• Publications of The Korean Astronomical Society
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• v.14 no.2
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• pp.69-78
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• 1999

We present the results of one-dimensional numerical simulations of SNR evolution in the in­homogeneous medium considering the effects of the evaporation of the cloud and the thermal conduction. We have included the effects of changing evaporation rate as a function of cloud size and the ambient temperature so that the clouds could be evaporated completely before they reach the center of the SNR. The heat conduction markedly changes the density distribution in the remnant interior. To explain the observed morphologies of the centrally peaked X-ray SNRs(for example W44), the maximal thermal conduction is required. However, this is unlikely due to the magnetic field and the turbulent motion. The effects of the evaporation of the cloud and the thermal conduction described here may explain the class of remnants observed to have centrally peaked X-ray emmision.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.34-46
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• 2002

Si-O-C-H films with a low dielectric constant were deposited on a p-type Si(100) substrate using a mixture gases of the bis-trimethylsilyl-methane (BTMSM) and oxygen by an inductively coupled plasma chemical vapor deposition (ICPCYD). High density plasma of about $~10^{12}\textrm{cm}^{-3}$ is obtained at low pressure (<400 mTorr) with rf power of about 300W in ICPCVD where the BTMSM and $O_2$ gases are fully dissociated. Fourier transform infrared (FTIR) spectra and X-ray photoelectron spectroscopy (XPS) spectra show that the film has $Si-CH_3$ and OH-related bonds. The void within films is formed due to $Si-CH_3$ and OH-related bonds after annealing at $500^{\circ}C$ for the as-deposition samples. The lowest relative dielectric constant of annealed film at $500^{\circ}C$ is about 2.1.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• Journal of the Korean earth science society
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• v.34 no.5
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• pp.407-414
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• 2013

This study presents the global star formation efficiency (SFE) of 272 local star-forming galaxies based on the HI gas mass, stellar mass, star formation rate (SFR), and morphology. The SFE increases as the stellar mass increases while the specific SFR decreases. The SFE is enhanced for galaxies with large H$\acute{a}$ equivalent widths, which is primarily due to the large SFR, not due to the large available amount of gas. The SFE is also enhanced by a factor of ~2 for merging systems compared to the normal spirals, showing that the merger-induced high pressure and density environment are crucial for the active star formation. Based on the SFR scaling relation, I present a SFR calibration formula using the HI gas mass.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2013.05a
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• pp.29-30
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• 2013

Steel corrosion is the most serious problem in RC structures. Even though patch repair method is normally applied in repair system, the effectiveness is not enough. Cathodic protection in active repair method to deteriorated RC structures. FEM model was developed to simulate the optimized cathodic protection condition. Iro oxidation, hydrogen evolution and oxygen reduction were considered to expect current distribution. Moisture content in concrete which can affect the electrolyte conductivity was used as initial condition.

• Proceeding of EDISON Challenge
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• 2016.03a
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• pp.336-338
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• 2016

Recent multifunctional two-dimensional material research has triggered huge interests in various modifications for substitution of atoms. Instead of novel metals used as the most popular catalysts, nonprecious transition metals are promising candidates for efficient oxidation-reduction transfers. The recent discovery of $Co@C_2N$ has an alternate possiblity as catalysts for the ORR(Oxygen Reduction Reaction) in DSSc(Dye Sensitized Solar Cell) and OER(Oxygen evolution cobalt oxides). Here we report spin-polarized DFT calculations of the structure doped Iron that is one of ferromagnetism atoms like Co to provide a basic desciption of the ferromagnetism of the elemental metals. The spin-density-funtional results present the most stable state energetically is when having pairwise up/down spin.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.557-558
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• 2006

In all conventional sintered PM products, the pores present are of two types, primary and secondary. Primary pores forming during compaction and latter during sintering, due to penetration of formed liquid through the matrix grain boundary. Effect of carbon addition on diffusion of Cu in SH737-2Cu system was investigated. After compaction and transient liquid phase sintering at $1120^{\circ}C$ and $1180^{\circ}C$, samples were characterized for densification, showing rise in sintering density and reduction in swelling on carbon addition. Quantitative microstructural characterization (shape factor and pore size) revealed bimodal distribution for 0% carbon, more rounded pores for 0.9% carbon and higher sintering temperature, and pore coarsening at higher sintering temperature.

• 한국연소학회:학술대회논문집
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• 2015.12a
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• pp.265-266
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• 2015

The multi-environment PDF model coupled with flamelet generated manifolds(FGM) has been developed for a large eddy simulation of turbulent partially premixed lifted flame. This approach has a capability to realistically account for the transport and evolution of probability density function for mixture fraction and progress variable with the manageable computational burden. Using the tabulated chemistry, it is possible to track radical distributions which is important to predict autoignition process with the vitiated coflow environment. Numerical results indicate that the present yields the good agreement with experimental data in terms of mixture fraction, temperature, and species mass fractions.

• Animal Systematics, Evolution and Diversity
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• v.14 no.2
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• pp.159-164
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• 1998

The spider, Tetragnatha squamata and its prey Empoasca vitis, the tea leafhopper, were investigated in laboratory on the prey-predator relationship. The predator spider showed a significant response to the increase of the prey. The predation effiency and the response of predator to its density were examined as well. The result of the experiments are give as questions.

• Animal Systematics, Evolution and Diversity
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• v.31 no.2
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• pp.86-94
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• 2015

The two zooxanthellate scleractinian corals are newly recorded in Korea: Psammocora albopicta Benzoni, 2006 of the family Psammocoridae and Oulastrea crispata (Lamarck, 1816) of the family Faviidae. These families are also newly recorded in Korea. Specimens were collected from the subtidal zones of Jeju-do Island, Korea by SCUBA diving from 1999 to 2014. Two scleractinians are described based on the morphological characters of skeletal structures. Psammocora albopicta is distinguished by its encrusting cerioid growth form, high density of corallites, small calicular diameter, single styliform columella, and fewer rows of enclosed septa. Oulastrea crispata is characterized by its encrusting plocoid growth form, polygonal calicular shape, irregular paliform lobes, and papillose columella.