• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.251-255
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• 2003

This paper presents the design, fabrication, and calibration of a piezoelectric polymer-based sensorized microgripper. Electro discharge machining technology is employed to fabricate super-elastic alloy based micro gripper. It is tested to present improvement of mechanical performance. For integration of force sensor on the micro gripper, the sensor design based on the piezoelectric polymer PVDF film and fabrication process are presented. The calibration and performance test of force sensor integrated micro gripper are experimentally carried out. The force sensor integrated micro gripper is applied to perform fine alignment tasks of micro opto-electrical components. It successfully supplies force feedback to the operator through the haptic device and plays a main role in preventing damage of assembly parts by adjusting the teaching command.

• Korean Journal of Computational Design and Engineering
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• v.7 no.3
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• pp.190-201
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• 2002

Surfaces of many engineering structures, specially, those of ships and airplanes are commonly fabricated as doubly curved shapes as well as singly curved surfaces to fulfill functional requirements. Given a three dimensional design surface, the first step in the fabrication process is unfolding or planar development of this surfaces into a planar shape so that the manufacturer can determine the initial shape of the flat plate. Also a good planar development enables the manufacturer to estimate the strain distribution required to form the design shape. In this paper, an algorithm for optimal approximated development of a general curved surface, including both singly and doubly curved surface is developed in the sense that the strain energy from its planar development to the design surface is minimized, subjected to some constraints. The development process is formulated into a constrained nonlinear programming problem, which is on basis of deformation theory and finite element. Constraints are subjected to characteristics of the fabrication method. Some examples on typical surfaces and the practical ship surfaces show the effectiveness of this algorithm.

• Journal of Korean Institute of Industrial Engineers
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• v.36 no.1
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• pp.42-51
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• 2010

The semiconductor industry is highly capital and technology intensive. Technology advancement on circuit design and process improvement requires chip makers continuously to invest a new fabrication facility that costs more than 3 billion US dollars. Especially major semiconductor companies recently started to discuss 450mm fabrication substituting existing 300mm fabrication of which facilities were initiated to build in 1998. If the plan is consolidated, the yield of 450mm facility would be more than doubled compared to existing 300mm facility. In steps of this important investment, facility layout has been acknowledged as one of the most important factors to be competitive in the market. This research proposes a new concept of semiconductor facility layout using hexagonal floor plan and its compatible material flow pattern. The main objective of this proposal is to improve the productivity of the unified layout that has been popularly used to build existing facilities. In this research, practical characteristics of the semiconductor fabrication are taken into account to develop a new layout alternative based on the analysis of Chung and Tanchoco (2009). The performance of the proposed layout alternative is analyzed using computer simulation and the results show that the new layout alternative outperforms the existing layout alternative, unified layout. However, a few questions on space efficiency to the new alternative were raised in communication with industry practitioners. These questions are left for a future study.

• Steel and Composite Structures
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• v.3 no.1
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• pp.13-32
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• 2003

In this paper design and fabrication information system for steel bridge construction is studied and proposed according to the progress of Construction CALS/EC in the construction industry in Japan. The data exchange in this system bases on the text file as well as CAD data with simplified drawings. The concept of this system is discussed following the analysis on the issues of the conventional system. The application of the product model is also discussed including effects and issues on the inspection system. This paper is based on the study carried out by Special Committee on Construction CALS of JASBC to which author belong.

• Journal of the Korean institute of surface engineering
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• v.47 no.6
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• pp.362-367
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• 2014

We report the design, fabrication of a $Si_3N_4$ probe and calculation of its mechanical properties for DPN(dip pen nanolithography), which consists of dual tips. Concept of dual tip probe is to employ individual tips on probe as either an AFM tip for imaging or a writing tip for nano patterning. For this, the dual tip probe is fabricated using low residual stress $Si_3N_4$ material with LPCVD deposition and MEMS fabrication process. On the basis of FEM analysis we show that the functionality of dual tip probe for imaging is dependent on the dimensions of dual tip probe, and high ratio of widths of beam areas is preferred to minimize curvature variation on probe.

• Journal of the Society of Naval Architects of Korea
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• v.31 no.3
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• pp.154-164
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• 1994

In this study, to find an economical production method which yields welded built-up beams with high quality, simulation techniques and optimization method are used. At first, fabrication variables such as welding current, voltage and speed and heated depth and breadth are selected and fabrication cost of a built-up beam is expressed by these parameters, which is optimized under the constraints. As advanced studies, total production cost including the fabrication cost and the material cost of the beam is expressed by the fabrication and design variables, and optimized with the design constraints by the class rules. In addition, assuming that heating for straightening is impossible. the optimization method of multi-objective functions based on the weighting method is applied to obtain the compromised optimal solutions of the total production cost and the welding deformation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.648-651
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• 2003

This paper presents a 3-axis fine positioning stage. All the procedure concerning the design and fabrication of the stae are described. The stage considered here is composed of flexure hinges, piezoelectric actuators and their peripherals. A special flexure hinge is adopted to be able to actuate the single stage in three axes at the same time. A ball contact mechanism is introduced into the piezoelectric actuator to avoid the cross talk among the axes. The final design is obtained with the theoretical analysis on the stage. An actual fine stage is developed and the design specifications are verified through an experiment.

• Transactions of the Society of Information Storage Systems
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• v.2 no.3
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• pp.163-168
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• 2006

Small form factor optical pickup (SFFOP) corresponding to BD specifications is strongly proposed for the next-generation portable storage device. In order to generate SFFOP, small sized optical pickup has been fabricated. We have developed a small sited optical pickup that is called the integrated optical pickup (IOP). The fabrication method of this system is mainly dependant on the use of the wafer based micro fabrication technology, which has been used in MEMS process such as photolithography, reactive ion etching, wafer bonding, and packaging process. This approach has the merits for mass production and high assembling accuracy. In this study, to generate the small sized optical pickup for high recording capacity, IOP corresponding to BD specifications has been designed and developed, including three main parts, 1) design, fabrication and evaluation of objective lens unit, 2) design and fabrication of IOP and 3) evaluation process of FES and TES.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.411-414
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• 2004

This paper introduces a modulation method for digital wireless communication based on general DS-QPSK. The design and fabrication is for home networking application to a typical RF transmitter with DS-QPSK modulator. This modulator implemented using VHDL hardware programming language, the fabrication of IC chip $5{\times}5 mm^2$ was carried by 27th IDEC MPW(Multi Project Wafer) process in 0.35${\mu}m$ rule at Samsung Inc. This paper presented the important of this technology for the future application in wireless sensor. This module can be efficient usage for home network to transmit the RF wireless sensor system.

• Composites Research
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• v.14 no.3
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• pp.10-17
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• 2001

A reseach was peformed to develop composite pressure vessels in conjunction with design, fabrication, and test. Fiber pattern and angels were decided by CADFIL software and they were [$liner/15^{\circ}/15^{\circ}/90^{\circ}/18^{\circ}/90^{\circ}/21^{\circ}/21^{\circ}/90^{\circ}$]. Fabrication of bottles were done by 5-axis filament winding machine. During fabrication fiber optic sensors were embedded to measure the strain at points when internal pressure was applied by water pump. Conventional strain gage instrumentation showed the stable test results. The test results were compared to finite element analysis results and they were close each other in strain values. One can see the successful design and fabrication of single boss composite vessels.