• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.71-75
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• 2006

The yellow emitting OLED using GDI602:Rubrene(10%) material has been fabricated and characterized. In the device fabrication, 2-TNATA [4,4',4'-tris(2-naphthylphenyl-phenylamino)-triphenyl-amine] as a hole injection material and NPB[N,N'-bis(1-naphthyl)-N,N'-diphenyl-1,1'-biphenyl -4,4'-diamine] as a hole transport material were deposited on the ITO(indium thin oxide)/glass substrate by vacuum evaporation. And then, yellow emission material was deposited using GDI602 as a host material and Rubrene(10%) as a dopant. Finally, small molecular OLED with the structure of $ITO/2-TNATA/NPB/GDI602:Rubrene(10%)/Alq_{3}/LiF/Al$ was obtained by in-situ successive deposition of $Alq_{3}$, LiF and Al as the electron transport material, electron injection material and cathode. The yellow OLED fabricated in our experiments showed the color coordinate of CIE(0.50, 0.49), the luminance of $2300\;Cd/m^{2}$ and the power efficiency of 0.7 lm/W at 10 V with the peak emission wavelength of 562 nm.

• Journal of the Semiconductor & Display Technology
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• v.6 no.2 s.19
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• pp.11-14
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• 2007

For the fabrication of blue color organic light emitting diodes(OLED) with a high performance, 2-TNATA [4,4',4"-tris (2-naphthylphenyl-phenylamino)-triphenylamine] as hole injection material and NPB [N,N'-bis (1-naphthyl) -N,N'-diphenyl-1,1'-biphenyl-4,4'-diamine] as hole transport material were deposited on the ITO (indium tin oxide)/glass substrate by the vacuum thermal evaporation. After then, blue color emission layer was deposited using TPM-BiP[(4'-Benzoylferphenyl-4-yl)phenyl-methanone-Diethyl(biphenyl-4-ymethyl)phosphonate] and GDI602 as a light emitting organic material. Finally, the two kinds of OLEDs with the structure of $ITO/2-TNATA/NPB/TPM-BiP/Alq_3/LiF/Al and ITO/2-TNATA/NPB/GDI602/Alq_3/LiF/Al$ were prepared by in-situ deposition. The maximum current density and luminance were found to be about $588\;mA/cm^2\;and\;5239\;cd/m^2$ at 12V for the OLED sample with the structure of $ITO/2-TNATA/NPB/TPM-BiP/Alq_3/LiF/Al$. Color coordinate of blue OLED was x=0.18, y=0.18 (at llV) and the maximum current efficiency was 2.82 cd/A (at 6V) with the peak emission wavelength of 440 nm.

• Journal of the Korean Electrochemical Society
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• v.18 no.1
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• pp.38-44
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• 2015

This review article summarizes the recent progress of quantum dot (QD)-sensitized solar cells based on mesoporous $TiO_2$ thin films. From the intrinsic characteristics of nanoscale inorganic QDs with various compositions, it was possible to construct a variety of 3rd-generation thin film solar cells by solution process. Depending on preparation methods, colloidal QD sensitizers are pre-prepared for later deposition onto the surface of $TiO_2$ or in-situ deposition of QDs from chemical bath is done for direct growth of QD sensitizers over substrates. Recently, colloidal QD sensitizers have shown an overall power conversion efficiency of ~7% by a very precise control of composition while a representative CdS/CdSe from chemical bath deposition have done ~5% with polysulfide electrolytes. In the near future, it is necessary to carry out systematic investigations for developing new hole-conducting materials and controlling interfaces within the cell, thus leading to an enhancement of both open-circuit voltage and fill factor while keeping the current high value of photocurrents from QDs towards more efficient and stable QD-sensitized solar cells.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.430-430
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• 2012

The surface recombination velocity of the silicon solar cell could be reduced by passivation with insulating layers such as $SiO_2$, SiNx, $Al_2O_3$, a-Si. Especially, the aluminium oxide has advantages over other materials at rear surface, because negative fixed charge via Al vacancy has an additional back surface field effect (BSF). It can increase the lifetime of the hole carrier in p-type silicon. The aluminium oxide thin film layer is usually deposited by atomic layer deposition (ALD) technique, which is expensive and has low deposition rate. In this study, ICP-assisted reactive magnetron sputtering technique was adopted to overcome drawbacks of ALD technique. In addition, it has been known that by annealing aluminium oxide layer in nitrogen atmosphere, the negative fixed charge effect could be further improved. By using ICP-assisted reactive magnetron sputtering technique, oxygen to nitrogen ratio could be precisely controlled. Fabricated aluminium oxy-nitride (AlON) layer on silicon wafers were analyzed by x-ray photoelectron spectroscopy (XPS) to investigate the atomic concentration ratio and chemical states. The electrical properties of Al/($Al_2O_3$ or $SiO_2/Al_2O_3$)/Si (MIS) devices were characterized by the C-V measurement technique using HP 4284A. The detailed characteristics of the AlON passivation layer will be shown and discussed.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.6
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• pp.574-579
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• 1999

A counter-flow type horizontal reactor of metal organic chemical vapor deposition was designed with the Reynolds and the Rayleigh numbers of Re = 4.5 and Ra = 215.8, respectively. The GaN thin films were grown and characterized by Hall measurement, double crystal X-ray diffraction analysis and photoluminescence measurement. The Si and Mg were also used for doping of GaN films. The dislocation density of $2.6{\times}10^8/\textrm {cm}^2$ was included in GaN films representing the geometrical lattice mismatch between sapphire substrates and GaN films. The Si doped n-GaN films provide the electron carrier density and mobility in the regions of $10^{17}~10^{18}/\textrm{cm}^3$ and 200~400 $\textrm{cm}^2$/V .sec, respectively. Mg doped p-GaN films were post-annealed and activated with the hole carrier density of $8{\times}10^{17}/{\textrm}{cm}^3$.

• Korean Chemical Engineering Research
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• v.43 no.1
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• pp.98-102
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• 2005

This article describes a study of chemical vapor deposition (CVD) of copper thin films on TiN substrates using (HFAC)Cu(DMB) as a precursor. The surface morphology and conformality of the Cu films as functions of substrate temperature and the presence or absence of iodine have been investigated. The surface roughness was increased significantly along with decrement of the step coverage by increasing the deposition temperature. The highest conformal films with the lowest surface roughness were obtained using the process of copper CVD, where iodine vapor were discretely introduced into the reactor during the growth of copper.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.96-96
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• 2016

나노섬유(nanofiber), 나노선(nanowire), 그리고 나노튜브(nanotube)와 같은 1차원 구조의(one-dimensional structure) 나노재료는 벌크(bulk) 및 박막(film) 재료와는 다르게 물리적, 화학적으로 특이한 성질을 가지고 있으며, 이러한 성질은 나노재료의 구조, 형상, 크기 등에 큰 영향을 받는다. 첫 째, 전기방사(electrospinning) 공정을 이용한 나노섬유의 합성; 용액의 특성, 전기장 세기, 방사시간 등의 변수를 조절하게 되면 방출되는 재료의 형상을 입자 혹은 섬유상의 형태로 얻을 수 있으며, 전기방사를 통해 합성된 나노재료의 소결 온도 및 시간을 달리함으로써 나노입자의 크기를 조절할 수 있다. 또한, 템플레이트 합성법(template synthesis) 및 이중노즐(coaxial nozzle)을 이용해 속이 빈 형태인 중공(hollow) 구조의 나노섬유를 얻을 수 있으며, 전기방사에 사용되는 전구물질에 원하는 금속 및 산화물을 첨가함으로써 복합체(composite) 나노섬유를 얻을 수 있다. 둘 째, VLS(Vapor-Liquid-Solid) 공정을 이용한 나노선의 성장; 온도, 압력, 전구물질의 양, 그리고 시간 등의 변수를 조절하게 되면 원하는 직경 및 길이를 갖는 나노선을 성장시킬 수 있다. 그리고 ALD(Atomic Layer Deposition)를 이용해 나노선에 추가적인 층을 형성함으로써 코어-셀 구조를 형성할 수 있으며, 감마선, UV와 같은 공정을 이용해 귀금속 촉매를 나노선에 기능화 시킬 수도 있다. 코어-셀 구조를 갖는 나노선/나노섬유는 코어 혹은 셀 층의 전자나 홀의 이동을 유발하여 전자공핍층(electron depletion layer) 또는 정공축적층(hole accumulation layer)을 확대 및 축소시켜 센서의 초기저항을 증가시키거나 감소시키는 역할로써 이용되고 있으며, 특히, 셀 층의 두께가 셀 층 재료의 Debye length와 유사한 크기를 갖게 되면, 셀 층은 완전공핍층(fully depleted layer)을 형성해 최대의 감도를 나타낼 수 있다. 본 연구에서는 다양한 제조 공정을 통해 제작될 수 있는 1차원 나노-구조물을 가스센서에 적용하는 사례들을 소개하고, 이러한 가스센서의 감응성능을 향상시키기 위한 방법의 한 가지로 원자층증착법으로 나노선/나노섬유의 표면에 셀층을 형성하여 감응성 향상 메커니즘 및 관련 주요 변수들을 조사하고자 한다.

• Journal of the Optical Society of Korea
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• v.13 no.1
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• pp.65-74
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• 2009

Device quality indium tin oxide (ITO) films are deposited on glass substrates and ultra-thin diamond-like carbon films are deposited as a buffer layer on ITO by a pulsed Nd:YAG laser at 355 nm and 532 nm wavelength. ITO films deposited at room temperature are largely amorphous although their optical transmittances in the visible range are > 90%. The resistivity of their amorphous ITO films is too high to enable an efficient organic light-emitting device (OLED), in contrast to that deposited by a KrF laser. Substrate heating at $200^{\circ}C$ with laser wavelength of 355 nm, the ITO film resistivity decreases by almost an order of magnitude to $2{\times}10^{-4}\;{\Omega}\;cm$ while its optical transmittance is maintained at > 90%. The thermally induced crystallization of ITO has a preferred <111> directional orientation texture which largely accounts for the lowering of film resistivity. The background gas and deposition distance, that between the ITO target and the glass substrate, influence the thin-film microstructures. The optical and electrical properties are compared to published results using other nanosecond lasers and other fluence, as well as the use of ultra fast lasers. Molecularly doped, single-layer OLEDs of ITO/(PVK+TPD+$Alq_3$)/Al which are fabricated using pulsed-laser deposited ITO samples are compared to those fabricated using the commercial ITO. Effects such as surface texture and roughness of ITO and the insertion of DLC as a buffer layer into ITO/DLC/(PVK+TPD+$Alq_3$)/Al devices are investigated. The effects of DLC-on-ITO on OLED improvement such as better turn-on voltage and brightness are explained by a possible reduction of energy barrier to the hole injection from ITO into the light-emitting layer.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.118-118
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• 2010

현재 반도체 제조 공정 중 많은 비중을 차지하는 식각 및 증착 공정에는 대부분 플라즈마를 사용하고 있으며, 이러한 반도체 장비내의 공정 부분품들은 수율과 생산성을 향상시키기 위하여 내플라즈마 특성이 우수한 세라믹 또는 세라믹 코팅막으로 구성되어 있다. 더욱이 최근에는 미세공정을 위해 고밀도 플라즈마 공정이 요구되면서, 노출된 세라믹 층이 침식되어 파티클이 떨어져 나오거나 모재와 세라믹 막 사이의 박리현상과 같은 심각한 문제들이 발생되고 있다. 따라서 보다 우수한 내플라즈마 특성을 갖는 세라믹 코팅 기술 개발이 시급한 실정이다. 현재 내플라즈마성 세라믹 코팅막 제조를 위한 코팅기술로서는 주로 용사법이 이용되고 있으나 기공률이 높고 치밀하지 못한 등의 문제점으로 인하여 사용수명이 짧다는 한계에 봉착하였다. 이에 본 연구에서는 상온에서 치밀하고 고속으로 세라믹 후막 형성이 가능한 Aerosol Deposition (AD)법과 AD법의 단점인 edge, corner, hole에서 코팅이 잘 안 되는 점을 보완할 수 있는 Arc Plasma Anodizing (APA)법을 조합하여, 상용화된 Al 모재위에 APA법을 사용하여 $Al_2O_3$ 후막 중간층을 형성한 뒤 그 위에 AD법으로 치밀한 $Al_2O_3$ 후막 성막함으로써 내 플라즈마 향상을 위한 새로운 개념의 제조기술개발을 시도하였다. 이를 위해 우선 Al 모재 위에 APA를 사용하여 중간층인 $Al_2O_3$막을 제조하였으며, 중간층의 두께에 따른 특성을 확인한 결과, $Al_2O_3$중간층의 두께가 두꺼워질수록 표면조도가 증가함을 확인 할 수 있었다. AD법으로 $Al_2O_3$중간층 위에 치밀한 $Al_2O_3$막을 제조하는데 있어 중요인자를 확인하기 위해, AD법으로 중간층 위에 $Al_2O_3$막을 제조한 후 성막특성을 관찰하였다. 그 결과, 중간층의 표면조도가 $0.8-1\;{\mu}m$인 경우에는 수 ${\mu}m$의 두께로 성막 되었으나, 표면조도가 $1\;{\mu}m$ 이상인 $Al_2O_3$중간층 위에서는 성막 되지 않았다. 이를 통해 AD법으로 치밀하고 두꺼운 $Al_2O_3$ 후막을 $Al_2O_3$중간층 위에 성막하기 위해서는 표면조도가 중요인자임을 확인하였다.

• Journal of the Korean Physical Society
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• v.81
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• pp.867-875
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• 2022

This paper explored the effect of deposition conditions on the characteristics of copper oxide (CuO_x) thin films prepared by direct current (DC) magnetron sputtering. X-ray diffraction exhibited that CuO with n-type conductivity was the main composition regardless of the DC magnetron sputtering power whereas the phase transition from n-type CuO to p-type Cu₂O was observed with decreasing the oxygen pressure (OP) from 40 to 20%. The optical band gap ranges of 1.6-1.9 eV, which are characteristic of n-type CuO, were determined for samples prepared with OPs of 30-40% while the optical band gap of 2.3 eV, which is characteristic of p-type Cu₂O, was measured for samples prepared with an OP of 20%. In addition, only Cu⁺ X-ray photoelectron spectroscopy (XPS) peak at the ~932.6 eV position exists in the films deposited with an OP of 20%, whereas only Cu²⁺ XPS peaks at ~934.2 eV and in the range of 940-945 eV are observed in the films deposited with an OP of 40%. Furthermore, as a result of XPS depth profile analysis, it was confirmed that the composition ratio of the sample prepared at an OP of 20% was Cu₂O, whereas the composition ratio of the sample prepared at an OP of 40% was CuO. These suggest that the CuO_x thin films could be constantly converted from n-type CuO to p-type Cu₂O by decreasing the oxygen partial pressure. Thin film transistors with Cu₂O deposited at 20% OP revealed p-type characteristics such as onset voltage (V_ON) of -3 V, saturated hole mobility of 8 cm²/Vs at V_GS = -28 V, subthreshold swing of 0.86 V/decade at V_GS-V_ON = -0.5 V, and on/off ratio of 1.14 × 10³.