• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 심포지엄 논문집 정보 및 제어부문
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• pp.102-104
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• 2006

Auto-Correlated time series (ATS) model was constructed by using the backpropagation neural network. The performance of ATS model was evaluated with sensor information collected from a large volume, industrial plasma-enhanced chemical vapor deposition system. A total of 18 sensor information were collected. The effect of inclusion of past and future information were examined. For all but three sensor information with a large data variance demonstrated a prediction error less than 4%. By integrating ATS model into equipment software, process quality can be more stringently monitored while improving device throughput.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.336-339
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• 2007

The enhanced control of OLED deposition processes by Organic Vapor Phase Deposition $(OVPD^{(R)})$ is discussed. $OVPD^{(R)}$ opens a wide space of process control parameters. It allows the accurate and individual control of deposition layer properties like morphology and precise mixing of multi component layers (co-deposition) in comparison to conventional deposition manufacturing processes like e. g. VTE (vacuum thermal evaporation).

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1140-1143
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• 2009

Organic Vapor Phase Deposition (OVPD) equipment enables the accurate and simultaneous control of deposition rates of multiple materials as well as their homogenous mixing in the gas phase. Graded or even cross-faded layers by varying carrier gas flow are options to improve OLED performances. As example, we will show how the efficacies of standard red phosphorescent OLEDs with sharp interfaces can be increased from 18.8 cd/A and 14.1 lm/W (1,000 cd/$m^2$) to 36.5 cd/A (+94 %, 18 % EQE) and 33.7 lm/W (+139 %) by the introduction of cross-fading, which is a controlled composition variation in the organic film.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1719-1721
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• 2007

Major display equipment suppliers have introduced equipment using ink jets for manufacturing steps such as printing the polyimide alignment layer and printing color filters. This paper will discuss the status of ink jets as precision deposition tools and the new technology being introduced for ink jet manufacturing.

• 한국진공학회지
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• 제12권2호
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• pp.112-117
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• 2003

MgO 박막은 PDP(plasma display panels)분야에서 널리 사용되어 왔다. 본 연구에서는, 기존에 사용되고 있는 e-beam evaporation, reactive magnetron sputtering법과 arc deposition법으로 MgO 보호막을 증착하여 구조적 · 광학적 특성을 비교하였다. 반응 가스인 산소 가스의 유입량을 변화시켜 Mg metal target을 이용하여 vacuum arc deposition equipment 의해 유리 기판 위에 증착하였다. Ellipsometer를 이용하여 치밀도를 측정하고, MgO보호막의 마모율(erosion rate)를 측정하기 위해 가속 실험 방법을 도입, Ar+ 이온빔에 의한 erosion test를 시행하여 내마모성을 알아보았다. 또한, XPS와 UV test를 사용하여 MgO보호막의 광투과도에 미치는 수분의 영향을 조사한 결과, arc evaporation 법이 광투과도 90%이상을 유지하여 수분의 영향에 둔감한 것을 알 수 있었다. 한편, XRD와 AFM을 이용하여 MgO 박막의 구조와 표면 형상에 대해 조사하였다.

• Applied Science and Convergence Technology
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• 제23권3호
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• pp.139-144
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• 2014

GaN deposition equipment and processes for the fabrication of white LEDs (Light Emitting Diode) using MOCVD (Metal Organic Chemical Vapor Deposition) were numerically modeled to analyze the effects of a reactive gas introduction strategy. The source gases, TMGa and $NH_3$, were injected from a shower head at the top of the chamber; the carrier gases, $H_2$ or $N_2$, were introduced using two types of injection structures: vertical and horizontal. Wafers sat on the holder at a radial distance between 100 mm and 150 mm. The non-uniformity of the deposition rates for vertical and horizontal injection were 4.3% and 3.1%, respectively. In the case of using $H_2$ as a carrier gas instead of $N_2$, the uniform deposition zone was increased by 20%.

• 한국세라믹학회지
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• 제56권3호
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• pp.277-283
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• 2019

We have examined minimization of the number of impurity particles by replacing the load-lock chamber materials of the chemical vapor deposition equipment through optimization of the pumping method in the deposition chamber. In order to reduce the number of impurity particles in the chamber, the load-lock spacer material was changed from monomer casting nylon to Torlon. Furthermore, we controlled the pumping speed and number of pumping ports, which resulted in a reduction in the impurity particle generation from 2.67% to 0.52%. This study revealed that the selection of the material for the parts of a chemical vapor deposition chamber can minimize particle generation, thereby presenting a method of optimization method of the chemical vapor deposition chamber.

• 반도체디스플레이기술학회지
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• 제22권2호
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• pp.133-137
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• 2023

This study the problem of deposition uniformity observed during Mist-CVD deposition experiments. The TRIZ's ADRIGE algorithm, a problem-solving technique, is utilized to systematically analyze the issue and propose solutions. Through problem and resource analysis, technical contradictions are identified regarding the precursor's volume and its path when it encounters the substrate. To resolve these contradictions, the concept of applying the principle of dimensional change to transform the precursor's three-dimensional path into a one-dimensional path is suggested. The chosen solution involves the design of an enhanced Mist-CVD system, which is evaluated for feasibility and analyzed using computational fluid dynamics. The analysis confirms that the deposition uniformity consistently follows a pattern and demonstrates an improvement in uniformity. The improved Mist-CVD equipment is validated through analysis, providing evidence of its feasibility and yielding satisfactory results.

• Corrosion Science and Technology
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• 제22권3호
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• pp.187-192
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• 2023

The use of biomass is increasing as a response to the convention on climate change. In Korea, a method applied to replace fossil fuels is using wood chips in a cogeneration plant. To remove air pollutants generated by burning wood chips, a selective denitrification facility (Selective catalytic reduction, SCR) is installed downstream. However, problems such as ash deposition and descaling of the equipment surface have been reported. The cause is thought to be unreacted ammonia slip caused by ammonia ions injected into the reducing agent and metal corrosion caused by an acidic environment. Element analysis confirmed that ash contained alkali metals and sulfur that could cause catalyst poisoning, leading to an increase in the size of ash particle and deposition. Measurement of the size of ash deposited inside the facility confirmed that the size of ash deposited on the catalyst was approximately three times larger than the size of generally formed ash. Therefore, it was concluded that a reduction in pore area of the catalyst by ash deposition on the surface of the catalyst could lead to a problem of increasing differential pressure in a denitrification facility.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.204-205
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• 2011

In thin film silicon solar cells, p-i-n structure is adopted instead of p/n junction structure as in wafer-based Si solar cells. PECVD is a most widely used thin film deposition process for a-Si:H or ${\mu}c$-Si:H solar cells. For best performance of thin film silicon solar cell, the dopant profiles at p/i and i/n interfaces need to be as sharp as possible. The sharpness of dopant profiles can easily achieved when using multi-chamber PECVD equipment, in which each layer is deposited in separate chamber. However, in a single-chamber PECVD system, doped and intrinsic layers are deposited in one plasma chamber, which inevitably impedes sharp dopant profiles at the interfaces due to the contamination from previous deposition process. The cross-contamination between layers is a serious drawback of a single-chamber PECVD system in spite of the advantage of lower initial investment cost for the equipment. In order to resolve the cross-contamination problem in single-chamber PECVD systems, flushing method of the chamber with NH3 gas or water vapor after doped layer deposition process has been used. In this study, a new plasma process to solve the cross-contamination problem in a single-chamber PECVD system was suggested. A single-chamber VHF-PECVD system was used for superstrate type p-i-n a-Si:H solar cell manufacturing on Asahi-type U FTO glass. A 80 MHz and 20 watts of pulsed RF power was applied to the parallel plate RF cathode at the frequency of 10 kHz and 80% duty ratio. A mixture gas of Ar, H2 and SiH4 was used for i-layer deposition and the deposition pressure was 0.4 Torr. For p and n layer deposition, B2H6 and PH3 was used as doping gas, respectively. The deposition temperature was $250^{\circ}C$ and the total p-i-n layer thickness was about $3500{\AA}$. In order to remove the deposited B inside of the vacuum chamber during p-layer deposition, a high pulsed RF power of about 80 W was applied right after p-layer deposition without SiH4 gas, which is followed by i-layer and n-layer deposition. Finally, Ag was deposited as top electrode. The best initial solar cell efficiency of 9.5 % for test cell area of 0.2 $cm^2$ could be achieved by applying the in-situ plasma cleaning method. The dependence on RF power and treatment time was investigated along with the SIMS analysis of the p-i interface for boron profiles.