• Bulletin of the Korean Chemical Society
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• 제32권3호
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• pp.847-851
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• 2011

This study examined In-Zn-Sn-O (IZTO) films deposited on glass substrates by pulsed DC magnetron sputtering with various substrate temperatures. The structural, electrical, optical properties were analyzed. Xray diffraction showed that the IZTO films prepared at temperatures > $150^{\circ}C$ were crystalline which adversely affected the electrical properties. Amorphous IZTO films prepared at $100^{\circ}C$ showed the best properties, such as a low resistivity, high transmittance, figure of merit, and high work function of $4.07{\times}10^{-4}\;{\Omega}$, 85%, $10.57{\times}10^{-3}\;{\Omega}^{-1}$, and 5.37 eV, respectively. This suggests that amorphous IZTO films deposited at relatively low substrate temperatures ($100^{\circ}C$) are suitable for electrode applications, such as OLEDs as a substitute for conventional crystallized ITO films.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.419-420
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• 2008

In this study, high quality (Al,N)-codoped p-type ZnO thin films were obtained by DC magnetron sputtering. The film on buffer layer grown in 80% $N_2$ ambient shows highest hole concentration of $2.93\times10^{17}cm^{-3}$. The films show hole concentration in the range of $1.5\times10^{15}$ to $2.93\times10^{17}cm^{-3}$, resistivity of 131.2 to 2.864 $\Omega$cm, mobility of 3.99 to 31.6 $cm^2V^{-1}s^{-1}$. The films on Si show easier p-doping in ZnO than those on buffer layer. The film on Si shows the highest quality of optical photoluminescence (PL) characteristics. The donor energy level $(E_d)$ of (Al,N)-codoped ZnO films is about 50 meV and acceptor energy level $(E_a)$ is in the range of 63 to 71 meV. It will help to improve p-type ZnO films.

• Transactions on Electrical and Electronic Materials
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• 제10권3호
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• pp.89-92
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• 2009

High-quality Al-N doped p-type ZnO thin films were deposited on Si and buffer layer/Si by DC magnetron sputtering in a mixture of $N_2$ and $O_2$ gas. The target was ceramic ZnO mixed with $Al_2O_3$ (2 wt%). The p-type ZnO thin films showed a carrier concentration in the range of $1.5{\times}10^{15}{\sim}2.93{\times}10^{17}\;cm^{-3}$, resistivity in the range of 131.2${\sim}$2.864 ${\Omega}cm$, mobility in the range of 3.99${\sim}$31.6 $cm^2V^{-1}s^{-l}$, respectively. It was easier to dope p-type ZnO films on Si substrates than on buffer layer/Si. The film grown on Si showed the highest quality of photoluminescence (PL) characteristics. The Al donor energy level depth $(E_d)$ of Al-N codoped ZnO films was reduced to about 50 meV, and the N acceptor energy level depth $(E_a)$ was reduced to 63 meV.

• 한국결정성장학회지
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• 제12권6호
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• pp.283-287
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• 2002

초고집적 반도체 회로에서 Cu를 배선으로 쓰이기 위한 Cu 금속과 Si 기판사이의 확산방지막으로써 Zr(Si)N 박막을 연구하였다. Zr(Si)N 박막증착은 DC magnetron sputter으로 $Ar/N_2$의 혼합 gas를 사용한 reactive sputtering 방법을 이용하였다. 상온에서 ZrN 박막 증착시 Ar gas와 NE gas 비율이 48 : 2일 때 가장 낮은 비저항값을 가졌으며, 증착시 기판의 온도의 증가에 따라서 비저항값이 낮아졌다. 비저항값이 감소된 ZrN 박막일수록 (002)면의 방향성을 갖는 결정이 성장되었다. ZrN 박막의 Cu 확산방지 특성은 ZrN 박막에 Si을 첨가함으로써 개선될 수 있으며 지나치게 첨가될 경우에는 오히려 확산방지 특성이 감소되었다. 접착력 특성에서는 ZrN에 Si의 함유량이 증가함에 파라 개선되었다. 증착막의 특성은 XRD, 광학 현미경, scretch tester 그리고 $\alpha$-step 등을 사용하여 분석하였다.

• 센서학회지
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• 제6권2호
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• pp.81-86
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• 1997

DC 마그네트론 스퍼터링을 이용하여 측온저항체 온도센서용 백금박막을 $Al_{2}O_{3}$ 기판위에 증착시켰다. 열처리 온도, 시간이 증가할수록 박막의 비저항 및 면저항은 감소하였다. Lift-off 방법을 이용하여 $Al_{2}O_{3}$ 기판위에 백금 저항체를 만들었으며, 텅스텐 wire, 실버 에폭시 그리고 SOG를 이용하여 백금박막 측온저항체 온도센서를 제작하였다. $25{\sim}400^{\circ}C$의 온도범위에서 백금박막 측온저항체 온도센서의 저항온도계수와 저항 변화율을 조사한 결과, 열처리 온도, 시간 및 박막의 두께가 증가할수록 저항온도계수가 증가하였으며 측정 온도범위 내에서 저항값은 선형적인 변화를 보였다. 열처리 온도 $1000^{\circ}C$, 시간 240분 그리고 박막두께 $1{\mu}m$ 조건에서 백금의 벌크에 가까운 $3825ppm/^{\circ}C$의 저항온도계수값을 얻을 수 있었다.

• 한국진공학회지
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• 제12권2호
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• pp.136-143
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• 2003

본 논문은 비질량분리형 이온빔증착법에 이용하기 위한 고순도의 고주파 스퍼터타입 이온소스에 대한 특성을 평가했다. 고주파 구리 코일과 고순도 (99.9999 %)의 구리 타겟으로 이루어진 이온소스에 대한 기본적인 특성과 ULSI금속배선용 구리 박막으로의 응용가능성에 대해서 고찰하였다. 구리 타겟에 걸어주는 전압에 따른 구리 타겟에 흐르는 전류 특성을 고주파 전원 또는 아르곤 가스 압력을 변화시키면서 특성을 평가한 후 구리박막제작을 위한 조건에 대해서 고찰하였다. 박막 증착을 위한 기본적인 조건으로써, 타겟의 전압 -300 V와 고주파 전원 240 W, 그리고 아르곤 압력 9 Pa이 정해졌으며, 이 같은 조건에서 기판 바이어스 -50 V에서 증착된 구리 박막의 비저항값은 1.8 $\pm$ 0.1 $mu\Omega$cm로 이는 구리 벌크의 저항값(1.67 $\pm$ 0.1 $\mu\Omega$cm)에 근접한 값임을 알 수 있었다.

• 한국초전도ㆍ저온공학회논문지
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• 제23권2호
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• pp.1-5
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• 2021

We have investigated the electrical transport properties of polycrystalline tantalum nitride (TaN_x) films. Various compositions of tantalum (nitride) thin films have been deposited on SiO₂ substrates by reactive DC magnetron sputtering while changing the ratio of nitrogen partial pressure. The substrate temperature was maintained at 283 K during deposition. X-ray diffraction analyses indicated the presence of α-Ta and β-Ta phases in the Ta film deposited in pure argon atmosphere, while fcc-TaN_x phases appeared in the sputtering gas mixture of argon and nitrogen. The N/Ta atomic ratio in the film increased ranging from 0.36 to 1.07 for nitrogen partial pressure from 7 to 20.7%. The superconducting transition temperatures of the TaN_x thin films were measured to be greater than 3.86 K with a maximum of 5.34 K. The electrical resistivity of TaN_x thin film was in the range of 177-577 𝜇Ωcm and increased with an increase in nitrogen content. The upper critical filed at zero temperature for a TaN_0.87 thin film was estimated to exceed 11.3 T, while it showed the lowest T_c = 3.86 K among the measured superconducting TaN_x thin films. We try to explain the behavior of the increase of the residual resistivity and the upper critical field for TaN_x thin films with the nitrogen content by using the combined role of the intergrain Coulomb effect and disorder effect by grain boundaries.

• 한국세라믹학회지
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• 제42권3호
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• pp.211-217
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• 2005

펄스 마그네트론 스퍼터링법을 이용하여 Co농도 변화에 따라 유리 기판 위에 ZnJ-xcoxo 박막을 제조하였다. Co 농도의 증가에 따라 $Zn_{1-x}Co_{x}O$ 박막의 c축 결정 배향성은 향상되었다. 표면 형상 분석을 통하여 매우 치밀한 박막이 성장되었음을 찰 수 있었다. 박막의 UV-visible투과율 측정 결과, $Co^{2+}$ 이온에 의한 sp-d상호교환 작용과 d-d 천이를 확인할 수 있었다. $Zn_{1-x}Co_{x}O$ 박막의 비저항은 $10^{-2}\~10^{-3}\;\Omega{\cdot}cm$의 값을 가지며 Co농도의 증가에 따라 박막의 비저항은 증가하였고, 특히 $30\;at\%$ Co에서는 박막의 결정성 저하로 인하여 급격한 비저항 증가가 발생하였다. X-ray photoelecoon specooscopy분석을 통해 Co와 O 간의 결합 상태를 확인하였으며, alternating gradient magnetometer측정 결과 $Zn_{1-x}Co_{x}O$ 박막의 상온 강자성 치력 현상을 관찰할 수 있었다. 낮은 비저항 및 상온 강자성 이력 특성을 갖는 $Zn_{1-x}Co_{x}O$ 박막은 자성 반도체 소자로의 응용 가능성을 나타내었다 .

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.379-380
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• 2007

The characteristics of a co-sputtered indium zinc tin oxide (IZTO) films prepared by dual target dc magnetron sputtering from IZO and ITO targets at a room temperature are investigated. Film properties, such as sheet resistance, optical transmittance, surface work function and surface roughness were examined as a function of ITO dc power at constant IZO dc power of 100 W. It was shown that the increase of the ITO dc power during co-sputtering of ITO and IZO target resulted in an increase of sheet resistance of the IZTO films. This can be attributed to high resistivity of ITO film prepared at room temperature. Surface smoothness and roughness were investigated by Scanning Electron Microscopy (SEM) and Atomic Force Microscopy (AFM). The synchrotron x-ray scattering results obtained from IZTO film with different ITO contents showed that introduction of ITO atoms into amorphous IZO film resulted in a crystallization of IZTO film with (222) preferred orientation due to low alc transition temperature of ITO film. However, the transmittance of the IZTO films with thickness of 150 nm is between 80 and 85 % at wavelength of 550 nm regardless of ITO content. Possible mechanism to explain the ITO and IZO co-sputtering effect on properties of IZTO is suggested.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.288-289
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• 2011

Indium Tin Oxide (ITO) is a typical highly Transparent Conductive Oxide (TCO) currently used as a transparent electrode material. Most widely used deposition method is the sputtering process for ITO film deposition because it has a high deposition rate, allows accurate control of the film thickness and easy deposition process and high electrical/optical properties. However, to apply high quality ITO thin film in a flexible microelectronic device using a plastic substrate, conventional DC magnetron sputtering (DMS) processed ITO thin film is not suitable because it needs a high temperature thermal annealing process to obtain high optical transmittance and low resistivity, while the generally plastic substrates has low glass transition temperatures. In the room temperature sputtering process, the electrical property degradation of ITO thin film is caused by negative oxygen ions effect. This high energy negative oxygen ions(about over 100eV) can be critical physical bombardment damages against the formation of the ITO thin film, and this damage does not recover in the room temperature process that does not offer thermal annealing. Hence new ITO deposition process that can provide the high electrical/optical properties of the ITO film at room temperature is needed. To solve these limitations we develop the Magnetic Field Shielded Sputtering (MFSS) system. The MFSS is based on DMS and it has the plasma limiter, which compose the permanent magnet array (Fig.1). During the ITO thin film deposition in the MFSS process, the electrons in the plasma are trapped by the magnetic field at the plasma limiters. The plasma limiter, which has a negative potential in the MFSS process, prevents to the damage by negative oxygen ions bombardment, and increases the heat(-) up effect by the Ar ions in the bulk plasma. Fig. 2. shows the electrical properties of the MFSS ITO thin film and DMS ITO thin film at room temperature. With the increase of the sputtering pressure, the resistivity of DMS ITO increases. On the other hand, the resistivity of the MFSS ITO slightly increases and becomes lower than that of the DMS ITO at all sputtering pressures. The lowest resistivity of the DMS ITO is $1.0{\times}10-3{\Omega}{\cdot}cm$ and that of the MFSS ITO is $4.5{\times}10-4{\Omega}{\cdot}cm$. This resistivity difference is caused by the carrier mobility. The carrier mobility of the MFSS ITO is 40 $cm^2/V{\cdot}s$, which is significantly higher than that of the DMS ITO (10 $cm^2/V{\cdot}s$). The low resistivity and high carrier mobility of the MFSS ITO are due to the magnetic field shielded effect. In addition, although not shown in this paper, the roughness of the MFSS ITO thin film is lower than that of the DMS ITO thin film, and TEM, XRD and XPS analysis of the MFSS ITO show the nano-crystalline structure. As a result, the MFSS process can effectively prevent to the high energy negative oxygen ions bombardment and supply activation energies by accelerating Ar ions in the plasma; therefore, high quality ITO can be deposited at room temperature.