• Journal of the Speleological Society of Korea
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• no.80
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• pp.21-24
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• 2007

The need for high-frequency decoupling capacitors to supply the transient current requirements to high-speed devices is ubiquitous in current microelectronics applications. Even though materials and their processes have already been developed in terms of their performances, low manufacturing cost cannot be overemphasized in current microelectronics industry. For this reason, we revisited low cost ceramic filled polymer integrated capacitor. Experiments were performed according to the design of experiment (DOE). The best recipe that has the optimized ratio of material composite was obtained using by response optimizer in Minitab. And also, high-frequency measurements were performed to get frequency dependent data using network analyzer.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2002.11a
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• pp.340-343
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• 2002

Electromagnetic(EM) radiation problems and their possible solutions are addressed in this paper for the split power plane of high-speed digital systems. Stitching and decoupling capacitors are proved to be very effective fur reducing signal noise, ground bounce as well as electromagnetic radiation from the split power plane. Simulations based on 3D-Finite Difference Time Domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC main board

• Journal of electromagnetic engineering and science
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• v.2 no.2
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• pp.75-80
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• 2002

Signal integrity problems and their possible solutions are addressed in this paper for split power plane of high-speed digital systems. Stitching and decoupling capacitors are proved to be very effective for reducing signal noise, ground bounce as well as electromagnetic radiation from the split power plane. Simulations based on 3D-Finite Difference Time Domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC main board.

• ETRI Journal
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• v.32 no.2
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• pp.265-272
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• 2010

To supply a power distribution network with stable power in a high-speed mixed mode system, simultaneous switching noise caused at the multilayer PCB and package structures needs to be sufficiently suppressed. The uni-planar compact electromagnetic bandgap (UC-EBG) structure is well known as a promising solution to suppress the power noise and isolate noise-sensitive analog/RF circuits from a noisy digital circuit. However, a typical UC-EBG structure has several severe problems, such as a limitation in the stop band's lower cutoff frequency and signal quality degradation. To make up for the defects of a conventional EBG structure, a partially located EBG structure with decoupling capacitors is proposed in this paper as a means of both suppressing the power noise propagation and minimizing the effects of the perforated reference plane on the signal quality. The proposed structure is validated and investigated through simulation and measurement in both frequency and time domains.

• Journal of the Korean Society for Railway
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• v.10 no.2 s.39
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• pp.96-102
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• 2007

This paper presents a study on the control of a power quality compensating equipment of electrical railway built in small-scaled to preliminary research. Because this compensating equipment is very complicated power electronics system, consisting of a scott transformer as a power source, four single phase inverters interconnected with DC-link capacitors and various electrical apparatuses, multiple controllers and control algorithms with high performance and reliability are needed. The major function of the compensating equipment is to manage reactive and active powers by using the four single phase inverters, so, the main control effort is focused on the power flow control which realized through the decoupling current control of the four inverters. Overall control system is designed with object oriented and analyzed on a Simulink window. The simulation results show that the design scheme is very effective for a complicated control system and the proposed controller has good performance.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.2
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• pp.142-145
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• 2018

In this paper, we present a design technique for the suppression of common-mode(CM) noise in switched-mode power supply boards using the segmentation method. By applying the segmentation method, the example structure is decomposed into two segments with decoupling capacitors and a recombination matrix is extracted for the segments. The effects of the decoupling capacitor on CM noise suppression are examined. The simulation time is significantly reduced on using the segmentation method.

• Journal of Power Electronics
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• v.17 no.2
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• pp.411-421
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• 2017

An approach based on a 2D lumped model is presented to quantify the voltage transfer gain (VTG) in power converter low power planes. The advantage of the modeling approach is the ease with which typical noise reduction devices such as decoupling capacitors or ferrite beads can be integrated into the model. This feature is enforced by a new modular approach based on effective matrix partitioning, which is presented in the paper. This partitioning is used to decouple power plane equations from external device impedance, which avoids the need for rewriting of a whole set of equation at every change. The model is quickly solved in the frequency domain, which is well suited for an automated layout optimization algorithm. Using frequency domain modeling also allows the integration of frequency-dependent devices such inductors and capacitors, which are required for realistic computation results. In order to check the precision of the modeling approach, VTGs for several layout configurations are computed and compared with experimental measurements based on scattering parameters.

• Proceedings of the KIPE Conference
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• 2019.07a
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• pp.207-209
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• 2019

This paper proposes a grid-tied photovoltaic (PV) system, consisting of Voltage-fed dual-active-bridge (DAB) dc-dc converter with single phase inverter. The proposed converter allows a small dc-link capacitor, so that system reliability can be improved by replacing electrolytic capacitors with film capacitors. The double line frequency free maximum power point tracking (MPPT) is also realized in the proposed converter by using Ripple Correlation method. First of all, to eliminate the double line frequency ripple which influence the reduction of DC source capacitance, control is developed. Then, a designing of Current control in DQ frame is analyzed and to fulfill the international harmonics standards such as IEEE 519 and P1547, $3^{rd}$ harmonic in the grid is directly compensated by the feedforward terms generated by the PR controller with the grid current in stationary frame to achieve desire Total Harmonic Distortion (THD). 5-kW PV converter and inverter module with a small dc-link film capacitor was built in the laboratory with the proposed control and MPPT algorithm. Experimental results are given to validate the converter performance.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.319-319
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• 2013

Even though the fabrication methods of metal oxide based thin film capacitor have been well established such as RF sputtering, Sol-gel, metal organic chemical vapor deposition (MOCVD), ion beam assisted deposition (IBAD) and pulsed laser deposition (PLD), an applicable capacitor of printed circuit board (PCB) has not realized yet by these methods. Barium Strontium Titanate (BST) and other high-k ceramic oxides are important materials used in integrated passive devices, multi-chip modules (MCM), high-density interconnect, and chip-scale packaging. Thin film multi-layer technology is strongly demanded for having high capacitance (120 nF/$mm^2$). In this study, we suggest novel multi-layer thin film capacitor design and fabrication technology utilized by plasma assisted deposition and photolithography processes. Ba0.6Sr0.4TiO3 (BST) was used for the dielectric material since it has high dielectric constant and low dielectric loss. 5-layered BST and Pt thin films with multi-layer sandwich structures were formed on Pt/Ti/$SiO_2$/Si substrate by RF-magnetron sputtering and DC-sputtering. Pt electrodes and BST layers were patterned to reveal internal electrodes by photolithography. SiO2 passivation layer was deposited by plasma-enhanced chemical vapor deposition (PE-CVD). The passivation layer plays an important role to prevent short connection between the electrodes. It was patterned to create holes for the connection between internal electrodes and external electrodes by reactive-ion etching (RIE). External contact pads were formed by Pt electrodes. The microstructure and dielectric characteristics of the capacitors were investigated by scanning electron microscopy (SEM) and impedance analyzer, respectively. In conclusion, the 0402 sized thin film multi-layer capacitors have been demonstrated, which have capacitance of 10 nF. They are expected to be used for decoupling purpose and have been fabricated with high yield.

• Journal of Power Electronics
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• v.17 no.4
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• pp.942-952
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• 2017

Modular multilevel converters (MMCs) have been receiving extensive research interest in high/medium-voltage applications due to its modularity, scalability, reliability, high-voltage capability, and excellent harmonic performance. Submodule capacitors are usually rather bulky because they have to withstand fundamental frequency voltage fluctuations. To reduce the capacitance of these capacitors, this study proposes a modified MMC with an active power decoupling circuit within each submodule. The modified submodule contains an auxiliary half bridge, with its capacitor split in two. Also, the midpoints of the half bridge and the split capacitors are connected by an inductor. With this modified submodule, the fundamental frequency voltage fluctuation can be suppressed to a great extent. The second-order voltage fluctuation, which is the second most significant component in submodule voltage fluctuations, is removed by the proper control of the second-order circulating current. Consequently, the submodule capacitance is significantly reduced. The viability and effectiveness of the proposed new MMC are confirmed by the simulation and experimental results. The proposed MMC is best suited for medium-voltage applications where power density is given a high priority.