• Title/Summary/Keyword: Device reliability

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Thermal Fatigue Reliability of Solder Joints in a Thin Film Optical Filter Device (박막 광학 필터 디바이스의 패키징시 솔더 조인트의 피로 신뢰성 해석)

  • Lee, Sung-Chul;Hyun, Chung-Min;Lee, Hyung-Man;Kim, Myoung-Jin;Kim, Hwe-Kyung;Kim, Ki-Tae
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.6
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    • pp.677-684
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    • 2004
  • Plastic and creep deformations of solder joints during thermal cycling are the main factors of misalignments and power losses in optical telecommunication components. Furthermore, the increased mismatch between solder Joint-bonded areas may cause severe failure in the components. Darveaux's creep model was implemented into a finite element program (ABAQUS) to simulate creep response of solder. Based on the finite element results, thermal fatigue reliability was predicted by using various fatigue life prediction models. Also, the effects of ramp conditions, dwelling time, and solder joint-embedding materials on the reliability were investigated under the thermal cycling conditions of the Telcordia schedule (-40∼75$^{\circ}C$).

Reliability Assessment Criteria of Differential Pressure Sensor for DPF (자동차용 DPF 차압센서의 신뢰성 평가기준)

  • Chung, Wooyoung;Min, Joonwon;Park, Dongkyu;Choi, Jungwoon;Choi, Wooseok;Kim, Sidong
    • Journal of Applied Reliability
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    • v.15 no.1
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    • pp.67-75
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    • 2015
  • Differential pressure sensor for DPF (Diesel Particulate Filter) is the important part of a automobile exhaust system. This device measures the pressure of before DOC and after DPF to determine whether the DPF regenerate. In this paper reliability assessment criteria for DPF differential pressure sensor are established on terms of quality calcification test and lifetime test. The former quality certification test comprises general performance test and environmental test. Items which pass the test undergo lifetime test which guarantees the extent of mean lifetime with certain confidence.

A Fault-Tolerant Control Strategy for Cascaded H-Bridge Multilevel Rectifiers

  • Iman-Eini, Hossein;Farhangi, Shahrokh;Schanen, Jean-Luc;Khakbazan-Fard, Mahboubeh
    • Journal of Power Electronics
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    • v.10 no.1
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    • pp.34-42
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    • 2010
  • Reliability is an important issue in cascaded H-bridge converters (CHB converters) because they use a high number of power semiconductors. A faulty power cell in a CHB converter can potentially lead to expensive downtime and great losses on the consumer side. With a fault-tolerant control strategy, operation can continue with the undamaged cells; thus increasing the reliability of the system. In this paper, the operating principles and the control method for a CHB multilevel rectifier are introduced. The influence of various faults on the CHB converter is investigated. The method of fault diagnosis and the bypassing of failed cells are explained. A fault-tolerant protection strategy is proposed to achieve redundancy in the CHB rectifier. The redundant H-bridge concept helps to deal with device failures and to increase system reliability. Simulation results verify the performance of the proposed strategy.

Failure Mode Analysis for a Hyperbaric Oxygen Chamber (고압산소 치료기에 대한 고장모드 분석)

  • Jeon, Tae-Bo;Park, Seong-Bin
    • Journal of Industrial Technology
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    • v.33 no.A
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    • pp.9-14
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    • 2013
  • Reliability plays a pivotal role in the development of medical instruments. A hyperbaric oxygen chamber, as a medical/health device, is known to help medical therapy for diversity of diseases through provision of high purity oxygen. The use of hyperbaric oxygen chamber is expected to increase in the future and study to examine reliability and safety is needed. We have performed reliability assessment for a newly developed hyperbaric oxygen chamber in this study. We first briefly discussed the system structure and mechanism. We then performed FMEA (Failure Mode and Effect Analysis) for the chamber. We drew major failure modes affecting the system performance and performed in depth analysis for measuring the expected effects.

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Implementation of PXIe platform based portable Automatic Test Equipment to improve reliability

  • Gwon, Hyeok-Jin
    • Journal of the Korea Society of Computer and Information
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    • v.22 no.7
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    • pp.9-16
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    • 2017
  • In this paper, we propose a development method of portable Automatic Test Equipment based on PXIe platform. Legacy VME form factor structured test equipment has limited reuse and expansion of modules due to unapplied bus specification. In particular, these limitations can cause development periods and costs to increase, and the reliability of environmental conditions is lacking due to non-standard modules. The test equipment of the proposed PXIe platform can use diverse COTS modules to shorten the development period and minimize the instability between developments. The PXIe development module works with standard Xilinx FPGAs, PXIe Windows device drivers, and applications on standard PXIe buses. The use of standard bus and COTS modules increases scalability and reusability, enabling rapid development and excellent maintenance. Through the test, we show the proposed test equipments can be implemented efficiently between the development processes and proved their reliability through function tests and environmental tests.

Fabrication of Flexible Photoluminescent Display for Improving Reliability

  • Choi, Kyung-Cheol;Kim, Seung-Hun;Jang, Cheol;Kim, Kuk-Joo;Ahn, Sung-Il
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.337-338
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    • 2009
  • A flexible photoluminescent display device was proposed and fabrication technology with a low process temperature was investigated in order to improve its reliability. The proposed flexible photoluminescent display showed good characteristics in reliability and flexibility. The lifetime of the proposed flexible photoluminescent displays with organics components is estimated to be approximately more than 10,000 hours.

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Structural Reliability Analysis of Automatic Fire Detectors for Reduction of False Alarms (화재감지기의 오보 감소를 위한 구조 신뢰도 분석)

  • 김주홍;임현교
    • Journal of the Korean Society of Safety
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    • v.8 no.1
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    • pp.6-12
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    • 1993
  • Now it is reported that there are many companies and factories which confront to the problem of false alarm in Automatic Fire Detecting System (AFDS). Though an AFDS is a high-priced and very important device in detecting a fire. the problem degrades the reliability and utility, eventually faith. of the system. This is a research concerned about the problem of false alarm of fire detectors in an AFDS. Structure of detectors was modeled up as a general K out-of n system. and reliability characteristics including false alarm rate and missed alarm rate, are derived from it. For decision of an optimal structure of detectors. preliminary analysis on various criteria is accomplished. It is concluded that appropriate modification of a detector with plural sensors may increase the system reliability and decrease the false alarm rate.

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Electrical instabilities in p-channel polysilicon TFTs: role of hot carrier and self-heating effects

  • Fortunato, G.;Gaucci, P.;Mariucci, L.;Pecora, A.;Valletta, A.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08b
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    • pp.1065-1070
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    • 2007
  • The effects of hot carriers and self-heating on the electrical stability of p-channel TFTs have been analysed combining experimental data and numerical simulations. While hot carrier effects were shown not to induce appreciable degradation, self-heating related instability was found to more seriously affect the device characteristics. New models have been developed to explain the reported results.

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Fabrication of Flexible Thin Film Diode Devices for Plastics film LCO (플라스틱 필름 LCD용 연성 박막 다이오드 소자 제작)

  • 이찬재;홍성제;한정인;김원근
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.218-221
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    • 2002
  • We have successfully developed the high performance flexible thin film diode device for flexible plastic film LCD. For flexible LCD, TFD device must be normally operated under any deformation state. Two type devices, Ti/Ta$_2$O$\sub$5//Ta and Al/Ta$_2$O$\sub$5//Al were fabricated and the symmetry and reliability of those were estimated under various measurement conditions including severely bending states.

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