• 제목/요약/키워드: Diamond etching

검색결과 101건 처리시간 0.025초

변형 에너지가 나노압입 유기 Hillock 현상에 미치는 영향 (Effect of Deformation Energy on the Indentation Induced Etch Hillock)

  • 김현일;윤성원;강충길
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 춘계학술대회 논문집
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    • pp.225-228
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    • 2005
  • The purpose of this study is to investigate effects of the plastic/elastic deformation energy on wet etching characterization on the surface of material by using the nanoindentation and HF wet etching technique. Indents were made on the surface of Pyrex 7740 glass by the hyperfine indentation process with a Berkovich diamond indenter, and they were etched in $50\;wt\%$ HF solution. After etching process, convex structure was obtained due to the deformation-induced hillock phenomena. In this study, effects of indentation process parameters (normal load, loading rate) on the morphologies of the indented surfaces after isotopic etching were investigated from an angle of deformation energies.

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Effect of Hydrogen Radicals for Ion Implanted CVD Diamond Using Remote Hydrogen Plasma Treatment(RHPT)

  • Won, Jaihyung;Hatta, Akimitsu;Yagi, Hiromasa;Wang, Chunlei;Jiang, Nan;Jeon, Hyeongmin;Deguehi, Masahiro;Kitabatake, Makoto;Ito, Toshimichi;Sasaki, Takatomo;Hiraki, Akio
    • The Korean Journal of Ceramics
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    • 제4권1호
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    • pp.15-19
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    • 1998
  • Defects formation of Chemical Vapor Deposition (CVD) diamond on $^4He^{2+}$ irradiation and after remote hydrogen plasma treatment(RHPT) were investigated by cathodoluminescence(CL). As calculated in the TRIM simulation, the light elements of $^4He^{2-}$ can be penetrated into the diamond bulk structure at 3~4 $\mu\textrm{m}$ depth. The effects of the implantation region were observed when 5 keV~20 keV electron energy (insight 0.3~4.0$\mu\textrm{m}$) of CL measurement was irradiated to diamond at temperature 80 K. After the RHPT, rehybridization of irradiation damaged diamond was studied. The intensity of 5RL center(intrinsic defect of C) was diminished. The 2.16 eV center (N-V center) occurring usually by annealing could not be seen after RHPT. The diamond was rehybridized by hydrogen radicals without etching and thermal degradation by the RHPT.

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다이어몬드 공구를 이용한 Ni 도금층의 정밀미세가공 시 절삭성 (Machinability in Micro-precision Machining of Ni-Plated Layer by Diamond Tool)

  • 김선아;박동삼
    • 한국생산제조학회지
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    • 제18권6호
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    • pp.636-641
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    • 2009
  • Recently, expansion of micro-technology parts requires micro-precision machining technology. Micro-groove machining is important to fabricate micro-grating lens and many micro-parts such as microscope lens, fluidic graphite channel etc. Conventional groove fabrication methods such as etching and lithography have some problems in efficiency and surface integrity. But, mechanical micromachining methods using single crystal diamond tools can reduce these problems in chemical process. For this reason, microfabrication methods are expected to be very efficient, and widely studied. This study deals with machinability in micro-precision V-grooves machining of nickel plated layer using non-rotational single crystal diamond tool and 3-axis micro stages. Micro V-groove shape, chip formation and tool wear were investigated for the analysis of machinability of Ni plated layer.

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Effect of Oxygen for Diamond Film Synthesis with C-Hexane in Microwave Plasma Enhanced CVD Process

  • Han, Sang-Bo
    • Journal of Electrical Engineering and Technology
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    • 제7권6호
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    • pp.983-989
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    • 2012
  • The purpose of this paper is to decide the optimum synthesis conditions of polycrystalline diamond films according to the ratio of gas mixture. Diamond films were deposited with cyclo-hexane as a carbon precursor by the microwave plasma enhanced chemical vapor deposition process. The optimum oxygen ratio to cyclo-hexane was reached about 125 % under the fixed 0.3% c-hexane in hydrogen. Oxygen plays a role in etching the graphitic components of carbon sp2 bond effectively. By OES measurement, the best synthesis conditions found out about 12.5 % and 15.75 %, which is the emission intensity ratios of CH(B-X) and $H{\beta}$ on $H{\alpha}$, respectively. Also, the electron temperature was similar about 5,000 to 5,200 K in this work.

나노스크래치와 HF 식각을 병용한 보로실리케이트 요/철형 구조체 패턴 제작 기술 (Fabrication Technique of Nano/Micro Pattern with Concave and Convex Structures on the Borosilicate Surface by Using Nanoscratch and HF etching)

  • 윤성원;강충길
    • 한국정밀공학회지
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    • 제21권4호
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    • pp.24-31
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    • 2004
  • The objective of this work is to suggest a mastless pattern fabrication technique using the combination of machining by Nanoindenter(equation omitted) XP and HF wet etching. Sample line patterns were machined on a borosilicate surface by constant load scratch (CLS) of the Nanoindenter(equation omitted) XP with a Berkovich diamond tip, and they were etched in HF solution to investigate chemical characteristics of the machined borosilicate surface. All morphological data of scratch traces were scanned using atomic force microscope (AFM).

수소-산소아세틸렌 연소염에 의한 다이아몬드 필름의 증착 (Deposition of Diamond Film by Hydrogen-oxyacetylene Combustion Flame)

  • 고찬규;김기영;박동화
    • 공업화학
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    • 제8권1호
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    • pp.84-91
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    • 1997
  • 대기압하에서 수소를 첨가한 연소염장치를 이용하여 몰리브덴 기판 위에 다이아몬드 필름을 증착시켰다. 기판 온도의 증가에 따라 핵생성밀도가 증가하였으며, $1000^{\circ}C$ 이상에서는 흑연화되고 이것이 수소 원자에 의해 에칭되었다. $C_2H_2/O_2$ 유량비를 증가시킬수록 핵생성밀도는 증가하였지만 결정형태가 구형화되며 비정질카본이 많이 증착되었다. $H_2$를 첨가하면, 표면 활성도가 향상되어 다이아몬드 핵생성밀도가 증가되었으며, 비정질카본을 에칭시켜 우수한 결정성의 다이아몬드 필름을 얻을 수 있었다. 증착시간을 증가시키면 다이아몬드 필름의 두께가 증가하였다.

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삭제기구가 자가 산부식 접착제의 미세누출에 미치는 영향 (EFFECT OF MICROLEAKAGE OF A SELF-ETCHING PRIMER ADHESIVE ACCORDING TO TYPES OF CUTTING INSTRUMENTS)

  • 김용희;박재구;조영곤
    • Restorative Dentistry and Endodontics
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    • 제32권4호
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    • pp.327-334
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    • 2007
  • 이 연구는 서로 다른 카바이드 버와 다이아몬드 버로 5급 와동을 형성 한 후 SE primer 접착 시스템인 Clearfil SE Bond를 이용한 복합레진 수복 시 버의 종류에 따른 법랑질과 상아질 변연에서의 미세누출 차이를 상호 비교하기 위하여 시행하였다. 4종의 삭제기구를 이용하여 각각 10개의 발거된 대구치의 협면 치경부에 5급 와동을 형성하였다. 1군은 plain-cut carbide fissure bur (no. 245)를 사용한 군, 2군은 cross-cut carbide fissure bur (no. 557)를 사용한 군, 3군은 fine diamond bur (TF-21F: 입자크기 $53\;-\;63\;{\mu}m$)를 사용한 군, 4군은 standard diamond bur (EX-41: 입자크기 $106\;-\;205\;{\mu}m$)를 사용한 군으로 분류하였다. 형성된 와동에 Clearfil SE Bond의 Primer와 Bond를 적용하고 Clearfil AP-X 복합레진을 충전하여 광중합한 후, Sof-Lex disc를 이용하여 마무리와 연마를 시행하였다. 수복된 치아를 2% methylene blue 용액에 24시간 동안 침적시킨 후 각 군의 치아를 협설로 절단하여 광학 입체현미경 하에서 법랑질과 상아질 변연에서의 미세누출 점수를 평가하여 다음과 같은 결과를 얻었다. Clearfil SE Bond와 복합레진을 이용한 5급 와동 수복 시 거친 다이아몬드 버의 사용은 카바이드 버나 미세한 다이아몬드 버에 비해 법랑질과 상아질 변연 모두에서 높은 미세누출을 나타내었다.

법랑질에 대한 total etching과 self-etching 접착제의 산부식 효과와 미세인장결합강도 (THE ETCHING EFFECTS AND MICROTENSILE BOND STRENGTH OF TOTAL ETCHING AND SELF-ETCHING ADHESIVE SYSTEM ON UNGROUND ENAMEL)

  • 오선경;허복;김현철
    • Restorative Dentistry and Endodontics
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    • 제29권3호
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    • pp.273-280
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    • 2004
  • The purpose of this study was to evaluate the etching effects and bond strength of total etching and self-etching adhesive system on unground enamel using scanning electron microscopy and microtensile bond strength test. The buccal coronal unground enamel from human extracted molars were prepared using low-speed diamond saw. Scotchbond Multi-Purpose (group SM). Clearfil SE Bond (group SE), or Adper Prompt L-Pop (group LP) were applied to the prepared teeth. and the blocks of resin composite (Filtek Z250) were built up incrementally. Resin tag formation was evaluated by scanning electron microscopy. after removal of enamel surface by acid dissolution and dehydration. For microtensile bond strength test. resin-bonded teeth were sectioned to give a bonded surface area of $1\textrm{mm}^2$. Microtensile bond strength test was perfomed. The results of this study were as follows. 1. A definite etching pattern was observed in Scotchbond Multi-Purpose group. 2. Self-etching groups were characterized as shallow and irregular etching patterns. 3. The results (mean) of microtensile bond strength were SM: 26.55 MPa, SE: 18.15 MPa, LP: 15.57 MPa. SM had significantly higher microtensile bond strength than 8E and PL (p < 0.05). but there was no significant differance between SE and PL.

RF-PECVD법에 의해 합성된 DLC 박막에 대한 plasma etching의 영향에 대한 연구 (Effect of plasma etching on DLC films prepared by RF-PECVD method)

  • 오창현;윤덕용;박용섭;조형준;최원석;홍병유
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 추계학술대회 논문집
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    • pp.315-315
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    • 2007
  • 본 논문에서는 DLC (Diamond-like carbon)박막이 가지는 높은 경도, 낮은 마찰계수, 전기적 절연성, 화학적 안정성 등의 특성을 이용하여, 리소그래피를 위한 resist나 hard coating물질로써 응용하기 위해, DLC 박막의 에칭에 관한 연구를 진행하였다. DLC 박막의 합성 과 에칭은 13.56 MHz RF plasma enhanced vapor deposition technique를 통해 이루어졌으며, DLC 박막은 150 W의 RF Power에서 메탄 $(CH_4)$과 수소$(H_2)$ 가스를 이용하여 약 300 nm의 두께로 제작되었으며, DLC박막의 에칭은 RF power의 변화 (50~250 W)와 산소 $(O_2)$가스의 유량변화 (5~25 sccm)에 따라 실시하였다. 에칭 되어진 DLC 박막의 표면 특성들은 AFM (atomic force microscopy)과 contact angle 장치를 사용하여 측정되었고, 측정된 결과로써 DLC 박막은 RF power와 산소 가스의 유량이 높을수록 etching rate는 증가하였고, 박막의 표면은 거칠어졌으며, 결국 DLC 표면에서는 산소에 의한 결합의 증가로 인해 친수성을 나타내었다.

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마이크로 V홈 연삭가공을 위한 다이아몬드숫돌의 V형상 트루잉에 관한 연구 (A Study on the Truing of Diamond Wheel for Micro V-shaped Groove Grinding)

  • 이주상
    • 한국정밀공학회지
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    • 제22권9호
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    • pp.27-33
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    • 2005
  • This study deals with the truing of diamond wheel fur the manufacture of micro v-shaped grooves with fine sharp edges in the grinding. Fine micro v-shaped grooves are key components to fabricate LGP(light guide plate), optical fiber connector and so on. Conventional v-shaped groove methods such as etching and lithography are difficult to make grooves with accuracy and cutting by lathe is difficult to select target materials. Therefore, as a preliminary stage to developing the grinding technology that will be expected fabrications for micro 3-dimensional structure of high effectivity and accuracy and freed up the restrictions of machinability to the materials for micro v-shaped grooves, truing is carried out with resin bond diamond wheel and electroforming diamond wheel using a cup-type truer. From the experimental results, it is found that the effects according to working direction of the cup-type truer and the restrainable methods of plastic deformation that is generated at wheel edge are examined. As a result, fine micro v-shaped diamond wheel was obtained, which are applicable to micro grinding for optical devices.