• Journal of Electrical Engineering and Technology
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• v.13 no.4
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• pp.1638-1643
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• 2018

Multi-layer ceramic capacitors as decoupling capacitor were fabricated by dielectric composition with a high dielectric constant. The fabricated decoupling capacitors were embedded in the PCB of the 10G RF transceiver module and evaluated for the characteristics of electrical noise by the level of AC input voltage. In order to further improve the electrical properties of the $BaTiO_3$ based composite, glass frit, MgO, $Y_2O_3$, $Mn_3O$, $V_2O_5$, $BaCO_3$, $SiO_2$, and $Al_2O_3$ were used as additives. The electrical properties of the composites were determined by various amounts of additives and optimum sintering temperature. As a result of the optimized composite, it was possible to obtain a density of $5.77g/cm^3$, a dielectric constant of 1994, and an insulation resistance of $2.91{\times}10^{12}{\Omega}$ at an additive content of 5wt% and a sintering temperature of $1250^{\circ}C$. After forming a $2.5{\mu}m$ green sheet using the doctor blade method, a total of 77 layers were laminated and sintered at $1180^{\circ}C$. A decoupling capacitor with a size of $0.6mm(W){\times}0.3mm(L){\times}0.3mm(T)$ (width, length and thickness, respectively) and a capacitance of 100 nF was embedded using a PCB process for the 10G RF Transceiver modules. In the range of AC input voltage 400mmV @ 500kHz to 2200mV @ 900kHz, the embedded 10G RF Transceiver modules evaluated that it has better electrical performance than the non-embedded modules.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.92.1-92.1
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• 2007

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.2
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• pp.202-211
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• 2014

The bulk current injection (BCI) and direct power injection (DPI) method have been established as the standards for the electromagnetic susceptibility (EMS) test. Because the BCI test uses a probe to inject magnetically coupled electromagnetic (EM) noise, there is a significant difference between the power supplied by the radio frequency (RF) generator and that transferred to the integrated circuit (IC). Thus, the immunity estimated by the forward power cannot show the susceptibility of the IC itself. This paper derives the real injected power at the failure point of the IC using the power transfer efficiency of the BCI method. We propose and mathematically derive the power transfer efficiency based on equivalent circuit models representing the BCI test setup. The BCI test is performed on I/O buffers with and without decoupling capacitors, and their immunities are evaluated based on the traditional forward power and the real injected power proposed in this work. The real injected power shows the actual noise power level that the IC can tolerate. Using the real injected power as an indicator for the EMS test, we show that the on-chip decoupling capacitor enhances the EM noise immunity.

• Journal of Power Electronics
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• v.16 no.5
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• pp.1894-1903
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• 2016

In general, electrolytic capacitors are used to reduce power pulsations on PV-panels. However, this can reduce the reliability of the PV AC-module system, because electrolytic capacitors have a shorter lifetime than PV-panels. In addition, PV-panels generate irregular power and inject it into the grid because the output power of a PV-panel depends on the surrounding conditions such as irradiation and temperature. To solve these problems, a grid-connected photovoltaic (PV) AC-module with active power decoupling and energy storage is proposed. A parallel bi-directional converter is connected to the AC module to reduce the output power pulsations of PV-panels. Thus, the electrolytic capacitor can be replaced with a film capacitor. In addition, the irregular output power due to the surrounding conditions can be regulated by using a parallel energy storage circuit. To maintain the discontinuous conduction mode at low irradiation, the frequency control method is adopted. The design method of the proposed converter and the operation principles are introduced. An experimental prototype rated at 125W was built to verify the performance of the proposed converter.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2002.11a
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• pp.324-327
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• 2002

For the characterization of arbitrary shaped printed circuit board, lossy transmission line grid model based on SPICE netlist and analytical plane model based on the segmentation method are proposed in this paper. Two methods are compared with an arbitrary shaped power/ground plane. Furthermore, design considerations for the complete power distribution network structure are discussed to ensure the maximum value of the PDN impedance is low enough across the desired frequency range and to guide decoupling capacitor selection.

• Proceedings of the KIPE Conference
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• 2015.07a
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• pp.419-420
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• 2015

In this paper, a low-cost single-phase PWM rectifier with small DC-link capacitors is proposed, where a buck-boost converter with a low power rating is added at the DC link. By controlling the auxiliary circuit so as to absorb the voltage ripple in the DC link, the second-order voltage ripple in DC-link capacitor can be reduced significantly. Therefore, a small film capacitor can be utilized to replace the bulky electrolytic capacitors. The simulation results are shown to verify the validity of the proposed method.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.4
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• pp.918-923
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• 2008

We proposed an embedded capacitor with the unique electrode structure, which electrodes are located on the same plane and dielectric gap was formed by electrodes. We named it 'Gap type EC', and it was analyzed by the FEM(Finite element Method) program tool. The resonant frequency of Cap type EC was obtained at more higher frequency region. Also, resonant frequency was changed with the magnitude and thickness of electrodes. The Gap type EC with the dielectric gap of $50{\mu}m$ showed capacitance density of $55pF/cm^2$. This value is the higher than that of conventional EC. So, we concluded that the Gap type EC can be a good candidate for high frequency decoupling.

• Journal of IKEEE
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• v.23 no.2
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• pp.474-478
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• 2019

In this paper, we analyze the degradation of receiving sensitivity due to the coupling between digital noise and mobile handset antenna using characteristic mode. First, we analyze the coupling mechanism between the antenna and digital noise, and analyze the role of the decoupling capacitor of the ground signal line, which is one of the ways to improve the antenna receiving sensitivity degradation due to camera noise. For the analysis, the digital signal line and the ground line of the FPCB of the camera module are modeled as a loop type feeder that excites the characteristic mode of the PCB ground, and improved model which has a ground line with a capacitor are analyzed.

• The Transactions of the Korean Institute of Power Electronics
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• v.26 no.4
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• pp.277-284
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• 2021

A single and three phase-compatible single-stage EV charger without electrolytic capacitor is proposed in this study. DC battery-charging current is inherently guaranteed in the three-phase grid due to three output currents with a phase shift of 120° between each other. The proposed EV charger can provide a DC battery charging current for the single-phase grid through the integrated active power decoupling circuit without using additional switches. The proposed EV charger ensures ZVS turn-on of all switches with wide grid and battery voltage ranges. The 11 kW prototype of the proposed EV charger demonstrates a peak efficiency of 97.01% and a power density of 5.58 kW/L.

• Journal of electromagnetic engineering and science
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• v.2 no.2
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• pp.68-74
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• 2002

In this paper, a pre-layout design approach for high-speed microprocessor is proposed. For multilayer PCB stark up configuration as well as selection and placement of decoupling capacitors, an effective solution for reducing SSN and EMI is obtained by modeling and simulation of complete power distribution system. The system model includes VRM, decoupling capacitors, multiple power and ground planes for core voltage, vias, as well as microprocessor. Finally, the simulation results are verified by measurements data.