• 마이크로전자및패키징학회지
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• 제27권3호
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• pp.35-39
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• 2020

Nonwet (Head in Pillow) 불량은 SMT(surface mount technology) 공정 불량 유형 중 하나로 이 불량은 solder paste misalign, reflow 조건, package warpage, package ball size 등과 같은 인자에 따라 불량이 발생을 한다. 이에 본 논문은 Nonwet 발생 인자 중 ① reflow 조건 ② package ball & solder paste misalign ③ package ball 크기 type에 대한 인자를 선정하여 nonwet 실험을 진행하였다. 먼저 reflow 조건의 경우 soldering 시간이 길 경우 nonwet risk가 증가를 하나, reflow 공정에 N₂를 적용할 시 solder ball 산화 억제에 따른 nonwet 개선을 확인 할 수 있었다. 또한 package ball과 solder paste misalign 발생 시 ball과 paste의 접촉 깊이가 20 ㎛ 이하의 경우 nonwet에 취약 했으며, package ball 체면적이 작을수록 nonwet 관점 개선됨을 확인 할 수 있었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1891-1894
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• 1999

We can classify the scratches after CMP process into micro-scratch and macro-scratches according to the scratch size, scratch intensity and defect map, etc. The micro-scratches on wafer after CMP process are discussed in this paper. From many causes, major factor that influences the formation of micro-scratch is known as particle size distribution of slurry.(1) It is indefinite what size or type of particle can cause micro-scratch on wafer surface, but there is possibility caused by large particle over 1um. The best way for controlling these large particle to inflow is to use the slurry filter on POU(Point of user). But the slurry filter(especially, depth-type filter) has sometimes the problem which makes more sever micro-scratches on wafer surface after CMP. We studied that depth-type slurry filter has what kind of week-points and the number of scratch could be reduced by lowering slurry flow rate and by using high spray bar which sprays DIW on polishing pad with high pressure.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1507-1510
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• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• KSII Transactions on Internet and Information Systems (TIIS)
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• 제14권3호
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• pp.1086-1103
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• 2020

The automatic identification and classification of image-based weld defects is a difficult task due to the complex texture of the X-ray images of the weld defect. Several depth learning methods for automatically identifying welds were proposed and tested. In this work, four different depth convolutional neural networks were evaluated and compared on the 1631 image set. The concavity, undercut, bar defects, circular defects, unfused defects and incomplete penetration in the weld image 6 different types of defects are classified. Another contribution of this paper is to train a CNN model "RayNet" for the dataset from scratch. In the experiment part, the parameters of convolution operation are compared and analyzed, in which the experimental part performs a comparative analysis of various parameters in the convolution operation, compares the size of the input image, gives the classification results for each defect, and finally shows the partial feature map during feature extraction with the classification accuracy reaching 96.5%, which is 6.6% higher than the classification accuracy of other existing fine-tuned models, and even improves the classification accuracy compared with the traditional image processing methods, and also proves that the model trained from scratch also has a good performance on small-scale data sets. Our proposed method can assist the evaluators in classifying pipeline welding defects.

• Archives of Reconstructive Microsurgery
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• 제18권1호
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• pp.35-39
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• 2009

Purpose: Various techniques have been attempted for design of the flaps. However, there are some disadvantages. They have thin, pliable, and two dimensional methods. The aim of this study is to report usefulness of polyurethane foam dressing materials for three dimensional design of the digital island flap. Methods: From June of 2007 to september of 2008, 10 patients received digital island flap surgery for soft tissue defect of the finger. After minimal debridement of the wound, size and shape of the defect were measured using polyurethane foam. We used Medifoam-$5^{(R)}$ And then, designed this inset the wound. The flap was designed on the donor site with a arterial pedicle as the central axis according to size and shape. A full thickness skin graft from the groin is applied on the flap donor defect and secured with a tieover bolster dressing. Results: Reviewing sizes of the flaps, the length and width of flaps ranged from 1.5 to 3.3 cm and 1.0 to 2.5 cm. The PACS(Picture Archiving Communication System) program allows identification of the donor depth of finger. The distance for the soft tissue ranged from 4.3 mm to 6.7 mm. Mean depth of donor site was 5.3${\pm}$0.6 mm. Also, the thickness of Medifoam-$5^{(R)}$ ranged nearly 5 mm. On flap insetting, full-thickness skin graft was necessary. We did not experience any problems in the recipient site size either, regardless of the extended flaps. Conclusion: Polyurethane foam has many advantages over the more conventional templates. Refinements in flap design and surgical technique resulted in favorable functional and cosmetic results. Especially, for beginner, Polyurethane foam dressing material is a simple and safe tool and therefore is an excellent choice for design of the island flap.

• 한국정밀공학회지
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• 제23권8호
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• pp.171-177
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• 2006

This study was performed as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-{\mu}m$-deep indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.51 GPa and 104 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$ ) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46- 0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined are a during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• 한국세라믹학회지
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• 제28권6호
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• pp.495-501
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• 1991

This study is intended to make defect-free region, denuded zone at the silicon wafer surface for semiconductor device substrates. In this experiment, initial oxygen concentration of starting material CZ-grown silicon wafer, various heat treatment combinations, denuding ambient and the amounts of oxygen reduction were measured, and then denuded zone (DZ) formation and depth were investigated. In Low/High anneal (DZ formation could be achieved), the optimum temperature for Low anneal was 700$^{\circ}C$∼750$^{\circ}C$. In case of High anneal, with the time increased, DZ depth was increased at 1000$^{\circ}C$, 1150$^{\circ}C$ respectively, but on the contrary, DZ depth was decreased at low temperature 900$^{\circ}C$. As well, out-diffusion time below 2 hours was unsuitable for effective Gettering technique even though the temperature was high, and DZ formation could be achieved when initial oxygen concentration was only above 14 ppm in silicon wafer.

• 한국가스학회지
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• 제16권2호
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• pp.18-24
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• 2012

본 연구는 Type II 가스실린터의 20,000 회 피로시험과 파열시험시 음향방출시험을 병행하여 용기의 손상정도를 평가하고자 하였으며, 실험에 사용된 용기는 결함 크기가 $3mm{\times}3mm{\times}50mm$ (폭${\times}$깊이${\times}$길이)이고 결함 방향이 용기의 종방향 및 횡방향인 인공결함용기와 건전한 용기 등 세 종류이다. 피로시험시 발생된 음향방출신호는 종방향결함의 경우 전체 신호 중 결함에서 발생된 이벤트의 비율이 50 % 이상이며, 음향방출신호의 위치표정도 매우 정확하게 일치하였다. 또한 파열시험에서는 인공결함용기가 결함 위치에서 에상파열압력보다 낮은 압력으로 파열될거라는 예상과는 달리 인공결함용기의 파열압력은 건전한 용기와 큰 차이가 없었으며, 단지 종방향 인공결함용기의 경우 파열위치가 결함 위치와 근접하게 발생하였다. 이는 종방향 결함의 길이만큼 복합재료의 두께가 얇아지는 효과로 나타나게 되어 금속라이너의 피로반복시 결함 발생과 성장위치에 영향을 미친 것으로 판단된다.

• 한국정보통신학회논문지
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• 제17권4호
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• pp.1010-1019
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• 2013

최근 완전한 3차원 입체시를 구현하는 홀로그램에 대한 연구가 활발해지고 있으나, 홀로그램은 생성 비용이 많이 들어 콘텐츠의 확보가 어려운 단점을 갖고 있다. 이에 본 논문에서는 생성된 디지털 홀로그램 콘텐츠를 저작하여 새로운 디지털 홀로그램 콘텐츠를 확보하는 방법을 제시한다. 이 방법은 깊이정보를 조작하거나 합성하여 새로운 디지털 홀로그램 콘텐츠를 저작하는 방법이다. 제안한 방법을 검증하기 위해 여러 종류의 깊이정보를 조작하여 위치와 거리를 변경하고, 이를 컴퓨터-생성 홀로그램으로 만든 후 복원한 결과 조작한 위치와 거리에 정확히 물체상이 복원되는 것을 확인하였다.

• Imaging Science in Dentistry
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• 제42권4호
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• pp.243-247
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• 2012

Purpose: This study was performed to compare the inverted digital images and film-based images of dry pig mandibles to measure the periodontal bone defect depth. Materials and Methods: Forty 2-wall bone defects were made in the proximal region of the premolar in the dry pig mandibles. The digital and conventional radiographs were taken using a Schick sensor and Kodak F-speed intraoral film. Image manipulation (inversion) was performed using Adobe Photoshop 7.0 software. Four trained examiners made all of the radiographic measurements in millimeters a total of three times from the cementoenamel junction to the most apical extension of the bone loss with both types of images: inverted digital and film. The measurements were also made in dry mandibles using a periodontal probe and digital caliper. The Student's t-test was used to compare the depth measurements obtained from the two types of images and direct visual measurement in the dry mandibles. A significance level of 0.05 for a 95% confidence interval was used for each comparison. Results: There was a significant difference between depth measurements in the inverted digital images and direct visual measurements (p>|t|=0.0039), with means of 6.29 mm ($IC_{95%}$:6.04-6.54) and 6.79 mm ($IC_{95%}$:6.45-7.11), respectively. There was a non-significant difference between the film-based radiographs and direct visual measurements (p>|t|=0.4950), with means of 6.64mm($IC_{95%}$:6.40-6.89) and 6.79mm($IC_{95%}$:6.45-7.11), respectively. Conclusion: The periodontal bone defect measurements in the inverted digital images were inferior to film-based radiographs, underestimating the amount of bone loss.