• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.725-728
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• 2001

We have fabricated thin films using the DC/RF magnetron sputtering of 74wt%Ni-l8wt%Cr-4wt%Al-4wt%Cu alloy target and studied the effect of the process parameters on the electrical properties for low TCR(Temperature Coefficient of Resistance) films. In sputtering process, pressure, power and substrate temperature, are varied as controllable parameter. The films are annealed to 400$^{\circ}C$ in air and nitrogen atmosphere. The sheet resistance, TCR of the films increases with increasing annealing temperature. It abruptly increased as annealing temperature increased over 300$^{\circ}C$ in air atmosphere. From XRD, it is found that these results are due to the existence of NiO on film surface formed by annealing. As a results of them, TCR can be controlled by variation of sputter process parameter and annealing of thin film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05b
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• pp.135-139
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• 2005

Thin films of $BaTiO_3$ system were prepared by radio frequency(rf)/dc magnetron sputtering method. We have investigated crystal structure, surface morphology and PTCR(positive-temperature coefficient of resistance) characteristics of the specimen depending on second heat-treatment temperatures. Second heat treatments of the specimen were performed in the temperature range of 400 to $1350^{\circ}C$. X-ray diffraction patterns of $BaTiO_3$ thin films show that the specimen heat treated below $600^{\circ}C$ is an amorphous phase and the one heat treated above $1100^{\circ}C$ forms a poly-crystallization. In the specimen heat-treated at $1300^{\circ}C$, a lattice constant ratio (c/a) was 1.188. Scanning electron microscope(SEM) image of $BaTiO_3$ thin films of the specimen heat treated in between 900 and $1100^{\circ}C}$ shows a grain growth. At $1100^{\circ}C$, the specimen stops grain-growing and becomes a poly-crystallization.

• Korean Journal of Materials Research
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• v.12 no.1
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• pp.82-88
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• 2002

Chromium carbide films were deposited on high speed steels using a Cr_3C_2$ target by magnetron sputtering. Effects of the deposition parameters (power, Ar pressure and substrate temperature) on deposition rates and surface roughnesses of the films were investigated. The morphologies of those films were characterized by scanning electron microscopy and atomic force microscopy. The grain size of the samples deposited using dc-power is larger than that using equivalent rf-power. The hardness of the sample increases with increasing rf-power, whereas the elastic modulus nearly does not change with rf-power. The optimum sputter deposition conditions for chromium carbide on high speed steels in the corrosion resistance aspect were found to be the rf-power with small roughness.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.1
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• pp.44-48
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• 2013

Niobium oxide($Nb_2O_5$) films were deposited on p-type Si wafers at room temperature using in-line pulsed-DC magnetron sputtering system with various frequencies. The different duty ratios were obtained by varying the frequency of pulsed DC power from 100 to 300 kHz at the fixed reverse time of $1.5{\mu}s$. From the thickness of the sputtered $NbO_x$ films, it was possible to obtain much higher deposition rate in case of pulsed-DC sputtering than RF sputtering. However, the similar leakage currents and structural characteristics were obtained from the metal-insulator-semiconductor(MIS) structure fabricated with the $NbO_x$ films and the x-ray photoelectron spectroscopy(XPS) results in spite of the different deposition rates. From the experimental results, the $NbO_x$ films sputtered by pulsed-DC sputtering are expected to be used in the fabrication process instead of RF sputtering.

• The Korean Journal of Ceramics
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• v.4 no.1
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• pp.9-14
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• 1998

Diamond-like carbon(DLC) films were deposited on buffer-layered ZnS substrates by radio frequency plasma enhanced chemical vapor deposition(RF-PECVD) method. Ge and GeC buffer layera were used between DLC and ZnS substrates to promote the adhesion of DLC on ZnS substrates. Ge buffer layers were sputter deposited by RF magnetron sputtering and $GeC^1$ buffer layers were deposited by same method except using acetylene reactive gas. The relatinship between film properties and deposition conditions was investigated using gas pressure, RF power and dc bias voltage as PECVD parameters. The hardness of DLC films were measured by micro Vickers hardness test and the adhesion of DLC films on buffer-layered ZnS substrates were studied by Sebastian V stud pull tester. The optical properties of DLC films on butter-layered ZnS substrates were characterized by ellipsometer and FTIR spectroscopy.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.207-212
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• 2005

Al, Ti, Ta, and Cr thin films were deposited on a polyimide substrate using DC magnetron sputter to study the adhesion characteristics of metal films on polyimide substrates, while RF bias of 0 - 400 W was applied to the substrate during DC sputtering. The adhesion strength was evaluated using a 90-degree peel test. The peel tests showed that the adhesion strength was enhanced by applying the RF bias to the substrate in all specimens. Scanning electron microscopy and Auger depth profile of the fractured surfaces indicate that the polyimide underwent cohesive failure during peeling and heavy deformation was also observed in the metal films peeled from the polyimide substrate when the RF bias applied during the deposition. Cross-sectional transmission electron microscopy revealed that the metal/polyimide interface was not clear and complicated. This complicated interface, likely formed due to the RF bias applied to the substrate, was attributed to the adhesion enhancement observed during the bias sputtering.

• Korean Journal of Materials Research
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• v.4 no.8
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• pp.952-957
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• 1994

Fe/Co and FeN/CoN multilayer films were prepared by using RF and DC magnetron sputter^ ing technique with Ar or a mixture of Ar and $N_{2}$ gas. Annealing treatment was carried out in a vacuum at temperatures between $100^{\circ}C$ and $500^{\circ}C$ for lhour. Saturation magnetization (MS) and coercivity (Hc) of Fe/Co mutilayer films were investigated as a function of Fe layer thickness and annealing temperature. Permeability ($\mu$) was also examined. Saturation magnetization of 1.8T and coercivity of 1.80e were obtained for the as-deposited Fe/Co($70 \AA /15 \AA$) multilayer film. The Coercivity(Hc) did not change from 1.8 Oe till the annealing temperature $250^{\circ}C$ and then increased rapidly at higher annealing temperatures above $300^{\circ}C$. Coercivity(Hc) measured for the as-deposited FeN/CoN multilayer film was 5 Oe. It decreased gradually with annealing up to $250^{\circ}C$, and then increased rapidly at higher tempera tures.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.117-118
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• 2011

초경합금 위에 RF Magnetron Sputter를 이용하여 Ti 중간층을 증착 후 MPECVD(Microwave Plasma Enhanced Chemical Vapor Deposition) 시스템을 이용하여 나노결정 다이아몬드 박막을 증착 하였다. 공정압력, 마이크로웨이브 전력, Ar/$CH_4$ 조성비, 기판온도를 일정하게 놓고 직류 bias의 인가 여부를 변수로 하고 증착시간을 0.5, 1, 2시간으로 변화시켜 박막을 제작하였다. 제작된 시편은 FE-SEM과 AFM을 이용하여 다이아몬드 박막의 표면과 다이아몬드 박막의 표면 거칠기 등을 측정하였고, Raman spectroscopy와 XRD를 이용하여 다이아몬드 결정성을 확인하였다. Automatic Scratch �岵謙�ter를 이용하여 복합박막의 층별 접합력을 측정하였다. 바이어스를 인가하지 않고 다이아몬드 박막을 증착할 경우 증착 시간이 증가할수록 다이아몬드 입자의 평균 크기가 증가하며 입자들이 차지하는 면적이 증가하는 것을 확인하였다. 그러나 1시간이 경과해도 아직 완전한 박막은 형성되지 못하고 2시간 이상 증착 시 완전한 박막을 이루는 것이 확인되었다. 이에 비해서 바이어스 전압을 인가할 경우 1시간 내에 완전한 박막을 이루었다. 표면 거칠기는 바이어스를 인가한 경우가 그렇지 않은 경우에 비해서 조금 높은 것으로 나타났다. 이러한 바이어스 효과는 표면에서의 핵생성 밀도 증가와 재핵생성 속도 증가에 기인하는 것으로 해석된다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.413-413
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• 2013

대면적 터치패널은 현재까지 저항막 방식, 적외선, Camera 방식을 주로 사용하고 있다. 저항막 방식의 Sensitivity, 높은 가격, 적외선 방식의 경우 빛의 간섭에 의한 오동작이 일어날 수 있는 문제를 가지고 있다. 최근의 Mobile용 터치스크린은 정전용량 방식의 터치기술 채택으로 저항막, 적외선, Camera 방식의 모든 단점을 해소할 수 있으나 터치 스크린 면적이 커지게 되면서 요구저항을 맞출 수 없는 문제로 현재 크기의 제한적이다. 본 연구에서는 완전일체형 터치(G2 Touch Hybrid) 방식의 ITO 터치필름을 사용하지 않고, 강화유리 기판을 사용하여 저(低)저항, 고(高)투과, 대형화(15 Inch), 경량화를 고려한 Zero-gap ITO를 코팅한 커버 유리용 투명전극에 대하여 전기적, 광학적, 구조적, 표면적 특성을 분석하였다. ITO 박막의 두께를 최소화하여 패턴 인비저블의 특성을 갖는 것이 필요로 하는데, 이는 ITO박막 패턴후에 패턴이 보이지 않게 하기 위해서이며, 이러한 시장의 요구를 충족하기 위해 RF/DC 고자력 Magnetron Sputtering System을 사용하여 면저항 $80{\Omega}$/${\Box}$, 표면특성 Rp-v 2.1 nm, 최고 광투과율 90.5%@550 nm, 반사율 차이 0.5 이하의 특성을 확인하였다. 또한, 저항 경시변화를 줄이기 위해서 Sheath heater를 이용한 진공코팅 중 발생되는 BM Ink out-gassing을 줄여 out-gassing에 의한 박막 손상을 줄일 수 있었으며 진공 성막중 결정성을 갖는 ITO 막을 형성시킬 수 있었다.

• Journal of the Korean Magnetics Society
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• v.9 no.5
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• pp.256-262
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• 1999

Sputter deposited CoCr(Mo)/Si film were studied with emphasis on the correlation between magnetic properties and crystallographic orientation. The perpendicular coercivities of CoCr films decreased with Si underlayer thickness, whereas those of CoCrMo films increased with Si underlayer thickness. It has been explained that additions of the larger atomic radius Mo atoms in CoCr films impedes crystal growth resulting in a decrease in grain size, thus this small grain size may induce high perpendicular coercivity. The c-axis alignment of CoCrMo film was improved due to addition of 2at.%Mo. It means CoCrMo layer grow self-epitaxial directly from orientation and structure of Si underlayer when the main layer grow on underlayer.