• 대한치과보철학회지
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• 제38권3호
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• pp.336-347
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• 2000

Statement of problem. Luster loss in esthetic anterior ceromer restoration can occur and can be related with rough surface texture. Understanding durability of surface finishing methods like polishing and surface coating have critical importance. Purpose. This study evaluated the effect of tooth brushing and thermal cycling on surface luster of 3 ceromer systems (Artglass, Targis, Sculpture) treated with different surface finishing methods. Material and methods. Seventy-two samples were prepared: 12 for control group Z100, 12 for Artglass, 24 for Targis, and 24 for Sculpture. Half of the Targis and Sculpture were polished according to the manufacturer's recommendation. The rest of the samples were coated with staining and glazing solution for Targis and Sculpture, respectively. All specimens were subjected to 10,000 cycles between $5^{\circ}C\;and\;55^{\circ}C$ with 30 seconds dwell time. Tooth brushing abrasion tests were performed in a customized tooth brushing machine with 500g back and forth for 20,000 cycle. Luster comparisons were based on grading after direct observation, and light reflection area was measured with Image analysis software. Results. All materials showed an decrease in luster grade after thermal cycling and tooth brushing. The post-tooth brushing results revealed that the glazed Sculpture had greater mean luster grade than did any other groups. While, the stained Targis group showed greatest changes after tooth brushing (p < 0.05), polished Targis and Sculpture did not show significant changes. However, glazed Sculpture showed discretely fallen out glaze resin. Conclusion. From the results of this study, all of the ceromer specimens were much glossy than control composite group after tooth brushing. coatings used for Targis and Sculpture had not durability for long term use.

• 대한치과보철학회지
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• 제31권4호
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• pp.482-505
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• 1993

The purpose of this study was to evaluate the fracture characteristics and the effect of resin bonding of laminate porcelain. In order to characterize the indentation-induced crack, Young's moduli and characteristic indentation dimensions were measured. The fatigue life under three point flexure test was measured using the electro-dynamic type fatigue machine, and the crack propagation with thermocycling was investigated on the condition of 15 second dwell time each in $5^{\circ}C\;and\;55^{\circ}C$ bath. The Vickers indentation pattern and the fracture surface were examined by an optical microscope and a scanning electron microscope (SEM). The results obtained were summarized as follows ; 1. Young's moduli(E) of the laminate porcelain and the resin cement used in this experiment were $62.56{\pm}3.79GPa$ and $15.01{\pm}0.12GPa$, respectively. 2. The initial crack size of the laminate porcelain was $69.19{\pm}5.94{\mu}m$ when an indentation load of 9.8N was applied, and the fracture toughness was $1.065{\pm}0.156MPa\;m^{1/2}$. 3. The fatigue life of laminate porcelain showed the constant fracture range at the stress level 27.46-35.30MPa. 4. When a cyclic flexure load was applied, the fatigue life of resin-bonded laminate porcelain was more decreased than that of laminate porcelain. 5. When a thermocycling was conducted, the crack growth rate of resin-bonded laminate porcelain was more increased than that of laminate porcelain. 6. Fracture surface showed the radial crack, the lateral crack, and the macroscopic crack branching region beneath the plastic deformation region when an indentation load of 9.8N was applied.

• 대한치과보철학회지
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• 제34권2호
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• pp.233-245
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• 1996

The purpose of this study was to evaluate the effect of thermocycling on bond strength between metal and resin cement according to thermocycling, and to observe the bond failure modes with optical microscope(X30). For this purpose, Super-Bond C & B and Panavia 21 resin cement were used. Metal specimens were made of Vera-Bond and the surface of specimens were sandblasted with $50{\mu}m$ aluminum oxide. All experimental groups were stored in $37^{\circ}C$ distilled water for 72 hours, followed by thermocycling between $5^{\circ}C$ and $55^{\circ}C$ with 15 second dwell time. 500, 1000, 2000 cycles of thermocycling were executed and the tensile bond strength was measured by Instron Universal Testing Machine(Model 4201) The obtained results were as follows : 1. Super-Bond C & B and Panavia 21 did not show statistically significant difference accor-ding to thermocycling test(P>0.05). 2. Super-Bond C & B specimens exhibited statistically significant higher tensile bond stre-ngth than Panavia 21 for all experimental groups(P<0.05). 3. Super-Bond C & B exhibited mixed mode failure with partial adhesive and partial cohe-sive failure, and most of Panavia 21 exhibited cohesive failure and some mixed mode failure.

• 한국전자파학회논문지
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• 제25권12호
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• pp.1275-1283
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• 2014

PCM(Pulse Code Modulation) 파형은 펄스에 특정 code를 실어 보내는 형태로 추적에 적합한 특성을 가진다. 특히 단일 펄스의 송수신만으로 표적의 탐지 및 추적이 가능하므로, 여러 임무를 수행해야 하는 다기능 레이다(MFR: Multi-Function Radar)에서는 시간 측면에서 효율적이다. 하지만 PCM 파형은 모호성 함수(ambiguity function) 의 특성으로 인해 표적을 탐지하고, 거리와 속도 정보를 얻기 위해서 도플러 필터 뱅크(Doppler filter bank)가 필요하다. 본 논문에서는 계산량과 하드웨어 측면에서 한계가 있는 도플러 필터 뱅크를 사용하는 대신, ML(Maximum Likelihood) 기반의 도플러 추정 방법을 고안하였다. 제안한 알고리즘은 폐형(closed form) 수식의 suboptimal 방법으로 적은 계산량으로 정확한 도플러 주파수를 추정할 수 있고, 이를 기반으로 표적의 탐지에 적용할 수 있다.

• Tribology and Lubricants
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• 제35권6호
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• pp.330-336
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• 2019

Conditioning is a process involving pad surface scraping by a moving metallic disk that is electrodeposited with diamond abrasives. It is an indispensable process in chemical-mechanical planarization, which regulates the pad roughness by removing the surface residues. Additionally, conditioning maintains the material removal rates and increases the pad lifetime. As the conditioning continues, the pad profile becomes unevenly to be deformed, which causes poor polishing quality. Simulation calculates the density at which the diamond abrasives on the conditioner scratch the unit area on the pad. It can predict the profile deformation through the control of conditioner dwell time. Previously, this effect of the diamond shape on conditioning has been investigated with regard to microscopic areas, such as surface roughness, rather than global pad-profile deformation. In this study, the effect of diamond shape on the pad profile is evaluated by comparing the simulated and experimental conditioning using two conditioners: a) random-shaped abrasive conditioner (RSC) and b) uniform-shaped abrasive conditioner (USC). Consequently, it is confirmed that the USC is incapable of controlling the pad profile, which is consistent with the simulation results.

• 감성과학
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• 제16권2호
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• pp.235-248
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• 2013

운전자의 신경증 수준에 따른 상황인식과 안구운동 및 운전수행에서의 차이를 비교하였다. 정적인 운전장면을 실험자극으로 사용한 실험 1에서는 신경증 수준에 따른 상황인식에서의 차이는 유의하지 않았던 반면, 안구운동의 경우 신경증 저집단에 비해 고집단이 실험자극의 주변영역에 대해 안구고정 시간비율과 안구고정 빈도비율이 모두 낮았다. 실험 2에서는 운전 시뮬레이터를 이용하여 실험참가자들이 실제 상황에 가깝게 운전하도록 한 후, 신경증 수준에 따른 상황인식, 안구운동, 그리고 운전수행 측정치에서의 차이를 비교하였다. 그 결과, 실험 1의 결과와는 대조적으로 신경증 고집단은 저집단에 비해 상황인식 점수가 상대적으로 낮았던 반면, 실험 1의 결과와 마찬가지로 신경증 실험자극의 주변영역에 대한 안구고정 시간비율과 안구고정 빈도비율이 상대적으로 낮았다. 특히, 운전수행 측정치에 대한 비교 결과, 신경증 고집단이 저집단에 비해 차선중앙 이탈값이 더 컸고 평균 운전속도도 더 느렸다.

• 전자공학회논문지C
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• 제36C권10호
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• pp.39-46
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• 1999

본 논문에서는 광대역 CDMA 무선 가입자망 시스템에서 초기 동기획득을 위한 단말기용 고속 탐색기의 새로운 하드웨어 구조를 제안한다. 제안된 고속 탐색기는 이중 적분 직렬 동기 획득 알고리즘을 사용하였고, 고속의 동기 획득을 위해 N개의 능동 상관기로 구성되었다. N개의 능동 상관기는 하드웨어 복잡도의 증가를 줄이기 위해서 하나의 에너지 계산기를 순차적으로 사용하는 파이프라인 기법으로 설계되었다. 제안된 무선 가입자망 시스템 단말기용 고속 탐색기는 광대역 무선 가입자망 규격에 맞게 VHDL로 설계되었고, JTC Wideband 채널 환경에서 검증되었다. 제안된 고속 탐색기의 평균 동기획득 시간은 상관기를 16개 사용하였을 때, 단말기가 처음 설치된 경우는 약 40초이었고, 단말기가 고정된 경우는 약 0.16초였다. 검증된 고속 탐색기는 LG의 0.6㎛ 라이브러리를 이용하여 게이트 수준으로 합성되었고, 합성된 탐색기의 게이트 수는 상관기가 16개 일 때 15.8K였다.

• 마이크로전자및패키징학회지
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• 제14권4호
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• pp.9-14
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• 2007

본 연구에서는 가속화 조건에서의 비전도성 접착제가 사용된 플립칩 패키지의 열적 신뢰성에 관하여 평가하였다. 실리콘 칩에 $17{\mu}m$두께의 Au 범프를 형성하고 무전해 Ni/Au 도금과 Cu 패드의 두께가 각각 $5{\mu}m$와 $25{\mu}m$로 형성된 연성 기판을 사용하여 플립칩 패키지를 형성하였다. 유리전이온도가 $72^{\circ}C$인 비전도성 접착제를 사용하여 플립칩을 접합시킨 후 열충격 시험과 항온항습 시험을 실시하였다. 열충격 싸이클과 항온항습 유지 시간이 증가할수록 플립칩 패키지의 전기 저항이 증가하는 것을 확인할 수 있었다. 이는 Au 범프와 Au 범프 사이의 균열, 칩과 비전도성 접착제 또는 기판과 비전도성 접착제 사이의 층간 분리에 의한 것으로 사료된다. 또한 항온항습 하에서의 전기 저항의 변화가 열충격하에서 보다 큰 것을 확인할 수 있었다. 따라서 비전도성 접착제가 사용된 플립칩 패키지는 온도보다 습기에 더욱 민감하다는 것을 알 수 있었다.

• 대한치과보철학회지
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• 제33권4호
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• pp.662-684
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• 1995

The purpose of this study was to evaluate the shear bond strength between various resin-bonded retainers and enamel according to the adhesive resins and retention types and observe the bond filure modes with scanning electron microscope(SEM). For this purpose, the followin eight sub-groups were tested in shear bond strength : 1) electrochemically etched group(Verabond) using Panavia EX and Superbond C&B 2) tin-plated group(PG-S) using Panavia EX and Superbond C&B 3) salt-treated group(Verabond) using Panavia EX and Superbond C&B 4) meshtreated group(Verabond) using Panavia EX and Superbond C&B. Thermocycling test was conducted on the condition of 15 second dwell time each in $5^{\circ}C$ and $55^{\circ}C$bath. Shear bond strength was measured by Instron Universal Testing Machine(medel 1125). The obtained results were as follows : 1. After thermocycling, the shear bond strengths of tin-plated group and electrochemically etched group were significantly greater than those of salt-treated group and mesh-treated group. And the shear bond strength of Panavia EX was greater than that of Superbond C&B with salt-treated group and tin-plated group(p<0.05). 2. Before thermocycling, electrochemically etched group using Superbond C&B produced the greatest shear bond strength(p<0.01). 3. The shear bond strength of electrochemically etched group using Superbond C&B was significantly decreased after thermocycling(p<0.01). 4. In observation of bond failure modes before thermocycling, Panavia EX highly exhibited enamel fracture. Tin-plated group using Superbond C&B adhesive failure between metal and resin and electrochemically etched group using Superbond C&B exhibited adhesive failure between enamel and rdsin. 5. In observation of failure modes after thermocycling, Panavia EX exhibited cohesive failure and Superbond C&B exhibited adhesive failure between resin and metal.

• 한국재료학회지
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• 제17권3호
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.