• Journal of the Korea Institute of Information and Communication Engineering
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• v.8 no.3
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• pp.577-585
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• 2004

System Packet Interface Level 4 Phase(SPI-4.2) is an interface for packet and cell transfer between a physical layer(PHY) device and a link layer device, for aggregate bandwidths of OC-192 ATM and Packet Over Sonet/SDH(POS), as well as 10Gbps Ethernet applications. In this paper, we performs the research for SPI-4.2. Also we analyze the performance of SPI-4.2 interface module after modeling using C programming language. This paper shows that SPI-4.2 interface module with 512-word FIFO depth is able to be adapted for the offered loads to 97％ in random uniform traffic and 94％ in bursty traffic with bursty length 32. SPI-4.2 interface module can experience an performance degradation due to heavy overhead when it massively receives small size packets less than 14-byte. SPI-4.2 interface module is suited for line cards in gigabit/terabit routers, and optical cross-connect switches, and SONET/SDH-based transmission systems.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.10
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• pp.2403-2408
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• 2014

We designate multiple target areas for the advertisement disseminations in order to resolve the problem of advertisement transmission efficiency degradation due to overlapped device-to-device (D2D) transmissions and unnecessary advertisement transmissions. We here propose an efficient advertisement dissemination algorithm based on pre-selected target areas considering user density. In our proposed algorithm, relay nodes are gradually selected according to the locations of the target areas. We mathematically analyze D2D advertisement coverages of our proposed algorithm, and compare the various simulation results of the proposed algorithm with those of the conventional algorithm according to the several simulation scenarios via intensive simulations.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.7
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• pp.100-106
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• 2015

In this paper, we propose a fast algorithm for low-power image enhancement method for mobile LCD. In the proposed fast algorithm, the spatial resolution of the input image is significantly reduced, and the image characteristics are analyzed on the reduced resolution image to find a dimming rate adaptive to the image content, thereby saving power. The proposed fast adaptive dimming and image enhancement algorithm is implemented as an application that runs on an Android device. Image quality evaluation and running time analysis experiments on the device indicate that the proposed fast algorithm jointly minimizes the quality degradation and power consumption, reducing the required computation load by over 95%.

• Korean Journal of Materials Research
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• v.31 no.3
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• pp.132-138
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• 2021

Electrochromic devices (ECDs) have been drawing great attention due to their high color contrast, low power consumption, and memory effect, and can be used in smart windows, automatic dimming mirrors, and information display devices. As with other electronic devices such as LEDs (light emitting diodes), solar cells, and transistors, the mechanical flexibility of ECDs is one of the most important issue for their potential applications. In this paper, we report on flexible ECDs (f-ECDs) fabricated using an all-in-one EC gel, which is a mixture of electrolyte and EC material. The f-ECDs are compared with rigid ECDs (r-ECDs) on ITO glass substrate in terms of color contrast, coloration efficiency, and switching speed. It is confirmed that the f-ECDs embedding all-in-one gel show strong blue absorption and have competitive EC performance. Repetitive bending tests show a degradation of electrochromic performance, which must be improved using an optimized device fabrication process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.6
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• pp.633-637
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• 2023

Recently, with the development of the smart device market, the integration of high-functional devices has increased the heat density, causing overload of the device, and resulting in various problems such as shortened lifespan, performance degradation, and failure. Therefore, research on heat dissipation materials is being actively conducted to realize next-generation electronic products. The heat dissipation material is characterized in that it is easy to dissipate heat due to its high thermal conductivity and minimizes leakage current flowing through the heat dissipation material due to its low electrical conductivity. In this study, flower-shaped Al₂O₃ and BN composites were engineered with a simple hydrothermal synthesis approach, and their thermal conductivity characteristics were compared and evaluated for each synthesis condition for the application to a heat dissipation material. Spherical BN and flower-shaped Al₂O₃ were easily obtained, and SEM/EDS analyses confirmed the uniform presence of BN between the Al₂O₃, and it can be expected that these shapes can affect the thermal conductivity.

• Journal of IKEEE
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• v.28 no.1
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• pp.33-37
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• 2024

In this paper, we report the design and the measurement of a X-band low noise amplifier (LNA) monolithic microwave integrated circuit (MMIC) using a 0.25 ㎛ gate length microstrip GaN-on-SiC high electron mobility transistor (HEMT) technology. The developed X-band GaN-based LNA MMIC achieves small signal gain of 22.75 dB ~ 25.14 dB and noise figure of 1.84 dB ~ 1.94 dB in the desired band of 9 GHz to 10 GHz. Input and output return loss values are -11.36 dB ~ -24.49 dB and -11.11 dB ~ -17.68 dB, respectively. The LNA MMIC can withstand 40 dBm (10 W) input power without performance degradation. The chip dimensions are 3.67 mm × 1.15 mm. The developed GaN-based LNA MMIC is applicable to various X-band applications.

• Korean Journal of Soil Science and Fertilizer
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• v.45 no.3
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• pp.410-420
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• 2012

The heavy reliance on fossil fuels, especially oil and gas has triggered the global energy crisis. Continued use of petroleum fuels is now widely recognized as unsustainable because of their depleting supplies and degradation to the environment. To become less dependent on fossil fuels, current world is shifting paradigm in energy by developing alternative energy sources mainly through the utilization of renewable energy sources. In particular, bioenergy recovery from wastes with the help of microorganism is viewed as one of the promising ways to mitigate the current global warming crisis as well as to supply global energy. It has been proved that microorganism can generate power by converting organic matter into electricity using microbial fuel cells (MFCs). MFC is a bioelectrochemical device that employs microbes to generate electricity from bio-convertible substrate such as wastewaters including municipal solid waste, industrial, agriculture wastes, and sewage. Sustainability, carbon neutral and generation of renewable energy are some of the major features of MFCs. However, the MFC technology is confronted with a number of issues and challenges such as low power production, high electrode material cost and so on. This paper reviews the recent developments in MFC technology with due consideration of electrode materials used in MFCs. In addition, application of biocathodes in MFCs has been discussed.

• Journal of the Korea Society for Simulation
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• v.22 no.4
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• pp.93-98
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• 2013

In this paper, the proposed shallow trench isolation structures for high threshold voltage for very large scale and ultra high voltage integrated circuits MOSFET were simulated. Physically based models of hot-carrier stress and dielectric enhanced field of thermal damage have been incorporated into a TCAD tool with the aim of investigating the electrical degradation in integrated devices over an extended range of stress biases and ambient temperatures. As a simulation results, shallow trench structure were intended to be electric functions of passive, as device dimensions shrink, the electrical characteristics influence of proposed STI structures on the transistor applications become stronger the potential difference electric field and saturation threshold voltage.

• Journal of Microbiology and Biotechnology
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• v.27 no.12
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• pp.2199-2210
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• 2017

Soil burial is the most widely used disposal method for infected pig carcasses, but composting has gained attention as an alternative disposal method because pig carcasses can be decomposed rapidly and safely by composting. To understand the pig carcass decomposition process in soil burial and by composting, pilot-scale test systems that simulated soil burial and composting were designed and constructed in the field. The envelope material samples were collected using special sampling devices without disturbance, and bacterial community dynamics were analyzed by high-throughput pyrosequencing for 340 days. Based on the odor gas intensity profiles, it was estimated that the active and advanced decay stages were reached earlier by composting than by soil burial. The dominant bacterial communities in the soil were aerobic and/or facultatively anaerobic gram-negative bacteria such as Pseudomonas, Gelidibacter, Mucilaginibacter, and Brevundimonas. However, the dominant bacteria in the composting system were anaerobic, thermophilic, endospore-forming, and/or halophilic gram-positive bacteria such as Pelotomaculum, Lentibacillus, Clostridium, and Caldicoprobacter. Different dominant bacteria played important roles in the decomposition of pig carcasses in the soil and compost. This study provides useful comparative date for the degradation of pig carcasses in the soil burial and composting systems.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.