• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.529-530
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• 2013

• Journal of the Korean Society for Precision Engineering
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• v.26 no.7
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• pp.22-30
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• 2009

• Journal of the Optical Society of Korea
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• v.18 no.3
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• pp.283-287
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• 2014

Square lattice nano-hole arrays with diameters and periodicities of 200 and 500 nm, respectively, are fabricated on InGaN/GaN blue light emitting diodes (LEDs) using electron-beam lithography and inductively coupled plasma reactive ion etching processes. Cathodoluminescence (CL) investigations show that light emission intensity from the LEDs with the nano-hole arrays is enhanced compared to that from the planar sample. The CL intensity enhancement factor decreases when the nano-holes penetrate into the multiple quantum wells (MQWs) due to the plasma-induced damage and the residues. Wet chemical treatment using KOH solution is found to be an effective method for light extraction from the nano-patterned LEDs, especially, when the nano-holes penetrate into the MQWs. About 4-fold CL intensity enhancement factor is achieved by the KOH treatments after the dry etching for the sample with a 250-nm deep nano-hole array.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.103-108
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• 2021

The TCD is used as one of the indicators for determining whether TSV Hole is defective. If the TCD is not normal size, it can lead to contamination of the CMP equipment or failure to connect the upper and lower chips. We propose a deep learning model for measuring the TCD. To verify the performance of the proposed model, we compared the prediction results of the proposed model for 2461 via holes with the CD-SEM measurement data and the prediction results of the existing model. Although the number of trainable parameters in the proposed model was about one two-thousandth of the existing model, the results were comparable. The experiment showed that the correlation between CD-SEM and the prediction results of the proposed model measured 98%, the mean absolute difference was 0.051um, the standard deviation of the absolute difference was 0.045um, and the maximum absolute difference was 0.299um on average.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.10
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• pp.65-72
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• 1998

The BTA drilling chip is better for deep hole drilling than other self-piloting with pad drilling chips because the large length to diameter ratio allows a unique cutting force dispersion and better supplies the high pressure fluid. Therefore the BTA is useful for many tasks, such as coolant hole drilling of large scale dies, as well as tube seat drilling, which is essential for the heat exchanger, and variable component drilling for automobiles. Deep hole drilling has several significant problems, such as hole deviation, hole over-size, circularity, straightness, and surface roughness. The reasons for these problems, which often result in quality short comings, are an alignment of the BTA drilling system and the unbalance of cutting force by work piece and tool shape. This paper analyzes the properties through an experiment which com¬pared single-edge BTA drills with multiple-edge BTA drills, as well as the shapes of the tools to cause an unbalance of cutting force, and its effect on the precision of the worked hole. Conclusions are as follows. 1) In SMSSC drilling, 60m/min of BTA with single and multi-edged tools proved the best cutting condition and the lowest wear character. 2) The roundness got a little worse as cutting speed was increased, but surface roughness was hot affected. 3) It was proved that the burnishing torque of both drills approached 26%. which is almost the same as the 24% insisted on by Griffiths, and the dispersion characteristic of the multi-edged BTA drill proved better than the single-edge BTA drill.

• Journal of the Semiconductor & Display Technology
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• v.2 no.3
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• pp.7-11
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• 2003

In this research, the etching characteristics of via contact and deep contact hole have been studied using multi-pole inductively coupled plasma(MICP) etching system. We investigated Plasma density of MICP source using the Langmuir probe and etching characteristics with RF frequency, wall temperature, chamber gap, and gas chemistry containing Carbon and Fluorine. As the etching time increases, formation of the polymer increases. To improve the polymer formation, we controlled the temperature of the reacting chamber, and we found that temperature of the chamber was very effective to decrease the polymer thickness. The deep contact etch profile and high selectivity(oxide to photoresist) have been achieved with the optimum mixed gas ratio containing C and F and the temperature control of the etching chamber.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.96.5-96
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• 2001

The probe with a 110mm diameter is originated and fabricated to measure hole accuracies of extremely deepholes. It consists of a measuring unit, an actuator unit, an active rotation stopper and a feed unit. The rolling of the probe is restricted and adjusted by the active rotation stopper. The probe is fed by the feed unit. In this measurement, accuracies are measured by using a rolling proof apparatus and machine table of deep hole boring machine instead of the stopper and the feed unit, respectively. Straightness, roundness and a diameter of a 110-mm hole are measured by the probe and testers made for each measuring purpose ...

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.275-280
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• 2001

Recently, the trends of industrial products grow more miniaturization, variety and mass production. Micro drilling which take high precision in cutting work is requested more micro hole and high speed working. Especially, Micro deep hole drilling is becoming more important in a wide spectrum of precision production industries, ranging from the production of automotive fuel injection nozzle, watch and camera parts, medical needles, and thick multi-layered Printed Circuit Boards(PCB) that are demanded for very high density electric circuitry. This paper shows the tool monitoring results of micro drill with tool dynamometer. And additionally, microscope with built-in monitor inspection show the relationship between burr in workpiece and chip form of micro drill machining.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.7 s.172
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• pp.47-53
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• 2005

Microholes with high aspect ratio are required in microstructures. Among various methods for producing the microhole, micro electrical discharge machining (MEDM) is very effective and useful process. But, it is difficult to machine the high aspect ratio holes below $100\;{\mu}m$ in diameter because machining condition becomes unstable due to bad removal of debris at deep hole. In this paper, ultrasonic vibration is applied to MEDM work fluid to make a high aspect ratio micro hole. It is shown that the vibration is effective in circulating the debris and increasing the machining rate. As a result, produced was a micro hole with $92\;{\mu}m$ entrance diameter, $81\;{\mu}m$ exit diameter and aspect ratio 23.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.842-846
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• 1997

Micro-hole drilling (holes less than 0.5 mm in diameter with aspect ratios larger than 10) is gaining increased attention in a wide spectrum of precision production industries. Alternative methods such as EDM, laser drilling, etc. can sometimes replace mechanical micro-hole drilling but are not acceptable in PCB manufacture because they yield inferior hole quality and accuracy. The major difficulties in micro-hold drilling are related to wandering motions during the inlet stage, high aspect ratios, high temperature,etc. However, of all the difficulties, the most undesirable one is the increase of drilling force as the drill penetrates deeper into hold. This is caused mainly by chip related effects. Peck-drilling is thus widely used for deep hole drilling despite the fact that it leads to low productivity. Therefore, in this paper, a method of cutting force regulation is proposed to achieve continuous drilling. A proportional plus derivative (PD) and a sliding modecontrol algorithm will be implemented for controlling the spinle rotational frequeency. Experimental results will show that sliding mode control reduces the nominal cutting force and its variation better than the PD control, resulting in a number of advantages such as an increase in drill life, fast stabilization of the wandering motion, and precise positioning of the hole.