. The optimum range of forging temperature of Al 5083 was from 420$\^{C}$ to 450$\^{C}$. The suitable strain rate was 1.5 sec(sup)-1. The deformation amount of a preform of a preform in a forging process is a key role in the mechanical properties of casting/forging products. In order to find the change of mechanical properties according to effective stain of cast aluminum billets, a hot upsetting test were performed with rectangular blocks and then a uniaxial tensile test was performed with specimens cut from the upsetted billets. The tensile strength and the elongation of cast/upsetted aluminum billets were increased largely until the effective strain was 0.7. FE analysis was performed to determine the configurations of case preform and die for an aluminum flange. In the FE analysis, the forging load-limit was fixed 1500ton for low equipment cost. The cast preform was designed so that the effective stain around the neck of a flange exceeded 0.7. From the result of FE analysis, optimal configurations of the cast preform and the die were designed for a large flange. The filling and solidification analysis for a sound cast-preform was carried out with MAGMA soft. In the forging experiment for an aluminum flange, it was confirmed that the optimal configuration of the cast preform predicted by FE analysis was very useful. The cast/forged products using designed preform were made perfectly without any defects.

• 마이크로전자및패키징학회지
• /
• 제20권3호
• /
• pp.31-35
• /
• 2013

TSOP(Thin Small Outline Package)는 가전제품, 자동차, 모바일, 데스크톱 PC등을 위한 저렴한 비용의 패키지로, 리드 프레임을 사용하는 IC패키지이다. TSOP는 BGA와 flip-chip CSP에 비해 우수한 성능은 아니지만, 저렴한 가격 때문에 많은 분야에 널리 사용되고 있습니다. 그러나, TSOP 패키지에서 몰딩공정 할 때 리드프레임의 열적 처짐 현상이 빈번하게 일어나고, 반도체 다이와 패드 사이의 Au 와이어 떨어짐 현상이 이슈가 되고 있다. 이러한 문제점을 해결하기 위해서는 리드프레임의 구조를 개선하고 낮은 CTE를 갖는 재료로 대체해야 한다. 본 연구에서는 열적 안정성을 갖도록 리드프레임 구조 개선을 위해 수치해석적 방법으로 진행하였다. TSOP 패키지에서 리드프레임의 열적 처짐은 반도체와 다이 사이의 거리(198 um~366 um)에서 안티-디플렉션의 위치에 따라 시뮬레이션을 진행하였다. 안티-디플렉션으로 TSOP 패키지의 열적 처짐은 확실히 개선되는 것을 확인 했다. 안티-디플렉션의 위치가 inside(198 um)일 때 30.738 um 처짐을 보였다. 이러한 결과는 리드프레임의 열적 팽창을 제한하는데 안티-디플렉션이 기여하고 있기 때문이다. 그러므로 리드프레임 패키지에 안티-디플렉션을 적용하게 되면 낮은 CTE를 갖는 재료로 대체하지 않아도 열적 처짐을 향상시킬 수 있음을 기대할 수 있다.

• Design & Manufacturing
• /
• 제15권2호
• /
• pp.23-29
• /
• 2021

The specific strength of magnesium alloy is four times that of iron and 1.5 times that of aluminum. For this reason, its use is increasing in the transportation industry which is promoting weight reduction. At room temperature, magnesium alloy has low formability due to Hexagonal closed packed (HCP) structure with relatively little slip plane. However, as the molding temperature increases, the formability of the magnesium alloy is greatly improved due to the activation of other additional slip systems, and the flow stress and elongation vary greatly depending on the temperature. In addition, magnesium alloys exhibit asymmetrical behavior, which is different from tensile and compression behavior. In this study, a jig was developed that can measure the plane deformation behavior on the surface of a material in tensile and compression tests of magnesium alloys in warm temperature. A jig was designed to prevent buckling occurring in the compression test by applying a certain pressure to apply it to the tensile and compression tests. And the tensile and compressive behavior of magnesium at each temperature was investigated with the developed jig and DIC equipment. In each experiment, the strain rate condition was set to a quasi-static strain rate of 0.01/s. The transformation temperature is room temperature, 100℃. 150℃, 200℃, 250℃. As a result of the experiment, the flow stress tended to decrease as the temperature increased. The maximum stress decreased by 60% at 250 degrees compared to room temperature. Particularly, work softening occurred above 150 degrees, which is the recrystallization temperature of the magnesium alloy. The elongation also tended to increase as the deformation temperature increased and increased by 60% at 250 degrees compared to room temperature. In the compression experiment, it was confirmed that the maximum stress decreased as the temperature increased.

• 한국철도학회논문집
• /
• 제13권2호
• /
• pp.147-151
• /
• 2010

충돌에너지는 다이에 의해 확관되는 팽창튜브의 소성변형에너지로 흡수된다. 충돌에너지를 성공적으로 흡수하기 위하여 튜브가 팽창되는 동안 좌굴이 발생해서는 안 된다. 팽창튜브의 좌굴불안전성은 초기경계조건과 튜브 두께 그리고 길이에 영향을 받는다. 본 연구는 동적 축 하중을 받는 팽창튜브의 좌굴을 예측하기 위한 경계조건의 결정, 기하학적 결함의 적용 그리고 재료의 비선형성과 동적효과를 적용하는 일련의 해석방법 및 절차를 제안하였다. 또한, 기하학적 결함의 적용이 튜브의 좌굴하중과 좌굴형상에 미치는 영향을 유한요소해석 결과를 통하여 분석하였고 튜브두께와 기하학적 결함의 상관관계를 연구하였다. 해석결과 기하학적 결함과 튜브의 좌굴형상은 밀접한 관계가 있었고 튜브의 두께가 작으면 기하학적 결함에 상관없이 좌굴하중은 변하지 않았다. 하지만, 두께가 증가할 경우 결함율이 증가하면 좌굴하중이 감소하는 경향을 보였다.

• 대한기계학회논문집A
• /
• 제34권10호
• /
• pp.1479-1485
• /
• 2010

최근 와이어의 생산성 및 고강도화를 위한 고탄소강의 고속신선으로 인해 와이어 표면의 급격한 온도상승으로 잔류응력이 크게 증가하는 문제점이 발생되고 있다. 와이어의 다단 신선 공정시에는 소성변형과 마찰열에 의하여 와이어 내부의 온도가 더욱 크게 상승하게 된다. 특히, 고속 신선의 경우 마찰에 의한 온도구배가 더욱 크게 되어 와이어 표면층에 축방향 인장 잔류응력을 과도하게 발생시킨다. 따라서, 본 연구에서는 먼저 표면 온도 상승과 축방향 잔류응력과의 관계를 규명한 다음에 와이어의 평형온도 예측 모델을 제안하고, 이를 토대로 표면 온도 상승에 의한 축방향 잔류응력 예측식을 개발하였다. 고탄소강(0.82%C)소재의 다단신선 실험을 통해 얻어진 시편에 대하여 X 선 회절을 이용하여 잔류응력을 측정하여 제안된 예측식을 검증하였다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2001년도 춘계학술대회 논문집
• /
• pp.905-909
• /
• 2001

The significance of casting/forging process for reducing the production cost of large components is being noted in these days. This casting/forging process is a method of forging a workpiece preformed by casting into the final shape. In this study, the casting/forging process has been applied in manufacturing a large aluminum flange in order to determine the optimum forging condition of the aluminum flange. The optimum range of forging temperature of Al 5083 was from $420^{\circ}C$ to $450^{\circ}C$. The suitable strain rate was 1.5 $sec^{-1}$. The deformation amount of a preform in a forging process is key role in the mechanical properties of casting/forging products. In order to find the change of mechanical properties according to effective stain of cast aluminum billets, a hot upsetting test were performed with rectangular blocks and then a uniaxial tensile test was performed with specimens cut from the upsetted billets. The tensile strength and the elongation of cast/upsetted aluminum billets were increased largely until the effective strain was 0.7. FE analysis was performed to determine the configurations of cast preform and die for an aluminum flange. In the FE analysis, the forging load-limit was fixed 1500ton for the low equipment cost. The cast preform was designed so that the effective stain around the neck of a flange exceeds 0.7. In the forging experiment for an aluminum flange, it was confirmed that the optimal configuration of the cast preform predicted by FE analysis was very useful. The cast/forged products using designed preform were made perfectly without any defects.

• 대한기계학회논문집A
• /
• 제27권10호
• /
• pp.1793-1799
• /
• 2003

An optimal design of a multi-layered plate structure to endure high-velocity impact has been suggested by using size optimization after numerical simulations. The NET2D, a Lagrangian explicit time-integration finite element code for analyzing high-velocity impact, was used to find the parameters for the optimization. Three different materials such as mild steel, aluminum for a multi-layered plate structure and die steel for the pellet, were assumed. In order to consider the effects of strain rate hardening, strain hardening and thermal softening, Johnson-Cook model and Phenomenological Material Model were used as constitutive models for the simulation. It was carried out with several different gaps and thickness of layers to figure out the trend in terms of those parameters' changes under the constraint, which is against complete penetration. Also, the measuring domain has been shrunk with several elements to reduce the analyzing time. The response surface method based on the design of experiments was used as optimization algorithms. The optimized thickness of each layer in which perforation does not occur has been obtained at a constant velocity and a designated total thickness. The result is quite acceptable satisfying both the minimized deformation energy and the weight criteria. Furthermore, a conceptual idea for topology optimization was suggested for the future work.

• 한국정밀공학회지
• /
• 제23권4호
• /
• pp.153-161
• /
• 2006

Micro-forming is a suited technology to manufacture very small metallic parts(several $mm{\sim}{\mu}m$). Micro-forming of $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk metallic glass(BMG) as a candidate material for this developing process are feasible at a relatively low stress in the supercooled liquid state without any crystallization during hot deformation. In this study, micro- formability of a representative bulk metallic glass, $Zr_{62}Cu_{17}Ni_{13}Al_8$. was investigated for micro-forging of U-shape pattern. Micro-formability was estimated by comparing $R_f$ values ($=A_f/A_g$), where $A_g$ is cross-sectional area of U groove, and $A_f$ the filled area by material. Micro-forging process was simulated and analyzed by applying finite element method. FEM simulation results showed reasonable agreement with the experimental results when the material properties and simulation conditions such as top die speed, remeshing criteria and boundary conditions were tightly controlled. The micro-formability of $Zr_{62}Cu_{17}Ni_{13}Al_8$ was increased with increasing load and time in the temperature range of the supercooled liquid state. Also, FEM simulation using a commercial software, DEFORM was confirmed to be applicable for the optimization of micro-forming process.