• Title/Summary/Keyword: CycleTime

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The Visualization of Vibration and Noise of The Rotary Compressor during One Cycle of Crank Shaft by use of Short Time Fourier Transform (STFT를 이용한 로터리 압축기 크랭크 1회전 동안의 실시간 진동소음의 가시화)

  • Ahn, Se-Jin;Jeong, Weui-Bong;Park, Jean-Hyung;Hwang, Seon-Woong
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2002.11b
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    • pp.428-433
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    • 2002
  • There have been many studies to visualize the vibration and noise of rotary compressor. Most of these studies assumed that the signal is stationary and the time-averaged signal is used for visualization. However, the noise and vibration signals generated during one cycle of crank shaft vary continuously. In this paper, the noise and vibration of rotary compressor which vary continuously are visualized by short time fourier transform method. The location of source and the transfer path of vibration and noise at arbitrary frequencies, which can not be visualized by averaged signal, can be visualized clearly.

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High Precision Path Generation of an LCD Glass-Handling Robot

  • Cho, Phil-Joo;Kim, Hyo-Gyu;Kim, Dong-Il
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.2311-2318
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    • 2005
  • Progress in the LCD industries has been very rapid. Therefore, their manufacturing lines require larger LCD glass-handling robots and more precise path control of the robots. In this paper, we present two practical advanced algorithms for high-precision path generation of an LCD glass-handling robot. One is high-precision path interpolation for continuous motion, which connects several single motions and is a reliable solution for a short robot cycle time. We demonstrate that the proposed algorithm can reduce path error by approximately 91% compared with existing algorithms without increasing cycle time. The second is real-time static deflection compensation, which can optimally compensate the static deflection of the handling robot without any additional sensors, measurement instruments or mechanical axes. This reduces vertical path error to approximately 60% of the existing system error. All of these algorithms have been commercialized and applied to a seventh-generation LCD glass-handling robot.

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The Application of Hydration Heat to Form Removal of Lining Concrete in Tunnel (수화열을 고려한 터널 라이닝 콘크리트 거푸집 탈형)

  • Lee, Jong-Kil;Jung, Hyung-Mok;Kim, Kook-Han;Namgoong, Yeong-Hwan;Park, Chan-Kyu
    • Proceedings of the Korea Concrete Institute Conference
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    • 2005.11a
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    • pp.347-350
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    • 2005
  • The strength level for removal of lining concrete in tunnel is increased from 2.94MPa to 4.9MPa in 2004. This result in the increase of concrete curing time, and construction time would be delayed. In this study, in order to improve the efficiency of construction cycle and satisfy the strength criterion, a curing method is adopted, which is considering the hydration heat in the lining concrete member. As a result, it is shown that the concrete curing time for form removal is about 20hrs without the adjustment of concrete mix design. And construction cycle time is not changed compared to that before the change of strength criterion.

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The Visualization of Vibration and Noise of The Rotary Compressor during One Cycle of Crank Shaft by use of Short Time Fourier Transform (SFT를 이용한 로터리 압축기 크랭크 1회전 동안의 실시간 진동소음의 가시화)

  • Ahn, Se-Jin;Jeong, Weui-Bong;Park, Jean-Hyung;Hwang, Seon-Woong
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2002.11a
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    • pp.346.1-346
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    • 2002
  • There have been many studies to visualize the vibration and noise of rotary compressor. Most of these studies assumed that the signal is stationary and the time-averaged signal is used for visualization. However, the noise and vibration signals generated during one cycle of crank shaft vary continuously. In this paper, the noise and vibration of rotary compressor which vary continuously are visualized by short time fourier transform method. (omitted)

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Effects of W CMP Process on PAD Characterization (패드 특성이 W CMP 공정에 미치는 영향)

  • Kim, Sang-Yong;Seo, Yong-Jin;Chung, Hun-Sang;Kim, Chang-Il;Chang, Eui-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.11a
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    • pp.178-181
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    • 2002
  • We studied the characteristics of polishing pad, which can apply W CMP process for global planarization of multilevel interconnection structure. Also we investigated the effects of different sets of polishing pad. The purpose of this experiment is the cost reduction by the increase of pad life time and decrease of cycle time and slurry usage with new pad. Especially we studied the effect of polishing pad for CMP process by this experiment of polishing pad that is consumables material during CMP process. We expecting the increase of process throughput and improvement of device manufacturing yield because we can choose optimum polishing pad through this result.

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Simulation on Spot Welding Behavior of Car Body Sheet (자동차용 판재의 점 용접시 용접거동 Simulation)

  • 이재갑;강춘식
    • Journal of Welding and Joining
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    • v.12 no.2
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    • pp.76-86
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    • 1994
  • Spot welding behavior of galvanized steel has been studied using both numerical and experimental techniques. The model that used to calculate temperature distribution within weldment is two-dimensional axis-symmetric finite difference method, and nugget sizes of specimen welded in condition of welding current and time has been estimated by experiment Results have shown that nugget sizes are increased in proportion to welding current and time, but the growth rate of nugget is decreased. Shear-tensile strength tests have shown interface fracture when welding current is 7, 9KA, welding time is 8-14cycle and 11KA, 8-10cycle respectively, but above 7, 9KA fracture shows button type. In button fracture, shear-tensile strengths have been proportional to nugget sizes.

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Computer Simulation: A Hybrid Model for Traffic Signal Optimisation

  • Jbira, Mohamed Kamal;Ahmed, Munir
    • Journal of Information Processing Systems
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    • v.7 no.1
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    • pp.1-16
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    • 2011
  • With the increasing number of vehicles in use in our daily life and the rise of traffic congestion problems, many methods and models have been developed for real time optimisation of traffic lights. Nevertheless, most methods which consider real time physical queue sizes of vehicles waiting for green lights overestimate the optimal cycle length for such real traffic control. This paper deals with the development of a generic hybrid model describing both physical traffic flows and control of signalised intersections. The firing times assigned to the transitions of the control part are considered dynamic and are calculated by a simplified optimisation method. This method is based on splitting green times proportionally to the predicted queue sizes through input links for each new cycle time. The proposed model can be easily translated into a control code for implementation in a real time control system.

Stress Spectrum Algorithm Development for Fatigue Crack Growth Analysis and Experiment for Aircraft Wing Structure (항공기 주익구조물의 피로균열 진전 해석 및 실험을 위한 응력 스펙트럼 알고리즘 개발)

  • Chun, Young Chal;Jang, Yun Jung;Chung, Tae Jin;Kang, Ki Weon
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.39 no.12
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    • pp.1281-1286
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    • 2015
  • Fatigue cracks can be generated in aircraft as a result of the cumulative time spent during flight operations, which can extend for long periods of time and cover a variety of missions. If a crack occurs in an aircraft's main spar, it can generate many problems, including a lift time reduction. To solve this problem, it was necessary to perform an analysis of fatigue crack growth in the fatigue critical locations. Much time and expense is involved in generating the stress needed for a crack propagation analysis over a long period of time to obtain the amount of data required for an actual aircraft. In this paper, an algorithm is developed that can calculate the spectrum of stress over a long period of time for a mission by the Southwest Research Institute, which is based on the short-time load factor data produced using the peak-valley cycle counting method.

The Study for the CMP Automation with Nova Measurement System (NOVA System을 이용한 CMP Automation에 관한 연구)

  • Kim, Sang-Yong;Chung, Hun-Sang;Park, Min-Woo;Kim, Chang-Il;Chang, Eui-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11b
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    • pp.176-180
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    • 2001
  • There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

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The Study for the CMP Automation wish Nova Measurement system (NOVA System을 이용한 CMP Automation에 관한 연구)

  • 김상용;정헌상;박민우;김창일;장의구
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11a
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    • pp.176-180
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    • 2001
  • There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

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