• 제목/요약/키워드: Deposition system

검색결과 1,615건 처리시간 0.019초

New SMOLED Deposition System for Mass Production

  • Lee, J.H.;Kim, C.W.;Choi, D.K.;Kim, D.S.;Bae, K.B.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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    • pp.407-410
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    • 2003
  • We will introduce our new concept deposition system for SMOLED manufacturing in this conference. This system is designed to deposit organic and metal material to downward to overcome the limit of substrate size and process tact time hurdle for OLED mass production, and is organized with organic deposition chamber, substrate pre-cleaning chamber, metal deposition chamber and encapsulation system. These entire process chambers are integrated with linear type substrate transfer system. We also compare our new SMOLED manufacturing system with conventional vacuum deposition systems, and show basic organic thin film property data, organic material deposition property data, and basic device property.

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후처리를 최소화하는 판재적층방식 쾌속조형기의 개발 (Development of Sheet Deposition Type Rapid Prototyping System Minimizing Post Processing)

  • 조인행;이건우;송용억
    • 한국정밀공학회지
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    • 제16권7호
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    • pp.210-218
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    • 1999
  • Sheet deposition type rapid prototyping system have many advantages : high build speed, low operating cost, large part size, no phase change, no need for support generation, and forth. However, those sheet deposition type rapid prototyping system require an additional post processing to remove excessive material attached to the part. This post processing is time consuming and labor intensive. Moreover, it is difficult for those system to fabricate parts with hollow cores and internal cavities. A new sheet deposition type rapid prototyping system that minimizes the post processing is proposed. The proposed system automatically removes excessive material in a peeling-off process between two cutting processes. In this way, the proposed system can reduce the post-processing time and cost as well as the limitation of the feasible geometric shapes in the conventional sheet deposition system.

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Simulation and Characteristic Measurement with Sputtering Conditions of Triode Magnetron Sputter

  • Kim, Hyun-Hoo;Lim, Kee-Joe
    • Transactions on Electrical and Electronic Materials
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    • 제5권1호
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    • pp.11-14
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    • 2004
  • An rf triode magnetron sputtering system is designed and installed its construction in vacuum chamber. In order to calibrate the rf triode magnetron sputtering for thin films deposition processes, the effects of different glow discharge conditions were investigated in terms of the deposition rate measurements. The basic parameters for calibrating experiment in this sputtering system are rf power input, gas pressure, plasma current, and target-to-substrate distance. Because a knowledge of the deposition rate is necessary to control film thickness and to evaluate optimal conditions which are an important consideration in preparing better thin films, the deposition rates of copper as a testing material under the various sputtering conditions are investigated. Furthermore, a triode sputtering system designed in our team is simulated by the SIMION program. As a result, it is sure that the simulation of electron trajectories in the sputtering system is confined directly above the target surface by the force of E${\times}$B field. Finally, some teats with the above 4 different sputtering conditions demonstrate that the deposition rate of rf triode magnetron sputtering is relatively higher than that of the conventional sputtering system. This means that the higher deposition rate is probably caused by a high ion density in the triode and magnetron system. The erosion area of target surface bombarded by Ar ion is sputtered widely on the whole target except on both magnet sides. Therefore, the designed rf triode magnetron sputtering is a powerful deposition system.

용매침착법을 이용한 페닐부타존의 용출속도에 관한 연구 (Studies on the Dissolution Rate of Phenylbutazone Deposited on Excipients by Solvent Deposition Method)

  • 용재익;손영옥
    • 약학회지
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    • 제29권3호
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    • pp.124-129
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    • 1985
  • A dissolution characteristics of phenylbutazone deposited on Avicel and dibasic calcium phosphate by solvent deposition method were studied. The solvent deposition was confirmed by scanning electron microscopy. Avicel was superior to dibasic calcium phosphate as excipient in dissolution rate. Total amount of phenylbutazone dissolved from Avicel deposition system at 30minutes were enhanced 1.2-1.6 times compared with physical mixtures of them. The dissolution rate of 10% solvent deposition system was highest and that of 75% solvent deposition system was lowest in Avicel system and dibasic calcium phosphate system. Dissolution profile of commercial products was dependent on manufacturing conditions and dissolution rate of 10% Avicel system was greater than that of commercial products.

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Flurbiprofen 용매침착물(溶媒沈着物)의 용출특성(溶出特性)에 관(關)한 연구(硏究) (Studies on Dissolution Rate of Flurbiprofen from Solvent Deposition Systems)

  • 최보경;용재익
    • Journal of Pharmaceutical Investigation
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    • 제15권3호
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    • pp.100-112
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    • 1985
  • Dissolution characteristics of flurbiprofen solvent deposited on ${\alpha}-cyclodextrin$, ${\beta}-cyclodextrin$, lactose and corn starch were studied to evaluate the pharmaceutical aspects of solvent deposition method where drug was solvent deposited on the surface of excipients. In a solvent deposition system, the drug to excipient ratio and kind of excipient affect much on dissolution rates of flurbiprofen. The solvent deposition system formation was confirmed by scanning electron microscope. By increasing the amounts of matrix, it was possible to enhance the dissolution rate of flurbiprofen solvent deposition system. The amount of flurbiprofen dissolved from ${\beta}-cyclodextrin$ deposition system (1:10) at 60 minutes was enhanced 6.5 times in water and 28 times in simulated gastric juice compared with flurbiprofen alone. Flurbiprofen solvent deposited system (1:10) enhanced dissolution rate greater than inclusion complex and dispersion system.

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새로운 건성 및 습성 침착 채취기의 개발 (Development of the Novel Dry and Wet Deposition Collector)

  • 이병규;이채복
    • 한국대기환경학회지
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    • 제16권6호
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    • pp.675-684
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    • 2000
  • A novel dry and wet deposition collector, which can overcome the several problems such as water evaporation cartridge cracks and high costs founded in the previous collector systems, has been constructed. ENVI-18 SPE adsorption cartridge has been used to measure atmospheric deposition of polycylic aromatic hydrocarbons (PAHs). A surrogate surface, consisted of water and methanol, was filled in the dry deposition funnel to simulate dry deposition onto water surface. A water supply system in order to compensat evaporation of the surrogate surface was used and it was consisted of a piston pump, a tubing pump, a overflow tube and a chamber system. A novel water vaporizing system to supply water onto the wet SPE cartridge system with a constant flow rate was developed. The novel water vaporizing system, consisted of a vacuum pump, a water supply reserviour and tube and a mini space heater, could prevent the PAHs adsorption cartridge cracks occurred in the previous collector and effectively adsorb PAHs. The novel dry and wet deposition collector showed a good adsorption, desorption, and recovery rates of PAHs. By reducing the number of pumps used and employing polypyopylene (PP) instead of teflon as a material of collection funnel, the total construction costs were much reduced as compared with the previous dry and wet deposition collectors.

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Triode magnetron sputtering system의 제작 및 특성평가 (Characteristic evaluations and production of triode magnetron sputtering system)

  • 김현후;이무영;김광태;윤상현;유환구;김종민;박철현;임기조
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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    • pp.787-790
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    • 2003
  • A rf triode magnetron sputtering system is designed and installed its construction in vacuum chamber. In order to calibrate the rf triode magnetron sputtering for thin films deposition processes, the effects of different glow discharge conditions were investigated in terms of the deposition rate measurements. The basic parameters for calibrating experiment in this sputtering system are rf power input, gas pressure, plasma current, and target-to-substrate distance. Because a knowledge of the deposition rate is necessary to control film thickness and to evaluate optimal conditions which are an important consideration in preparing better thin films, the deposition rates of copper as a testing material under the various sputtering conditions are investigated. Furthermore, a triode sputtering system designed in our team is simulated by the SIMION program. As a result, it is sure that the simulation of electron trajectories in the sputtering system is confined directly above the target surface by the force of $E{\times}B$ field. Finally, some teats with the above 4 different sputtering conditions demonstrate that the deposition rate of rf triode magnetron sputtering is relatively higher than that of the conventional sputtering system. This means that the higher deposition rate is probably caused by a high ion density in the triode and magnetron system. The erosion area of target surface bombarded by Ar ion is sputtered widely on the whole target except on both magnet sides. Therefore, the designed rf triode magnetron sputtering is a powerful deposition system.

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RF 헬리콘 플라즈마를 이용한 회학기상 증착기의 제작 (Construction of CVD by using RF Helicon Plasma)

  • 신재균;현준원;박상규
    • 한국전기전자재료학회논문지
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    • 제11권8호
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    • pp.607-612
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    • 1998
  • RF HPCVD(Helicon Plasma Chemical Vapor Deposition) has been successfully constructed for diamond thin films. The system consists of plasma generation tube, deposition chamber, pumping lines for gas system. A mixture of $CH_4 and H_2$is used for reaction. Two thermocouples, a quartz tube surrounded by a RF antenna and a magnet, and a high temperature heater were set up in the deposition chamber. The process for the thin film diamond deposition has been carried put in a high vacuum system at a substrate temperature of $800^{\circ}C$, and pressure of 5 mtorr. It is also demonstrated. that the RF HPCVD system has advantages for controlling deposition parameters easily.

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OLED 패널의 기준패턴과 증착패턴의 크기 측정을 위한 패턴 동시 측정 시스템의 구현 (Implementing a Simultaneous Pattern Measurement System for Measuring the Size of the Standard Pattern and the Deposition Pattern of an OLED Panel)

  • 곽병호;최경주
    • 한국멀티미디어학회논문지
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    • 제22권2호
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    • pp.117-127
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    • 2019
  • Simultaneous pattern measurement system is new research subject for OLED panel inspection. It is defect inspection of OLED panel after deposition. This research suggests the system that calculates the size and center point of each patterns after obtaining standard and deposition pattern as one image. This system could be applied to OLED manufacturing process. The research result shows that the size and center point of each patterns could be obtained by displaying the standard pattern and deposition pattern in one image.

정전효과를 고려한 반도체 웨이퍼의 입자침착 특성 (Particle Deposition Characteristics with Electrostatic Effect on Semiconductor Wafers)

  • 이건형;채승기;문영준
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2006년도 하계학술발표대회 논문집
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    • pp.779-785
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    • 2006
  • Particle transport and deposition characteristics on semiconductor wafers inside the chamber were experimentally investigated via a particle generation & deposition system and a wafer surface scanner. Especially the relation between particle size($0.083{\sim}0.495{\mu}m$) and particle deposition velocity with ESA(Electrostatic Attraction) effect was studied. Spot deposition technique with the deposition system using nozzle type outlets of the chamber was newly conducted to derive particle deposition velocity and all experiment results were compared with the previous study and were in a good agreement as well.

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