• Journal of the Korean institute of surface engineering
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• v.54 no.5
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• pp.207-212
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• 2021

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizing the performance degradation to the bonding surface to the inorganic compound or the oxide film etc. The surface was treated in a ultrasonic washer using a diamond abrasive to remove other component substances from the prepared cast plate substrate surface. FE-SEM was used to analyze the bonding characteristics of the bonded copper substrates, and the cross section of the bonded Cu conjugates at the sintering junction temperature of 100 ℃, 150 ℃, 200 ℃, 350 ℃ and the pressure of 2303 N/cm² and 3087 N/cm². At 2303 N/cm², the good bonding of copper substrate was confirmed at 350 ℃, and at the increased pressure of 3087 N/cm², the bonding condition of Cu was confirmed at low temperature junction temperature of 200 ℃. However, the recrystallization of Cu particles was observed due to increased pressure of 3087 N/cm² and diffusion of Cu atoms at high temperature of 350 ℃, which can lead to degradation in semiconductor manufacturing.

• Restorative Dentistry and Endodontics
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• v.13 no.2
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• pp.323-334
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• 1988

The purpose of this study was to observe the effect of dentin surface conditioners on the dentin surfaces. Freshly extracted human molars were used in this study. They were stored at $4^{\circ}C$ saline solution before experiment. The crown portions of the teeth were cut in various directions by means of wet diamond point to expose dentin which include transverse, vertical oblique, horizontal and oblique cut to the long axis (Fig. 1). Each tooth was then mounted with self curing acrylic resin in brass ring to expose the flattened dentin surfaces. Final finish was accomplished by grinding the dentin specimens with wet No. 180 and No. 600 grit silicon carbide abrasive paper until a 6.0mm in diameter on a dentin surface was exposed without pulp exposure. The specimens were divided into 9 groups according to the modes of dentin treatment procedure. The following surface treatments were applied on these preparation surfaces; Group 1: unetched (control group) after finish with No. 600 silicon carbide abrasive paper. Group 2: etched with 30% phosphoric acid for 60s Group 3: etched with 10-3 solution for 60s Group 4: Cleaned with 5% NaOCl for 30s Group 5: applied Dentin Adhesit Group 6: cleaned with 5% NaOCl followed by applying the Dentin Adhesit$^{(R)}$ Group 7: applied Photo Bond on the unetched dentin followed by applying the Photo Clearfil Bright Group 8: Etched with 30% phosphoric acid followed by applying Photo Bond and Photo Clearfil Bright Group 9: etched with 10-3 solution followed by applying Photo Bond and Photo Clearfil Bright All the specimens were stored in $37^{\circ}C$ under 50% relative humidity for 24 hours before observations. The specimens in 7, 8, and 9 group, omitting the group 1 to 6, were demineralized in 10% HCl for 10s in order to observe the resin tags. All the specimens in each group were then dried at room temperature. The dried specimens were ion coated with Eiko ion coater (Eiko-engineering Co.), and observed in Hitachi S-430 Scanning electron microscope (Hitachi, Co. Tokyo) at 15KV. The following results were obtained as follows; 1. The smear layers were still remained in group 1,2,4,5, and 6. 2. There is no effect of 5% NaOCl and 30% phosphoric acid on the changes of dentin morphology 3. The dentin treated with 10-3 solution, indicating the tubules opened when the smear layer and the dental plug dissolved. 4. In case of applying the bonding agents the resin tag was not formed at the deep area of dentinal tubules, but in case of applying the Dentin Adhesit$^{(R)}$ that was not.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.5
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• pp.301-306
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• 2017

Wire electrical discharge machining (WEDM) process was evaluated to slice Silicon (Si) for various applications. Specifically, various Si workpieces with various resistances, such as single and multi crystalline Si bricks and wafers were used. As conventional slicing processes, such as slurry-on or diamond-on wire slicing, are based on mechanical abrasions between Si and abrasive, there is a limitation to decrease the wafer thickness as well as kerf-loss. Especially, when the wafer thickness is less than $150{\mu}m$, wafer breakage increases dramatically during the slicing process. Single crystalline P-type Si bricks and wafers were successively sliced with considerable slicing speed regardless of its growth direction. Also, typical defects, such as microcracks, craters, microholes, and debris, were introduced when Si was sliced by electrical discharge. Also, it was found that defect type is also dependent on resistance of Si. Consequently, this study confirmed the feasibility of slicing single crystalline Si by WEDM.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.545-545
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• 2008

Poly-Si is an essential material for floating gate in NAND Flash memory. To fabricate this material within region of floating gate, chemical mechanical polishing (CMP) is commonly used process for manufacturing NAND flash memory. We use colloidal silica abrasive with alkaline agent, polymeric additive and organic surfactant to obtain high Poly-Si to SiO2 film selectivity and reduce surface defect in Poly-Si CMP. We already studied about the effects of alkaline agent and polymeric additive. But the effect of organic surfactant in Poly-Si CMP is not clearly defined. So we will examine the function of organic surfactant in Poly-Si CMP with concentration separation test. We expect that surface roughness will be improved with the addition of organic surfactant as the case of wafering CMP. Poly-Si wafer are deposited by low pressure chemical vapor deposition (LPCVD) and oxide film are prepared by the method of plasma-enhanced tetra ethyl ortho silicate (PETEOS). The polishing test will be performed by a Strasbaugh 6EC polisher with an IC1000/Suba IV stacked pad and the pad will be conditioned by ex situ diamond disk. And the thickness difference of wafer between before and after polishing test will be measured by Ellipsometer and Nanospec. The roughness of Poly-Si film will be analyzed by atomic force microscope.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.44 no.4
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• pp.16-24
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• 2012

To characterize the coating structure, diverse methods such as mercury intrusion, nitrogen adsorption and oil absorption methods have been developed and widely employed. These indirect techniques, however, have some limitation to explain the actual coating structure. Recently microscopic observation methods have been tried for analyzing structural characteristics of coating layers. Preparation of the undamaged cross section of a coating layer is essential for obtaining high quality image for analysis. In this study, distortion-free cross-section of the coating layer was prepared using a grinding and polishing technique. The coated paper was embedded in epoxy resin and cured. After curing the resin block it was ground with abrasive papers and then polished with diamond particle suspension and nylon cloth. Polished coating layer was sufficient enough to obtain undamaged cross sectional images with scanning electron microscope under backscattered electron image mode. In addition, the SEM images allowed distinction of the coating layer components. Also S/B latex film formed between pigment particles was visualized by osmium tetroxide staining. Pore size distribution and pore orientation were evaluated by image analysis from SEM cross-sectional images.

• Geomechanics and Engineering
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• v.31 no.3
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• pp.249-263
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• 2022

The specially-shaped Polycrystalline Diamond Compact (PDC) cutter is widely used in drill bit design due to its advantages of high rock cutting efficiency, strong impact resistance and long service life in hard and abrasive formation drilling. A detailed understanding of rock cutting behavior of worn specially-shaped PDC cutter is essential to improve the drilling efficiency and decrease the drilling costs. In this paper, the theoretical models of two new principles (loading performance (LP) and cutting performance (CP)) are derived for evaluating the cutting process of worn specially-shaped cutter, the theoretical models consider the factors, such as cutter geometry, aggressiveness, stress state, working life, and rock cutting efficiency. Besides, the numerical model of heterogeneous granite is developed using finite element method combined with Voronoi tessellation, the LP and CP of 12 kinds of worn specially-shaped PDC (SPDC) cutters are analyzed. The results found that the mechanical specific energy (MSE) of worn cutters first increase and then decrease with increasing the cutting depth, and the MSE increase with the increase of back rake angle except for Conical cutter and Wedge-shaped cutter. From the perspective of CP, the worn PDC cutters are more suitable for the smaller cutting depths, and the back rake angle has little effect on the CP of the specially-shaped worn PDC cutters. Conical cutter, Saddle-shaped cutter and Ellipse-shaped cutter have the highest CP value, while Rhombus-shaped cutter, Convex cutter and Wedge-shaped cutter have the lowest value in selecting cutters. This research leads to an enhanced understanding of rock-breaking mechanisms of worn SPDC cutters, and provides the basis to select of specially-shaped PDC cutters for the specific target formation.

• The korean journal of orthodontics
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• v.31 no.6 s.89
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• pp.567-578
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• 2001

To investigate the difference of Texture exhibited on interproximal enamel surface with each different stripping method and the susceptibility of proximal enamel to demineralization after stripping and the application of a topical fluoride go] and sealant, one hundred human premolars, which were Previously extracted for orthodontic reasons were evaluated by means of Scanning electron microscopy and laser fluorescence. The results were as follows : 1. No matter what the initial stripping instrument was the furrows that resulted from all the stripping methods were not completely removed by careful polishing. 2. Among the enamel surfaces that were treated with three different initial abrasive instruments, followed by the same polishing method (Sof-$Lex^{(r)}$ disks), the enamel surfaces that were treated with 700 crosscut carbide bur showed the smoothest surfaces. 3. The stripped teeth, no matter what the initial stripping instrument was, were less resistant to initial demineralization than untreated teeth. But no difference in caries susceptibility according to differently stripped methods was found (p<(0.001). 4. Teeth treated with APF-gel or sealant were mote resistant to demineralization than those treated without other treatment after stripping (p<0.001). 5. Comparing groups treated with APF-gel to groups treated with sealant, the former was more resistant to demineralization than the tatter (p<0.05). In conclusion, enamel surfaces that were stripped jnterproximally were less resistant to demineralization even though various attempts were made to produce smooth, self-cleaning enamel surfaces. Therefore, additional treatment-sealant or calcifying/ fluoridating solution To the stripped enamel surfaces is recommended.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.6
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• pp.383-388
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• 2019

High purity SiC fine powder with metal impurity contents of less than 1 ppm was synthesized by improved carbothermal reduction process, and the synthesized powder was used for SiC single crystal growth in RF heating PVT device at temperature above 2,100℃. In-situ x-ray image analyzer was used to observe the sublimation of the powder and single crystal growth behavior during the growth process. SiC powder was used as a source of single crystal growth, exhausted from the outside of the graphite crucible at the growth temperature and left graphite residues. During the growth, the flow of raw materials was concentrated in the middle and influenced the growth behavior of SiC single crystals. This is due to the difference in temperature distribution inside the crucible due to the fine powder. After the single crystal growth was completed, the single crystal ingot was cut into a 1 mm thick single crystal substrate and finely polished using a diamond abrasive slurry. A dark yellow 4H-SiC was observed overall of single crystal substrate, and the polycrystals generated in the outer part may be caused by the incorporation of impurities such as the bubble layer mixed in the process of attaching the seed crystal to the seed holder.

• Restorative Dentistry and Endodontics
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• v.28 no.1
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• pp.89-99
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• 2003

The purpose of this study was to investigate the bonding of resin- based root canal sealer, AH26 when the sealer was applied as a thin layer between dentine and gutta-percha surface. In this study forty non-caries extracted human molars and resin-based root canal sealer(AH 26, DeTrey/Dentsply, Germany) were used. Disks of gutta-percha, 6mm in diameter.6mm thick (Diadent/Dentsply, Korea) for thermoplastic obturation were used and dentin surfaces were treated with 2% NaOCl(Group 1) or 2%NaOCl+17% EDTA(Group 3). Disks of gutta-Percha, 6mm in diameter.6mm thick (Diadent/Dentsply, Korea) for conventional obturation were used and dentin surface were treated with 2% NaOCl(Group 2) or 2%NaOCl+17% EDTA(Group 4). Enamel was removed by a horizontal section 1mm below the deepest portion of the central occlusal groove by using a watercooled low speed diamond saw. A second horizontal section was done around cementoenamel junction. Exposed dentin surface was cut to approximately $8{\times}8{\;}mm$ rectangular shape and was ground against 320, 400, 600 grade silicon carbide abrasive paper serially. After grinding, the dentine surface were soaked in a solution of 2% NaOCl for 30 minutes and twenty of specimens were treated with 17% EDTA solution for 1 minute. The treated specimens were washed and dried, Root canal sealer, AH26 was prepared according to the manufacture's instructions The Gutta-percha and dentin surface were coated with a thin layer of the freshly mixed seal or. The specimens were left overnight at room temperature. After their initial set, they were transferred to an incubator at $37$^{\circ}C$ for 72 h. After 72 hours, resin blocks were made. The resin block was serially sectioned vertically into stick of $1{\cdot}1mm$. Twenty sticks were prepared from each group. After that, tensile bond strength f3r each stick was measured with Microtensile Tester Failure patterns of the specimens at the interface between gutta-percha and dentin were observed under the SEM(x1000) and Stereomicroscope (LEICA M42O, Meyer Inst., TX U.S.A) at 1.25 x25 magnification. The results were statistically analysed by using a One-way ANOVA and Tukey's test. The results were as follows; 1. Tensile bond strengths($mean{\pm}SD$) were expressed with ascending order as follows: Group 1, $3.09{\pm}$ 1.05Mpa : Group 2, $6.23{\pm}1.16MPa$ : Group 3, $7.12{\pm}1.07MPa$ : Group 4, $10.32{\pm}2.06MPa$. 2. Tensile bond strengths of the group 2 and 4 used disks of gutta-percha for conventional obturation were significantly higher than that of the group 1 and 3 used fir thermoplastic obturation. (p < 0.05). 3. Tensile bond strengths of the group 3 and 4 treated with 2% NaOC1+17% EDTA were significantly higher than that of the group 1 and 2 treated with 2% NaOCl. (p < 0.05). 4. In analysis of failure patterns at the interface between sealer and gutta-percha, there were observed 49 (61%)cases of adhesive failure patterns and 31 (39%) cases of mixed failures patterns.