• Elastomers and Composites
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• 제33권5호
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• pp.315-323
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• 1998

본 연구의 목적은 카본블랙 첨가량 변화, 가황조건 및 가황시스템 변화에 따른 배합고무의 가교밀도 및 고무보강성을 조사하고자 하였다. 결합고무량은 배합고무중 카본블랙 체적비가 증가함에 따라 증가하였으나, 총가교밀도는 결합고무량 증가에 따라 감소하였다. 가황반응 속도상수는 가황온도 및 가황시스템에 따라 현저하게 변화하였으며, 특히 가황온도에 강한 의존성을 나타내었다. 가황반응의 활성화에너지는 카본블랙 첨가량이 많고 EC 가황시스템이 적용된 배합고무 또는 카본블랙 첨가량이 적고 CC 가황시스템이 적용된 배합고무에서 높게 나타났다. 가황된 배합고무중 가장 높은 총가교밀도는 카본블랙 첨가량이 적고 가황시스템중 CC 가황시스템이 적용된 배합고무에서 나타났으며, EC 가황시스템에 의한 총가교밀도의 뚜렷한 변화는 나타나지 않았다. Mooney-Rivlin식에 의한 가장 높은 탄성상수는 카본블랙 첨가량이 적고, SEC 가황시스템이 사용된 배합고무에서 나타났다. 모듈러스는 배합고무중 카본블랙 첨가량이 증가함에 따라 증가하였으며, 가황시스템별 영향은 SEC>CC>EC 시스템 순으로 높게 나타났다.

• Bulletin of the Korean Chemical Society
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• 제23권2호
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• pp.320-324
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• 2002

Binary cure system is composed of different two cure accelerators, which can cause a synergy effect to delay the scorch time and to increase the cure rate. In this study, binary cure systems between 1,6-bis(N,N'-dibenzylthiocarbamoyldithio)-hexane (DBTH) and benzothiazole sulfenamides were investigated using carbon black-filled natural rubber compounds. N-Cyclohexyl-2-benzothiazole sulfenamide (CBS), N-tert-butyl-2-benzothiazole sulfenamide (TBBS), and 2-(morpholinothio) benzothiazole (MOR) were employed as benzothiazole sulfenamides. The binary cure systems show scorch safty at high temperature. The binary cure systems have faster cure rate and better reversion resistance than the single cure system of the benzothiazole sulfenamides. DBTH is found to be more effective to decrease the viscosity of a compound than the benzothiazole sulfenamides. Physical properties of the vulcanizates with the binary cure system are better than those of the vulcanizates with the single one.

• 공업화학
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• 제10권3호
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• pp.419-426
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• 1999

가황고무의 가황반응에 대하여 가황시스템 및 온도, 보강성충전제 첨가량 변화에 의한 반응속도상수 및 활성화에너지, 가교밀도 및 탄성상수, 가황특성 ($t_5,\;t_{90}$), 고무보강성 및 내마모성을 고찰하였다. 반응속도상수는 보강성충전제 첨가량, 가황시스템 및 가황반응온도에 대한 의존성이 크게 나타났으며, 반응온도에 따라 지수적으로 증가하였다. 활성화에너지는 가황시스템중 촉진제에 대한 황 비율이 높은 가황시스템에서 가장 작게 나타났으며, 보강성충전제 첨가량이 적을수록 작게 나타났다. 카본블랙 첨가량 변화는 고무보강성 및 내마모성에 직접적으로 영향을 미치고 있으나, 가황시스템 변화는 각기 다른 영향이 나타났다. 카본블랙 첨가량이 증가하면 모듈러스가 증가하고, 내마모성이 향상되며, 스코치시간이 짧아졌으나, 가교밀도 및 탄생상수는 감소하였다. 높은 가교밀도 및 탄성상수는 카본블랙 첨가량에 관계없이 촉진제에 대한 황 비율 0.73 (${\fallingdotseq}1$)에서 나타났으며, 스코치시간 ($t_5$)은 촉진제에 대한 황 비율 변화에 거의 영향을 받지 않는 것으로 나타났다. 빠른 최적가황시간 ($t_{90}$) 역시 촉진재에 대한 황 비율이 1에 가까운 조건 (=0.73)에서 나타났다. 가황조건별 배합고무의 등가 가황곡선계수는 카본블랙 첨가량에 관계없이 CC 시스템에 대해서는 0.96, SEC 및 EC 시스템에 대해서는 0.74로 나타났다. 한편 가황고무의 마모된 부피는 부과된 하중이 증가함에 따라 지수적으로 증가하였다.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2006년 창립20주년기념 정기학술대회 및 국제워크샵
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• pp.233-236
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• 2006

A dilatometer was used to investigate the effect of cure conditions and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with number of cyclic cure. Post cured samples outside the mold led to less shrinkage compared with sample in the mold. And sample containing kaolin filler showed less shrinkage than unfilled sample.

• 반도체디스플레이기술학회지
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• 제16권2호
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• pp.19-26
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• 2017

The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

• 한국재료학회지
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• 제3권3호
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• pp.215-222
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• 1993

에폭시 수지를 개질하기 위하여 반응성 첨가제 Malononitrild(MN)을 Diglycidy1 ether fo vispenol A (CGEBA)/Methylene dianiline(MDA)계를 첨가하여 이 계의 경화 반응속도론과 경화반응메카니즘을 시차주사 열분석(DSC)과 적외선 흡수 분광법을 통해 관찰하였다. 경화반응속도론으로부터 MN으로 개질된 DGEBA/MDA는 완전히 경화를 이루기 위하여 $80^{\circ}C$로 부터 $170^{\circ}C$까지 $30^{\circ}C$간격으로 경화시킨 시료로 반응메카니즘을 고찰한 결과 PA(primary amine)-E(epoxide)그리고 E(epoxide)-OH(hydroxy1 group)반응 이외에 PA(primary amine)-CN(nitrile)과 CN(nitrile)-OH(hydroxy1 group)반응이 일어남을 알았다.

• 한국해양공학회지
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• 제23권4호
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• pp.1-5
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• 2009

A dilatometer was used to investigate the effect of cure conditions, mold types and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with the number of cyclic cures. Post cured samples outside the mold led to less shrinkage compared with samples in the mold. Sample cured in a silicon mold represented less shrinkage than sample cured in an aluminum mold. Sample containing kaolin filler showed less shrinkage than unfilled sample.

• 반도체디스플레이기술학회지
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• 제18권1호
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• pp.65-69
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• 2019

The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

• 폴리머
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• 제25권1호
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• pp.63-70
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• 2001

대표적 가교형태 변화에 따른 유사한 stress-strain 특성을 나타내는 조건하에서 공정특성 및 전반적 물성에 미치는 영향을 조사하였다. 천연고무 기본 배합에서 촉진제나 황 공여체(sulfur donor) 증가에 따라 induction time은 길어지나, 가류속도는 빨라졌다. 가교계 변화에 따른 인장강도의 영향은 매우 적은 반면 신장율은 conventional vulcanization (CV)계에서 efficient vulcanization (EV)계로 갈수록 감소하는 경향을 보여 주었다. Blow-out이 발생하는 시간을 가교형태에 따라 비교하여 보면 CV

• Macromolecular Research
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• 제17권8호
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• pp.585-590
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• 2009

The cure behaviors, dielectric characteristics and fracture toughness of diglycidylether of bisphenol-A (DGEBA)/poly(ethylene terephthalate) (PET) blend system were investigated. The degree of conversion for the DGEBA/PET blend system was measured using Fourier transform infrared (FTIR) spectroscopy. The cure kinetics were investigated by measuring the cure activation energies ($E_a$) with dynamic differential scanning calorimetry (DSC). The dielectric characteristic was examined by dielectric analysis (DEA). The mechanical properties were investigated by measuring the critical stress intensity factor ($K_{IC}$), critical strain energy release rate ($G_{IC}$), and impact strength test. As a result, DGEBAIPET was successfully blended. The Ea of the blend system was increased with increasing PET content to a maximum at 10 phr PET. The dielectric constant was decreased with increasing PET content. The mechanical properties of the blend system were also superior to those of the neat DGEBA. These results were attributed to the increased cross-linking density of the blend system, resulting from the interaction between the epoxy group of DGEBA and the carboxyl group of PET.