• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.9 no.2
• /
• pp.149-156
• /
• 1999

An experimental simulation on the flow in Czochralski melt using a cold model was carried out to obtain the velocities of fluid flow which affects the oxygen concentration of Czochralski crystal growing system. Low melting point Woods metal with similar Pr number to the silicon melt was adopted as a working fluid. Local flow velocities at numerous positions in the melt were simulataneously measured in three dimension using incorporated magnet probe. The measured velocity field showed a non-axisymmetric pattern dominated by natural convection. The analysis on the correlation between data set of temperatures simultaneously measured at two melt positions showed that the values of correlation coefficients were smaller than those of previous study on the small size of silicon melt and these phenomena are believed to occur because turbulent behavior becomes stronger in large size of the melt.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.24 no.6
• /
• pp.246-251
• /
• 2014

Recent studies have shown methods of improving solar cell efficiency. Especially on single crystalline silicon wafer which is high-efficiency solar cell material that has been widely studied. Interstitial oxygen (Oi) is the main impurity in the Czochralski (Cz) growing method, and excess of this can form precipitates during cell fabrication. We have demonstrated the effect of Oi impurity and oxygen precipitation concentration of the wafer on Cz-silicon solar cell efficiency. The result showed a decrease in cell efficiency as Oi and oxygen precipitation increase. Moreover, we have found that the critical point of [Oi] to bring higher cell efficiency is at 14.5 ppma in non-existent Bulk Micro Defect (BMD).

• Korean Journal of Materials Research
• /
• v.2 no.2
• /
• pp.119-125
• /
• 1992

Oxygen segregation in horizontal-magnetic-field-applied Czochralski (HMCZ) silicon crystals has been studied as a function of magnetic field strength (B) and crucible rotation rate (C). Along the axis of 57mm din. <100> crystals grown under B=2, 3, 4 kG and C=4-15rpm, the oxygen distribution was usually saw-tooth shaped and fluctuated unevenly. Compared to the conventional CZ method, this result seems to indicate that the horizontal magnetic field, at levels used in the present experiment, had a destabilizing influence on oxygen transport to the growth interface. On the other hand, as C increased, the oxygen fluctuation lessened, and [0] increased overall. At B=2 kG, an oxygen profile in a level of 27-36 ppma was achieved by a programmed ramp of C. Oxygen precipitation behavior of the HMCZ silicon during a simulated device manufacturing process was compared and found to be inferior to that of typical CZ silicon. The uneven oxygen profile in the as-grown state was identified as the major source of poor precipitation uniformity in the HMCZ silicon.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.26 no.5
• /
• pp.171-174
• /
• 2016

The diamond wire sawing method to produce silicon wafers for the photovoltaic application is still a new and highly investigated wafering technology. This technology, featured as the higher productivity, lower wear of the wire, and easier recycling of the coolant, is expected to become the mainstream technique for slicing the silicon crystals. However, the saw marks on the wafer surface have to be investigated and improved. This paper discusses the removal of saw marks on diamond wire-sawn single crystalline silicon wafer. With a pretreatment step using tetramethyl ammonium hydroxide ($(CH_3)_4NOH$, TMAH) and conventional texturing process with KOH solution (1 % KOH, 8 % IPA, and DI water), the saw marks on the surface of the diamond wire-sawn silicon wafers can be effectively removed and they are invisible to naked eyes completely.

• Proceedings of the Korea Association of Crystal Growth Conference
• /
• 1997.10a
• /
• pp.155-159
• /
• 1997

We investigated the effect of mechanical backside damage in Czochralski silicon wafer. The intensity of mechanical damage were evaluated by minority carrier recombination lifetime by a laser excitation/microwave reflection photoconductance decay method, photo-acoustic displacement method, X-ray section topography, and wet oxidation/preferential etch methods. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and the photoacoustic displacement values are also increased proportionally.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2005.05a
• /
• pp.259-259
• /
• 2005

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.18 no.4
• /
• pp.140-145
• /
• 2008

Silicon single crystals are grown by Czochralski (CZ) method in different growing conditions. The different shapes of the crystal-melt interface are obtained with various magnetic fields. Effects of zero-Gauss plane (ZGP) shape and magnetic intensity (MI) on the crystal-melt interface in the crystal experimentally are investigated. The shape of ZGP is not only flat but also parabolic, which is due to magnetic ratio (MR) of the lower to upper current densities in the configurations of the cusp-magnetic fields. As the MR increases, the crystal-melt interface becomes more concave. It means that the hot melt can be easily transported to the crystal-melt interface with increasing the MR. Effective shape of the crystal-melt interface is found to depend on the magnetic field in cusp-magnetic CZ method. The experimental results are compared with other studies and discussed.

• 한국신재생에너지학회:학술대회논문집
• /
• 2011.05a
• /
• pp.187.2-187.2
• /
• 2011

태양광산업의 value chain중 up-stream쪽인 고순도 실리콘산업은 셀, 모듈, 시스템 쪽에 비하여 영업 이익률이나 부가가치 측면에서 매우 높은 성장성을 현재 보여주고 있으며 최근 원자력산업의 안전성 문제가 대두됨으로 인하여 태양광수요가 전 세계적으로 증대되는 경향을 나타내어 태양광용 실리콘의 수요가 확대됨과 아울러 spot시장에서의 가격 또한 상승하고 있다. 이런 관점에서 잉곳 및 웨이퍼 가공 중에 발생하는 고순도 실리콘 폐기물의 재활용 이 다시 주목받고 있다. 태양전지 웨이퍼(wafer)용 소재는 6N급 이상의 결정질 실리콘 잉곳(ingot)이 주를 이루며, 고효율의 셀을 제조하기 위해서 단결정 실리콘 잉곳이 많이 사용된다. 실리콘 단결정을 육성하는 방법에는 Floating zone 법, Czochralski 법, Bridgeman 법, CVD 등 매우 다양하다. 이 중 Czochralski 법은 전체 생산량의 대부분을 차지하고 있는 방법으로, 용융액에서 결정을 인상하여 ingot을 제작하는 방법이다. 그러나 대량의 전기에너지를 소비하여 제작되는 고순도의 실리콘 단결정 잉곳은 후 가공공정에서 그 절반 이상이 분말(powder) 및 슬러지(sludge)로 폐기되므로, 자원의 재활용 및 환경오염 측면에서 주요과제가 되고 있다. Czochralski 법으로 제작된 ingot의 경우 그 표면이 매끄럽지 못하여, 웨이퍼 단위의 가공 시 형태가 진원이 될 수 있도록 표면을 미리 연마(grinding)하는데, 이때에도 미세 분말이 다량 발생하게 된다. 본 연구에서는 이러한 고순도 단결정 실리콘 ingot의 연마 가공공정에서 발생한 미세 분말을 용해하여 보았다. 진공 챔버(chamber) 내부에 유도가열 코일과 냉도가니로 구성된 장비를 통해 전자기유도가열을 이용하여 실리콘 분말 폐기물을 용해하고, 그 시편을 ICP-MS 및 비저항 측정을 통해 분말 의 특성을 조사하여 재활용 가능성을 검토해 보았다.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.33 no.3
• /
• pp.91-96
• /
• 2023

To verify the quality of bubbles during the use of quartz glass crucibles (QC), an appropriate accelerated testing method was proposed. The bubble state of discarded waste crucibles obtained from actual Czochralski (Cz) processes was analyzed, and optimal heat treatment conditions were suggested by varying temperature, pressure, and time using the QC test piece. By subjecting the samples to heat treatment at 1450℃, 0.4 Torr, and 40 hours, it was possible to control the bubble size and density to a similar level as those generated in the actual Cz process. In particular, by selecting a relatively lower pressure of 0.4 Torr compared to the typical range of 10~20 Torr applied in the Cz process, the time required for accelerated bubble formation testing could be reduced. However, it was determined that increasing the heat treatment temperature to 1550℃ led to the phenomenon of Ostwald ripening, resulting in larger bubbles and a rapid decrease in density. Therefore, it was concluded that it was not a suitable condition for the desired b ake test.

• Korean Chemical Engineering Research
• /
• v.58 no.3
• /
• pp.369-380
• /
• 2020

Most mono-crystalline silicon ingots are manufactured by the Czochralski (Cz) process. But If there are oxygen impurities, These Si-ingot tends to show low-efficiency when it is processed to be solar cell substrate. For making single-crystal Si- ingot, We need Czochralski (Cz) process which melts molten Si and then crystallizing it with seed of single-crystal Si. For melts poly Si-chunk and forming of single-crystalline Si-ingot, the heat transfer plays a main role in the structure of Cz-process. In this study to obtain high-quality Si ingot, the Cz-process was modified with the process design. The crystal growth simulation was employed with pulling rate and rotation speed optimization. Studies for modified Cz-process and the corresponding results have been discussed. The results revealed that using crystal growth simulation, we optimized the oxygen concentration of single crystal silicon by the optimal design of the pulling rate, rotation speed and melt charge level of Cz-process.