• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.131-134
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• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1214-1218
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• 2005

As demands for precision parts are increased, existing methods to fabricate them such as MEMS, LIGA technology have the technical limitations like high precision, high functionality and ultra miniaturization. A micro-stereolithography technology based on $DMD^{TM}$(Digital Micromirror Device) can meet these demands. In this technology, STL file is the standard format as the same of conventional rapid prototyping system, and 3D part is fabricated by stacking layers that are sliced as 2D section from STL file. Whereas in conventional method, the resin surface is cured as scanning laser beam spot according to the section shape, but in this research, we use integral process which enables to cure the resin surface at one time. In this paper, we deal with the dynamic pattern generation and $DMD^{TM}$ operation to fabricate micro structures. Firstly, we address effective slicing method of STL file, conversion to bitmap, and dynamic pattern generation. Secondly, we suggest $DMD^{TM}$ operation and optimal support manufacturing for $DMD^{TM}$ mounting. Thirdly, we examine the problems on continuous stacking layers, and their improvements in software aspects.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.24 no.7
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• pp.935-941
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• 2020

People estimation is important to provide IoT services. Most people counting technologies use camera or sensor data. However, the conventional technologies have the disadvantages of invasion of privacy and the need to install extra infrastructure. This paper proposes a method for estimating the number of people using a Wi-Fi AP. We use channel state information of Wi-Fi and analyze that using deep learning technology. It can be achieved by pre-installed Wi-Fi infrastructure that reduce cost for people estimation and privacy infringement. The proposed algorithm uses a k-binding data for pre-processing process and a 1D-CNN learning model. Two APs were installed to analyze the estimation results of six people. The result of the accurate number estimation was 64.8%, but the result of classifying the number of people into classes showed a high result of 84.5%. This algorithm is expected to be applicable to estimate the density of people in a small space.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.1
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• pp.52-62
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• 2004

In this paper we look at the effect of Fringe-Enhanced-Barrier-lowering (FEBL) for high-K dielectric MOSFETs and the dependence of FEBL on various technological parameters (spacer dielectrics, overlap length, dielectric stack, S/D junction depth and dielectric thickness). We show that FEBL needs to be contained in order to maintain the performance advantage with scaled high-K dielectric MOSFETs. The degradation in high-K dielectric MOSFETs is also identified as due to the additional coupling between the drain-to-source that occurs through the gate insulator, when the gate dielectric constant is significantly higher than the silicon dielectric constant. The technology parameters required to minimize the coupling through the high-K dielectric are identified. It is also shown that gate dielectric stack with a low-K material as bottom layer (very thin $SiO_2$ or oxy-nitride) will be helpful in minimizing FEBL. The circuit performance issues with high-K MOS transistors are also analyzed in this paper. An optimum range of values for the dielectric constant has been identified from the delay and the energy dissipation point of view. The dependence of the optimum K for different technology generations has been discussed. Circuit models for the parasitic capacitances in high-K transistors, by incorporating the fringing effects, have been presented.

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 1996.06c
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• pp.802-811
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• 1996

Farmers need alternatives for weed control due to the desire to reduce chemicals used in farming. However, conventional mechanical cultivation cannot selectively remove weeds located in the seedline between crop plants and there are no selective heribicides for some crop/weed situations. Since hand labor is costly , an automated weed control system could be feasible. A robotic weed control system can also reduce or eliminate the need for chemicals. Currently no such system exists for removing weeds located in the seedline between crop plants. The goal of this project is to build a real-time , machine vision weed control system that can detect crop and weed locations. remove weeds and thin crop plants. In order to accomplish this objective , a real-time robotic system was developed to identify and locate outdoor plants using machine vision technology, pattern recognition techniques, knowledge-based decision theory, and robotics. The prototype weed control system is composed f a real-time computer vision system, a uniform illumination device, and a precision chemical application system. The prototype system is mounted on the UC Davis Robotic Cultivator , which finds the center of the seedline of crop plants. Field tests showed that the robotic spraying system correctly targeted simulated weeds (metal coins of 2.54 cm diameter) with an average error of 0.78 cm and the standard deviation of 0.62cm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.4
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• pp.208-211
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• 2018

This paper details the design of a 1,200 V class trench gate field stop IGBT (insulated gate bipolar transistor) with a nano gate structure smaller than 1 um. Decreasing the size is important for lowering the cost and increasing the efficiency of power devices because they are high-voltage switching devices, unlike memory devices. Therefore, in this paper, we used a 2-D device and process simulations to maintain a gate width of less than 1 um, and carried out experiments to determine design and process parameters to optimize the core electrical characteristics, such as breakdown voltage and on-state voltage drop. As a result of these experiments, we obtained a wafer resistivity of $45{\Omega}{\cdot}cm$, a drift layer depth of more than 180 um, an N+ buffer resistivity of 0.08, and an N+ buffer thickness of 0.5 um, which are important for maintaining 1,200 V class IGBTs. Specially, it is more important to optimize the resistivity of the wafer than the depth of the drift layer to maintain a high breakdown voltage for these devices.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.13 no.9
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• pp.4606-4623
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• 2019

Nowadays modern cities develop in a very rapid speed. Buildings become larger than ever and the interior structures of the buildings are even more complex. This drives a high demand for precise and accurate indoor navigation systems. Although the existing commercially available 2D indoor navigation system can help users quickly find the best path to their destination, it does not intuitively guide users to their destination. In contrast, an indoor navigation system combined with augmented reality technology can efficiently guide the user to the destination in real time. Such practical applications still have various problems like position accuracy, position drift, and calculation delay, which causes errors in the navigation route and result in navigation failure. During the navigation process, the large computation load and frequent correction of the displayed paths can be a huge burden for the terminal device. Therefore, the navigation algorithm and navigation logic need to be improved in the practical applications. This paper proposes an improved navigation algorithm and navigation logic to solve the problems, creating a more accurate and effective augmented reality indoor navigation system.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.261-278
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• 2003

Concepts.Wafer-Level Chip-Scale Concept with Handling Substrate.Low Accuracy Placement Layout with Isolation Trench.Possible Pitch of Interconnections down to $10{\mu}{\textrm}{m}$ (Sn-Grains).Wafer-to-Wafer Equipment Adjustment Accuracy meets this Request of Alignment Accuracy (+/-1.5 ${\mu}{\textrm}{m}$).Adjustment Accuracy of High-Speed Chip-to-Wafer Placement Equipment starts to meet this request.Face-to-Face Modular / SLID with Flipped Device Orientation.interchip Via / SLID with Non-Flipped Orientation SLID Technology Features.Demonstration with Copper / Tin-Alloy (SLID) and W-InterChip Vias (ICV).Combination of reliable processes for advanced concept - Filling of vias with W as standard wafer process sequence.No plug filling on stack level necessary.Simultanious formation of electrical and mechanical connection.No need for underfiller: large area contacts replace underfiller.Cu / Sn SLID layers $\leq$ $10{\mu}{\textrm}{m}$ in total are possible Electrical Results.Measurements of Three Layer Stacks on Daisy Chains with 240 Elements.2.5 Ohms per Chain Element.Contribution of Soldering Metal only in the Range of Milliohms.Soldering Contact Resistance ($0.43\Omega$) dominated by Contact Resistance of Barrier and Seed Layer.Tungsten Pin Contribution in the Range of 1 Ohm

• Journal of Korea Multimedia Society
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• v.11 no.2
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• pp.228-236
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• 2008

Recently augmented reality technology has been researched to view the virtual shape of buildings before construction or cultural heritages under recovery. Those researches used special devices or markers that are not applicable in long distanced outdoor environment. Also the server had to compute a lot of transformations for the location changes of virtual objects. This paper proposed a mobile augmented reality system that uses GPS and accelerometer sensors in order to compute the virtual object's locations without using markers. The server determines the position and orientation by comparing the GPS data obtained from the client with the predefined 3D object informations in the server. If the server sends the virtual object informations such as the position, orientation and matching information, then the client matches the virtual object on the screen of mobile camera phone. In addition, the client computes the transformations of location change detected by the accelerometer derived from the user's movement without additional connection to the server.

• Journal of Biomedical Engineering Research
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• v.31 no.2
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• pp.123-128
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• 2010

The thermometers is widely used in diagnostic medical devices, and the safety and accurate performance of these devices are important in the diagnosis and monitoring of personal health. Especially, the accuracy of infra-red thermometer is highly emphasized. Here two typical thermometers are utilized for this purpose: the electronic thermometers measure body temperature by contacting to subject while infra-red thermometers measure by no contacting to subject. Therefore, the evaluating items of each thermometer are different, and the standard for each temperature is highly needed. But, there have been no international standards of each thermometer such as IEC. In this paper, we developed the standards of electronic and infra-red thermometer based on national standards such as KS, ASTM, EN, JIS and FDA guidance. The new standards focused on the safety and suitable performance for health care. This standards were applied to enact and revise the electronic medical device standards. So it can be applied to evaluate the safety and performance on technical file review. We predict that this standard will improve the quality of diagnostic medical devices (thermometers) and increase the international competitive power of domestic product.