• 한국정밀공학회지
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• 제22권2호
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• pp.164-171
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• 2005

This study aims to examine an effect of stacking sequence and curvature on the penetration characteristic of a composite laminated shell. For the purpose, we manufactured specimens with different stacking sequences and curvatures, and conducted a penetration test using an air-gun. To examine an influence according to stacking sequence, as flat plate and curvature specimen had more plies, their critical penetration energy was higher, Critical penetration energies of specimen A and C with less interfaces somewhat higher than those of B and D with more interfaces. The reason that with less interfaces, critical penetration energy was higher is pre-impact bending stiffness of composite laminated shell with less interfaces was lower than that of laminated shell with more interfaces, but bending stiffness after impact was higher. And it is because interface, the weakest part of the composite laminated shell, was influenced by transverse impact. As curvature increases, critical penetration energy increases linearly. It is because as curvature increases, resistance to in-plane deformation as well as bending deformation increases, which need higher critical penetration energy. Patterns of cracks caused by penetration of composite laminated shells include interlaminar crack, intralaminar crack, and laminar fracture. A 0$^{\circ}$ply laminar had a matrix crack, a 90$^{\circ}$ply laminar had intralaminar crack and laminar fracture, and interface between 0$^{\circ}$and 90$^{\circ}$laminar had a interlaminar crack. We examined crack length and delamination area through a penetration test. For the specimen A and C with 2 interface, the longest circumferential direction crack length and largest delamination area were observed on the first interface from the impact point. For the specimen B and D with 4 interface, the longest crack length and largest delamination area were observed on the third interface from the impact point.

• 자원환경지질
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• 제43권6호
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• pp.637-648
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• 2010

옥천대의 북동변인 주천 지역에 분포하는 송봉층(소위 방림층군)은 선캠브리아 시대의 경기육괴 기반암위에 부정합 관계로 분포하며, 조선누층군의 하부 지층에 대비된다. 이것은 영남육괴와 조선누층군의 관계가 옥천대 남동변에서 역시 부정합이라는 사실과 함께 옥천대 양쪽 경계부의 기반암이 최소한 고생대 초에는 하나였을 것임을 의미한다. 주천 지역에서는 세 번의 변형작용이 인지된다. 첫 번째 변형작용에 의해서 선캠브리아 시대의 화강암이 연성전단대를 따라서 북북동 방향으로 옥천대의 고생대층 상위로 이동하였다. 두 번째 변형작용은 남동방향을 향한 충상단층운동과 이에 수반된 누루하지단층으로 특징 지워진다. 특히 누루하지단층을 경계로 하여 북동쪽 지괴와 남서쪽 지괴 사이에 변형작용 분리가 발생하였다. 세 번째 변형작용은 누루하지단층을 수 km의 변위를 갖는 우수향 주향이동단층으로 재활성시켰다.

• KSTLE International Journal
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• 제4권2호
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• pp.47-51
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• 2003

Sliding wear tests have been carried out in room temperature air and water in order to compare the wear resistance of Zr-xNb-xSn alloys of various alloying elements (Nb and Sn). The main focus was to quantitatively compare the wear properties of the recently developed Zr-xNb-xSn alloys with the commercial ones using the evaluation parameters of the wear resistance with the consideration of the worn area. As a result, the recently developed alloys had a similar wear resistance compared with the commercial ones. The dominant factor governing the wear resistance was the protruded volume of the wear debris that was formed on the worn area in the air condition, but the accommodation of the plastic deformation on the contact area in water. In addition, the worn area size appeared to be very different depending on the tested alloys. To evaluate the wear resistance of each test specimen, the ratio of the wear volume or the protruded volume to the worn area ($D_e$ or $D_p$) is investigated and proposed as the evaluation parameters of the wear resistance.

• 한국생산제조학회지
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• 제9권3호
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• pp.48-54
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• 2000

In this study the characteristics of chip formation of the cold drawn Bi-S free machining steels were assessed. And for comparison those of the cold drawn Pb-S free machining steel the hot rolled low carbon steel which has MnS as free machining inclusions and the conventional steels were also investigated. During chip formation the cold drawn free machining steels show relatively little change in thickness and width of chip compare to those of the conventional carbon steels. And a single parameter which indicates the degree of deformation during chip formation chip cross-section area ratio is introduced. The chip cross-section area ratio is defined as chip cross-section area is divided by undeformed chip cross-section area. The variational patters of the chip cross-section area ratio of the materials cut are similar to those of the shear strain values. The shear stress however seems to be dependent on the carbon content of the materials. The cold drawn Bi-S and Pb-S steels show nearly the same chip forming behaviors and the energy consumed during chip formation is almost same. A low carbon steel without free machining aids shows poor chip breakability due to its high ductility. By introducing a small amount of free machining inclusions such as MnS Bi, Pb or merely increasing carbon content the chip breakability improves significantly.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
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• pp.351-356
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• 1999

In this study, the characteristics of chip formation of the cold drawn Bi-S free machining steels were assessed. And for comparison, those of the cold drawn Pb-S free machining steel, the hot rolled low carbon steel which has MnS as free machining inclusions and the conventional steels were also investigated. During chip formation, the cold drawn free machining steels show relatively little change in thickness and width of chip compare to those of the conventional carbon steels. And a single parameter which indicates the degree of deformation during chip formation, 'chip cross-section area ratio' is introduced. The chip cross-section area. The variational patterns of cross-section area is divided by undeformed chip cross-section area. The variational patterns of the chip cross-section area ratio of the materials cut are similar to those of the shear strain values. The shear stress, however, seems to be dependent on the carbon content of the materials. The cold drawn BiS and Pb-S steels show nearly the same chip forming behaviors and the energy consumed during chip formation is almost same. A low carbon steel without free machining aids shows poor chip breakability due to its high ductility. By introducing a small amount of non-metallic inclusions such as MnS, Bi, Pb or merely increasing carbon content the chip breakability improves significantly.

• 한국의류학회지
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• 제10권1호
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• pp.47-57
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• 1986

The purpose of this study is to investigate fatigue phenomema of woven fabric. In order to obtain the basic data which is available for predicting the fabric fatigue phenomena, the change of mechanical properties of woven fabrics caused by the wearing and the changes of mechanical properties of woven fabrics which were subjected to repeated tensile-shearing deformation using fabric testing machine has been investigated and compared. The fatigue of woven fabrics was examined with the value of basic mechanical properties of specimens measured by the KES-F fabric testing system and their hand value and wearing ability. The results were as follows. 1) The fatigue phenomena of woven fabrics by the wearing for 800 hours are different on the position of the body: On the portion of hip, the change of surface property was the greatest, bending hysterisis was greatly increased, thickness weight, stiffness, fullness shearing hysterisis were more increased than original fabric and T.H.V. was decreased. On the portion of knee, decreasing of tensile resilience and increasing of bending, shearing hysterisis were observed greater than any other part, and increasing of stiffness, crispness was more than original fabric. On the bottom area, the changes of mechanical property was comparatively small, H.V. and T.H.V. showed near the value of the original fabric. 2) By drycleaning most of mechanical properties showed the tendency to recover the value of the original fabric, but bending hysterisis and thickess were increased, tensile and com-pression resilience were decreased more than original fabric in all parts. 3) The fatigue phenomena caused by fabric fatigue testing machine were as follows. The decreasing of hystersis in the repeated deformation such as bending, shearing was appeared at the $10^2$ deformation, but with the increasing cycle, the tendency was slightly regained. Handle value was also appeared the lowest value at the $10^2$ deformation.

• 대한기계학회논문집A
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• 제37권7호
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• pp.891-897
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• 2013

본 논문에서는, 고 변형률 속도에서의 알루미늄 합금의 압축 변형거동을 홉킨슨 압력봉 시험, SHPB 방법을 통해 연구하였다. 이와 함께 음향방출기법이 사용되었고, 웨이브 가이드선을 통해 시편에 연결된 AE 센서를 이용하여 충격 변형시 검출되는 AE 신호를 실시간으로 검출하였다. 검출된 AE 신호를 통해 진폭, 에너지 및 최대 주파수 특성을 분석하였다. 또한 손상 기구에 따른 음향방출신호의 특성을 분석하기 위하여 시험 수행 후 충돌 시험편 표면과 측면을 관찰하였다. 변형률이 높아질수록 AE 진폭과 AE 누적에너지는 증가하였고, AE 최대 주파수는 감소하였다. 각 신호의 특성은 재료의 손상 기구와 밀접한 관련이 있는 것으로 확인되었다.

• 한국가스학회지
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• 제16권5호
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• pp.47-51
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• 2012

본 연구에서는 3가지의 서로 다른 단면형상을 갖는 밀봉 링의 변형거동 안정성을 FEM으로 해석하였다. NBR 소재로 제조한 밀봉 링의 변형거동 안정성을 고찰하기 위해 초기 압축률로 25%를 적용하였다. 작동유체의 압력을 최대 $25kgf/cm^2$까지 올렸을 때 발생한 최대변형률, 최대응력, 최대접촉법선응력을 해석하였다. FEM 결과에 의하면, 밀봉 링의 중심부에 빈 공간을 확보한 중공오링과 중공사각링의 최대 변형률은 기존 오링에 비해 높아졌지만, 최대응력과 최대접촉법선응력은 떨어지는 것으로 나타났다. 결국, 밀봉 링이 장수명의 내구 안정성을 확보하기 위해서는 중심부에 빈 공간을 확보하는 것이 권장된다. 그렇지만, 접촉식 밀봉 링의 밀봉 안전성을 확보하기 위해서는 밀봉 링을 하나의 몸체로 설계하는 것이 바람직하다.

• 한국정밀공학회지
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• 제29권5호
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• pp.563-571
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• 2012

In 3D integration package using TSV technology, bonding is the core technology for stacking and interconnecting the chips or wafers. During bonding process, however, warpage and high stress are introduced, and will lead to the misalignment problem between two chips being bonded and failure of the chips. In this paper, a finite element approach is used to predict the warpages and stresses during the bonding process. In particular, in-plane deformation which directly affects the bonding misalignment is closely analyzed. Three types of bonding technology, which are Sn-Ag solder bonding, Cu-Cu direct bonding and SiO2 direct bonding, are compared. Numerical analysis indicates that warpage and stress are accumulated and become larger for each bonding step. In-plane deformation is much larger than out-of-plane deformation during bonding process. Cu-Cu bonding shows the largest warpage, while SiO2 direct bonding shows the smallest warpage. For stress, Sn-Ag solder bonding shows the largest stress, while Cu-Cu bonding shows the smallest. The stress is mainly concentrated at the interface between the via hole and silicon chip or via hole and bonding area. Misalignment induced during Cu-Cu and Sn-Ag solder bonding is equal to or larger than the size of via diameter, therefore should be reduced by lowering bonding temperature and proper selection of package materials.

• 한국터널지하공간학회 논문집
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• 제18권6호
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• pp.557-568
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• 2016

심부 터널을 굴착하는 동안 발생할 수 있는 현상인 압출은 큰 소성 변형과 터널 축소 그리고 지보 붕괴를 일으킬 수 있다. 따라서 압출 현상의 발생 가능성과 변형량, 응력 변화의 정량적 예측은 합리적인 시공 방안을 수립하기 위하여 매우 중요하다. 본 연구는 변형률 연화 구성모델을 이용한 3차원 수치해석을 수행하여 압출 거동을 합리적으로 모사하고 변형량과 소성 범위 등을 정량적으로 예측하고자 하였다. 다양한 범위의 응력 조건과 강도 조건의 42가지 경우에 대한 해석을 수행한 결과 최대접선응력과 암반강도비가 소성 변형량과 소성 깊이를 합리적으로 예측할 수 있었으며 이들의 관계식을 제안하였다.