• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.53-58
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• 2000

During the curing process of thick glass/epoxy laminates, a substantial amount of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass/epoxy composites. Also, it requires a longer time for full and uniform consolidation. In this work, temperature, degree of cure and consolidation of a 20mm thick unidirectional glass/epoxy laminate were investigated using an experiment and a 3-dimentional numerical analysis considering the exothermic reaction. From the experimental and numerical results, it was found that the experimentally obtained temperature profile agreed well with the numerical one and the cure cycle recommended by the prepreg manufacturer should be modified to prevent a temperature overshoot and to obtain full consolidation.

• Elastomers and Composites
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• v.27 no.4
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• pp.275-280
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• 1992

Vulcanization reaction was studied by DSC through the comparison cure states to physical properties and the investegation of chemicals effect on vulcanization. Reaction enthalpy showed a good correlation with physical properties, increased with the increase of sulfur content, and increased with accelerator content, as well, where the ratio of MOR to sulfur was less than 1.0. Reaction temperature was decreased with increasing accelerator content and decreased also with sulfur content where the ratio of MOR to sulfur was more than 1:3. As a result, the cure state and reaction temperature could be controlled effectively with the ratio of accelerator to sulfur in the range of a third to unity.

• Korean Chemical Engineering Research
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• v.46 no.1
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• pp.200-204
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• 2008

The curing kinetics of diglycidyl ether of bisphenol F (DGEBF) with an asymmetric cycloaliphatic amine curing agent were examined by thermal analysis in both isothermal and dynamic curing conditions. From the residual curing of the samples partially cured in isothermal condition and from the dynamic curing with various heating rates, it was found that there exist two kinds of reactions such as at low temperature and at high temperature regions. It was thus also found that the cure parameters obtained from the isothermal curing kinetic model hardly estimate experimental results for a degree of cure larger than 0.6. The activation energies and frequency factors of these two kinds of reactions were obtained from the dynamic curing experiments with various heating rates. From the curing analysis, it was verified that the total cure kinetics for low degrees of cure is dominated by the cure reaction in the low temperature region.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.65-69
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• 2019

The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

• Korean Journal of Materials Research
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• v.11 no.9
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• pp.727-732
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• 2001

The cure kinetics of diglycidyl ether of bisphenol A (DGEBA)/4,4'- methylene dianiline (MDA) system with synthesized phenyl glycidyl ether-dimethylurea (PGE-DMU) was studied by Kissinger and Ozawa equations with DSC analysis in the temperature range of $20~300^{\circ}C$ To investigate the reaction mechanism between epoxy group of PGE and urea group of DMU, FT-lR spectroscopy analysis was used. The epoxide group of PGE reacted with the urea group of DMU and formed a hydroxyl group which acted as a catalyst on the cure reaction of other epoxide and amine groups. The activation energy of DGEBA/MDA system without PGE-DMU was 46.5 kJ/mol and those of the system with 5 and 10 phr of PGE- DMU were 43.4 and 37.0 kJ/mol, respectively. Ozawa method also showed the same tendency.

• Applied Chemistry for Engineering
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• v.5 no.4
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• pp.731-736
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• 1994

Cure kinetics of DGEBA/MDA/MN system with and without HQ were studied by Fractional life method and Kissinger equation. And the effect of HQ as a catalyst was studied. As cure temperature increased, the reaction rate increased and reaction order was almost constant. The activation energy of the system with HQ was lower about 13% and the reaction rate was higher than that of the system without HQ. It was because hydroxyl group of HQ formed a transition state with epoxide group and amine group and opened the epoxide ring easily and rapidly.

• Polymer(Korea)
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• v.26 no.5
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• pp.599-606
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• 2002

In this study, 4,4'-tetraglycidyl diaminodiphenyl methane (TGDDM)/polyamideimide (PAI) blends were cured using diaminodiphenyl sulfone (DDS). And the effect of addition of different PAI contents to neat TGDDM was investigated in the thermal, mechanical, and morphological properties of the blends. The cure behavior and thermal stability of the cured specimens were monitored by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. Also, the critical stress intensity factor (K$\_$IC/) was measured in UTM, and the phase separation behavior and final morphology of TGDDM/PAI blends were examined in scanning electron microscopy(SEM). As a result, the cure temperature and cure activation energy (E$\_$a/) were decreased with increasing the PAI content. The decreasing of cure temperature and cure activation energy were probably due to the presence of secondary amine group of PAI backbone used as co-initiator. But, the decomposition activation energy (E$\_$t/) and K$\_$IC/ value were increased up to 5. 10 phr of PAI content, respectively and they were decreased above the PAI contents. These results were explained on the basis of chain scission reaction by etherification. And morphology of blends observed from SEM was confirmed in co-continuous structures.

• Composites Research
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• v.28 no.3
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• pp.99-103
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• 2015

This paper presents the cure kinetics studies on the cure reaction of thermosetting resin. Above all, change in degree of cure and specific heat capacity according to temperature are observed using DSC and MDSC. The results are analyzed by cure kinetics and specific heat capacity model. Glass transition temperature was also measured to apply to the specific heat capacity model. Model parameters were gained from the modeling result. As a result, behavior of specific heat capacity can be calculated mathematically.

• Polymer(Korea)
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• v.35 no.3
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• pp.196-202
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• 2011

The cure kinetics of a bisphenol A epoxy resin and polyoxypropylene diamine curing agent system are investigated in both dynamic and isothermal conditions by differential scanning calorimetry (DSC). In dynamic experiments, the shift of exothermic peaks obtained at different heating rates is used to obtain activation energy of overall cure reaction based on the methods of Ozawa and Kissinger. Isothermal DSC data at different temperatures are fitted to an autocatalytic Kamal kinetic model. The kinetic model is in a good agreement with the experimental data in the initial stage of cure. A diffusion effect is incorporated to describe the later stage of cure, predicting the cure kinetics over the whole range of curing process. Also, dynamic mechanical analysis is performed to evaluate the storage modulus and average molecular weight between crosslinkages.

• Polymer(Korea)
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• v.38 no.2
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• pp.171-179
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• 2014

Low temperature cure prepregs are being developed for use in the preparation of large-structured fiber-reinforced polymer (FRP) composites with good performance. Cure behavior and chemorheology of low temperature cure epoxy resin system, based on epoxy resin, curing agent, and accelerators, were investigated to provide a matrix resin suitable for the prepreg preparation. Characteristics of cure reaction were studied in both dynamic and isothermal conditions by means of differential scanning calorimetry and rheometry. The low temperature cure epoxy resin system suggested in this study as a matrix resin was curable at $80^{\circ}C$ for 3 h, and showed the gel times of 120 and 20 min at 80 and $90^{\circ}C$, respectively. Thermal and mechanical properties of the cured sample were almost the same as high temperature cure counterparts.