• Journal of the Microelectronics and Packaging Society
• /
• v.27 no.4
• /
• pp.83-89
• /
• 2020

For the past few decades, as part of efforts to protect the environment where fossil fuels, which have been a key energy resource for mankind, are becoming increasingly depleted and pollution due to industrial development, ecofriendly secondary batteries, hydrogen generating energy devices, energy storage systems, and many other new energy technologies are being developed. Among them, the lithium-ion battery (LIB) is considered to be a next-generation energy device suitable for application as a large-capacity battery and capable of industrial application due to its high energy density and long lifespan. However, considering the growing battery market such as eco-friendly electric vehicles and drones, it is expected that a large amount of battery waste will spill out from some point due to the end of life. In order to prepare for this situation, development of a process for recovering lithium and various valuable metals from waste batteries is required, and at the same time, a plan to recycle them is socially required. In this study, we introduce a nanoscale pattern transfer printing (NTP) process of Li2CO3, a representative anode material for lithium ion batteries, one of the strategic materials for recycling waste batteries. First, Li2CO3 powder was formed by pressing in a vacuum, and a 3-inch sputter target for very pure Li2CO3 thin film deposition was successfully produced through high-temperature sintering. The target was mounted on a sputtering device, and a well-ordered Li2CO3 line pattern with a width of 250 nm was successfully obtained on the Si substrate using the NTP process. In addition, based on the nTP method, the periodic Li2CO3 line patterns were formed on the surfaces of metal, glass, flexible polymer substrates, and even curved goggles. These results are expected to be applied to the thin films of various functional materials used in battery devices in the future, and is also expected to be particularly helpful in improving the performance of lithium-ion battery devices on various substrates.

• Journal of radiological science and technology
• /
• v.37 no.4
• /
• pp.239-246
• /
• 2014

Filter absorbs low-energy X-ray to increase the average energy and reduces patient exposure dose. This study investigates if the materials of Mo and W could be used for the digital imaging device CR by conducting image assessment and dose measurement of SNR, FOM and histogram. In addition, measurement of beam quality was conducted depending on the material of the filter, and at the same time, a proper combination of filters was examined depending on the change in tube voltage (kVp). In regard to entrance skin dose, Mo filter showed the dose reduction by 42~56%, compared to Cu filter. Moreover, Mo filter showed higher transmission dose by around 1.5 times than that of Cu filter. In image assessment, it was found that W was unsuitable to be used as a filter, whereas Mo could be used as a filter to reduce dose without decline in image quality at the tube voltage of 80 kVp or higher. As tube voltage increased, 2.0 mm Al+0.1 mm Mo almost had a similar histogram width to that of 2.0 mm Al+0.2 mm Cu. Therefore, Mo filter can be used at relatively high tube voltage of 80 kVp, 100 kVp and 120 kVp. The SNR of 2.0 mm Al+0.1 mm Mo did not show any significant difference from those of 2.0 mm Al+0.2 mm Cu and 2.0 mm Al+0.1 mm Cu. As a result, if Mo filter is used to replace Cu filter in general radiography, where 80 kVp or higher is used for digital radiation image, patient exposure dose can be reduced significantly without decline in image quality, compared to Cu filter. Therefore, it is believed that Mo filter can be applied to chest X-ray and high tube voltage X-ray in actual clinical practice.

• The Journal of Korean Academy of Prosthodontics
• /
• v.38 no.5
• /
• pp.583-594
• /
• 2000

Dislodgement of a crown or extension bridge and the loosening of a retainer of a bridge is a serious clinical problem in fixed restoration. Generally these problems are considered to be associated with deformation of the restoration. During biting, the restoration is subjected to complex forces and deforms considerably within the limit of its elasticity. Deformation of the restoration under the occlusal force induces excessive stress in the cement film, which then leads to the cement fracture. Such a fracture may eventually cause loss of the restoration. Because most of the past retention tests for full veneer crown were done without fatigue loading, they were not exactly simulating intraoral environment. And the purpose of this study was to evaluate the effect of cyclic cantilever loading on the retentive strength of full veneer crowns depending on different type of cements and taper of prepared abutment. Steel dies with $8^{\circ}\;or\;16^{\circ}$ convergence angle were fabricated through milling and crowns with the same method. These dies and crowns were divided into 8 groups. Group 1 : $16^{\circ}$ taper die, cementation with zinc phosphate cement, without loading Group 2 : $16^{\circ}$ taper die, cementation with zinc phosphate cement, with loading Group 3 : $8^{\circ}$ taper die, cementation with zinc phosphate cement, without loading Group 4 : $8^{\circ}$ taper die, cementation with zinc phosphate cement, with loading Group 5 : $16^{\circ}$ taper die, cementation with Panavia 21, without loading Group 6 : $16^{\circ}$ taper die, cementation with Panavia 21, with loading Group 7 : $8^{\circ}$ taper die, cementation with Panavia 21 without loading Group 8 : $8^{\circ}$ taper die, cementation with Panavia 21, with loading After checking the fit of die and crown, the luting surface of dies and inner surface of crowns were air-abraded for 10 seconds. The crowns were cemented to the dies, with cements mixed according to the manufacturer's recommendations. A static load of 5kg was then applied for 10 minutes with static loading device. Twenty-four hours later, group 1, 3, 5, 7 were only thermocycled, group 2, 4, 6, 8 were subjected to cyclic loading after thermocycling. Retentive tests were performed on the Instron machine. From the finding of this study, the following conclusions were obtained 1. Panavia 21 showed significantly higher retentive strength than zinc phosphate cement for all groups (p<0.05). 2. There was a significant difference in the retentive strength between $8^{\circ}\;and\;16^{\circ}$ taper for zinc phosphate cement(p<0.05), but no significant difference for Panavia 21 (p>0.05). 3. Cyclic loading significantly decreased the retentive strength for all groups(p<0.05). 4. For zinc phosphate cement, there was 35% reduction of the retentive strength after loading in the $16^{\circ}$ taper die, 25% in the $8^{\circ}$ taper die, and for Panavia 21, 21% in the $16^{\circ}$ taper die, 18% in the $8^{\circ}$ taper die.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.3
• /
• pp.13-19
• /
• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.