• KSCE Journal of Civil and Environmental Engineering Research
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• v.26 no.5D
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• pp.703-708
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• 2006

In the United States and Japan ITS device performance test-beds have been widely developed to enhance the reliability of traffic information and to expedite the standardization of components for securing the compatibility of device. In this study the selection criteria for developing ITS device performance test-bed are investigated by analyzing the cases and studies of overseas. Based on the criteria, a test-bed is developed and test-run. The importance of developing ITS device performance test-bed was identified as the result of reviewing the test run of each selection.

• Journal of Information Technology Services
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• v.13 no.1
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• pp.125-134
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• 2014

Device discovery for D2D (device-to-device) communication enables a device to discover other devices in order to initiate communication with them. Devices should perform the discovery phase using a small quantity of radio resource in a short time and be able to reduce the load of the base station. Legacy device discovery schemes have focused on discovering as many target devices as possible. However, it is not appropriate for peer-to-peer D2D communication scenario. Further, synchronization problems are an important issue for discovery signal transmission. This paper proposes a discovery method that one requesting device discovers a specific target for communication. Multiple antenna beamforming is employed for the synchronization between the base station and a target device. The proposal can reduce the load of the base station using the information that it already maintains and improve the reliability of the device discovery because two times of synchronizations using beamforming among the base station and devices can make the exact discovery of a target device with mobility possible.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.12
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• pp.761-767
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• 1999

Poly-Si TFTs(polycrystalline silicon thin film transistors) fabricated on a low cost glass substrate have attracted a considerable amount of attention for pixel elements and peripheral driving circuits in AMLCS(active matrix liquid crystal display). In order to apply poly-Si TFTs for high resolution AMLCD, a high operating frequency and reliable circuit performances are desired. A new poly-Si TFT with CLBT(counter doped lateral body terminal) is proposed and fabricated to suppress kink effects and to improve the device stability. And this proposed device with BC(buried channel) is fabricated to increase ON-current and operating frequency. Although the troublesome LDD structure is not used in the proposed device, a low OFF-current is successfully obtained by removing the minority carrier through the CLBT. We have measured the dynamic properties of the poly-Si TFT device and its circuit. The reliability of the TFTs and their circuits after AC stress are also discussed in our paper. Our experimental results show that the BC enables the device to have high mobility and switching frequency (33MHz at $V_{DD}$ = 15 V). The minority carrier elimination of the CLBT suppresses kink effects and makes for superb dynamic reliability of the CMOS circuit. We have analyzed the mechanism in order to see why the ring oscillators do not operate by analyzing AC stressed device characteristics.

• Journal of Applied Reliability
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• v.17 no.1
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• pp.50-57
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• 2017

Purpose : This paper is a comparative analysis results of the fatigue test for dental implants and accelerated life test by using a static type loading device commonly used in Korea and a dynamic type loading device (universal-joint) recommended by FDA. Methods : Fatigue tests of dental implant is based on ISO 14801 and classified into static load test and dynamic load test. The tests were carried out on three test specimens by four load stress steps under each loading device. For analysis on failure mode such as crack, fracture and permanent deformation of test specimens, we used X-ray three-dimensional computed tomography on test specimens before and after the fatigue tests. The design of the accelerated life test was based on the analysis results of the fatigue life data obtained from the dynamic load test and the statistical analysis software (Minitab ver.15) was used to analyze the appropriate life distribution. Results : As a result of the fatigue tests and the accelerated life tests at same acceleration condition under each test method, the fatigue life under the dynamic type loading device (universal-joint) was shorter than when static type loading device was applied. Conclusion : This paper can be used as a reference when the universal-joint type loading device for implants fatigue test is applied as ISO 14801.

• KIPS Transactions on Computer and Communication Systems
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• v.1 no.2
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• pp.71-78
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• 2012

The digital tachograph is a device that automatically records speed and distance of a vehicle, together with the driver's activity and vehicle status at an accident. It records vehicle speed, break status, acceleration, engine RPM, longitude and latitude of GPS, accumulated distance, and so on. European Commission regulation made digital tachographs mandatory for all trucks from 2005. Republic of Korea made digital tachographs mandatory for all new business vehicles from 2011 and is widening the range of vehicles that must install digital tachographs year by year. This device is used to analyze driver's daily driving information and car accidents. Under a car accident that makes the device reliability unpredictable, it is very important to store driving information with maximum reliability for its original mission. We designed and implemented a practical digital tachograph. This paper presents a storage scheme that consists of a first storage device with small capacity at a high reliability and a second storage device with large capacity at a low cost in order to reliably records data with a hardware at a low cost. The first storage device records data in a SLC NAND flash memory in a log-structured style. We present a reverse partial scan that overcomes the slow scan time of log-structured storages at the boot stage. The scheme reduced the scan time of the first storage device by 1/50. In addition, our design includes a scheme that fast stores data at a moment of accident by 1/20 of data transfer time of a normal method.

• Journal of the Korean Society of Safety
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• v.32 no.3
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• pp.54-59
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• 2017

This paper presents an efficient finite analysis model and a simulation-based reliability analysis method for stowage device system failure of a container crane with respect to lateral load. A quasi-static analysis model is introduced to simulate the nonlinear resistance characteristics and failure of tie-down and stowage pin, which are the main structural stowage devices of a crane. As a reliability analysis method, a subset simulation method is applied considering the uncertainties of later load and mechanical characteristic parameters of stowage devices. An efficient Markov chain Monte Carlo (MCMC) method is applied to sample random variables. Analysis result shows that the proposed model is able to estimate the probability of failure of crane system effectively which cannot be calculated practically by crude Monte Carlo simulation method.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2007.04a
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• pp.115-127
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• 2007

[ ${\blacktriangleright$ ] Various Factors to affect TC Reliability of 4 array RES has been Investigated through Simulation Tool and Daisy Chain Board Test ${\blacktriangleright$ Solder Joint Crack Mechanism of 4 array RES has been Examined Also, It has been Examined Thoroughly What Influence Each Factors gibes to TC Reliability and Why Those Factors gives an Influence to it ${\blacktriangleright$ BGA Type RES is Suggested to Improve TC Reliability (Patented) ${\blacktriangleright$ Through this Study, Best Design Parameter has been Optimized to Increase TC Reliability of 4 Array RES

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2008.05a
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• pp.216-219
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• 2008

The Power LED is more much than 1W and appliable to lights that is different from signal LED. In this paper we investigated types of tests in reliability assessment standards on Power LED. we make comparison of that military standards, JEITA(Japan Electronics and Information Technology Industries Association) and JEDEC(Joint Electron Device Engineering Council) with RS(reliability standard). Reliability tests should be considered that informations can be obtained from requirements of a real system Therefore, The paper aided companies to criteria for reliability tests by themselves.

• International Journal of Reliability and Applications
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• v.5 no.1
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• pp.15-24
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• 2004

Folder type electronic devices have hinge to support the rotational motion of folder. This hinge is stressed by the rotational inertia moment of folder at the maximum open limit position of folder. This stress is repeated whenever the folder is open, and it is a cause of hinge fracture. In this paper, the reliability evaluation for the hinge fracture in the folder type cellular phone is discussed. For this, the durability testing machine using crank-rocker mechanism is developed to evaluate the life cycle of the hinge, and the degradation after repetitions of opening and shutting is evaluated from the deformation around the hinge, where the deformation is measured by ESPI (electronic speckle pattern interferometer). Experimental results showed that ESPI was able to measure the deformation of hinge precisely, so we could monitor the change of deformation around the hinge as the repetition number of folder open is increased.