• 연구논문집
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• s.29
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• pp.151-162
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• 1999

In general, manufacturing processes of thermosetting composites consist of mold filling and resin cure. The important parameters used in modeling and designing mold filling are the permeability of the fibrous preform and the viscosity of the resin. To consolidate a composite, resin cure or chemical reaction plays an essential role. Cure kinetics. Therefore, is necessary to quantify the extent of chemical reaction or degree of cure. It is also important to predict resin viscosity which can change due to chemical reaction during mold filling. There exists a heat transfer between the mold and the composite during mold filling and resin cure. Cure kinetics is also used to predict a temperature profile inside composite. In this study, a new scheme which can determine cure kinetics from dynamic temperature scaning was proposed. The method was applied to epoxy resin system and was verified by comparing measurements and predictions.

• Bulletin of the Korean Chemical Society
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• v.18 no.11
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• pp.1199-1203
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• 1997

The investigation of cure kinetics of biphenyl epoxy (4,4-diglycidyloxy-3,3,5,5-tetramethyl biphenyl)-xylok resin system with four different catalysts was performed by differential scanning calorimeter using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy and rate constant were calculated and reported. The results indicate that the curing reaction of the formulations using triphenylphosphine (TPP) and 1-benzyl-2-methylimidazole (1B2MI) as a catalyst proceeds through a first order kinetic mechanism, whereas that of the formulations using diazabicyloundecene (DBU) and tetraphenyl phosphonium tetraphenyl borate (TPP-TPB) proceeds by an autocatalytic kinetic mechanism. To describe the cure reaction in the latter stage, we have used the semiempirical relationship proposed by Chern and Poehlein. By combining an nth order kinetic model or an autocatalytic model with a diffusion factor, it is possible to predict the cure kinetics of each catalytic system over the whole range of conversion.

• Polymer(Korea)
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• v.35 no.3
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• pp.196-202
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• 2011

The cure kinetics of a bisphenol A epoxy resin and polyoxypropylene diamine curing agent system are investigated in both dynamic and isothermal conditions by differential scanning calorimetry (DSC). In dynamic experiments, the shift of exothermic peaks obtained at different heating rates is used to obtain activation energy of overall cure reaction based on the methods of Ozawa and Kissinger. Isothermal DSC data at different temperatures are fitted to an autocatalytic Kamal kinetic model. The kinetic model is in a good agreement with the experimental data in the initial stage of cure. A diffusion effect is incorporated to describe the later stage of cure, predicting the cure kinetics over the whole range of curing process. Also, dynamic mechanical analysis is performed to evaluate the storage modulus and average molecular weight between crosslinkages.

• Polymer(Korea)
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• v.24 no.1
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• pp.105-112
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• 2000

Using a commercial epoxy/carbon fiber composite prepreg (DMS 2224) as a model system, the cure kinetics of vitrifying thermoset system were analyzed by isothermal and dynamic-heating experiments. Focusing on the processing condition of high performance composite systems, a phenomenological kinetic model was developed by using differential scanning calorimetry (DSC) and reaction kinetics theories. The model system exhibited a limited degree of cure as a function of isothermal temperature seemingly due to the diffusion-controlled reaction rates. The diffusion-controlled cure reaction was incorporated in the development of the kinetic model, and the model parameters were determined from isothermal experiments. The first order reaction was confirmed from the characteristic shape of isothermal cure thermograms, and the activation energy wes 78.43 kJ/mol. Finally, the proposed model was used to predict a complex autoclave thermal condition, which was composed of several isothermal and dynamic-heating stages.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.9
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• pp.2154-2164
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• 1995

In this study, a dielectric cure monitoring system which consists of an electric circuit, a sensor and a personal computer was developed to on-line monitor the dielectric properties of carbon fiber epoxy composite materials. Also, the kinetic model of carbon fiber epoxy composite materials was developed by curve fitting of differential scanning calorimetry data. The start and end points of cure and the relationship between the dissipation factor and the degree of cure were obtained by comparing the dissipation factor from the dielectric properties with the degree of cure from the DSC data. The relationship between the dissipation factor and the degree of cure was tested under various temperature profiles.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1992.03a
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• pp.177-200
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• 1992

A thermo-viscoplastic finite element program was developed to analyze the compression molding of SMC process. Deformation of the material was modelled by using the flow-rule. Heat balance during the process was coupled to the deformation. In the cure study, a kinetic model was adopted to describe the cure behavior. The numerical kinetic model was integrated with the thermo-viscoplastic numerical analysis by adding heat generation due to the chemical reaction of the workpiece in the heat transfer analysis. The integrated finite element program can simulate a whole sequential molding process including deformation, heat transfer, and chemical reaction. A practical SMC molding process with T-shaped substructure was simulated. The simulated results showed good agreements with experiments.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.134-137
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• 2001

The cure kinetics of a cycloalipatic epoxy / anhydride / Co(II) system for a no-flow underfill encapsulant, has been studied by using a differential scanning calorimetry(DSC) under isothermal and dynamic conditions over the temperature range of $160^{\circ}C ~220^{\circ}C$. The kinetic analysis was carried out by fitting dynamic/isothermal heating experimental data to the kinetic expressions to determine the reaction parameters, such as order of reaction and reaction constants. Diffusion-controlled reaction has been observed as the cure conversion increases and successfully analyzed by incorporating the diffusion control term into the rate equation. The prediction of reaction rates by the model equation corresponded well to experimental data at all temperature.

• Korean Chemical Engineering Research
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• v.46 no.1
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• pp.200-204
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• 2008

The curing kinetics of diglycidyl ether of bisphenol F (DGEBF) with an asymmetric cycloaliphatic amine curing agent were examined by thermal analysis in both isothermal and dynamic curing conditions. From the residual curing of the samples partially cured in isothermal condition and from the dynamic curing with various heating rates, it was found that there exist two kinds of reactions such as at low temperature and at high temperature regions. It was thus also found that the cure parameters obtained from the isothermal curing kinetic model hardly estimate experimental results for a degree of cure larger than 0.6. The activation energies and frequency factors of these two kinds of reactions were obtained from the dynamic curing experiments with various heating rates. From the curing analysis, it was verified that the total cure kinetics for low degrees of cure is dominated by the cure reaction in the low temperature region.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.11
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• pp.2853-2865
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• 2000

During the curing process of thick glass/epoxy laminates, a substantial amount of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass/epoxy composites. Also, it takes a longer time for full and uniform consolidation. In this work, temperature, degree of cure and consolidation of a 20 mm thick unidirectional glass/epoxy laminate were investigated using an experiment and a 3-dimentional numerical analysis. From the experimental and numerical results, it was found that the experimentally obtained temperature profile agreed well with the numerical one, and the cure cycle recommended by the prepreg manufacturer should be modified to prevent a temperature overshoot and to obtain full consolidation.

• Elastomers and Composites
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• v.34 no.4
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• pp.321-331
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• 1999

The curing process is the final step in tire manufacturing whereby a green tire built from layers of rubber compounds is formed to the desired shape and the compounds are converted to a strong, elastic materials to meet tire performance needs under elevated pressure and temperature in a press. A numerical optimization procedure was developed to improve product quality in a tire curing process. First, a dynamic constrained optimization problem was formulated to determine the optimal condition of the supplied cure media during a curing process. The objective function is subject to an equality constraint representing the process model that describes the heat transfer and cures kinetic phenomena in a cure press and is subject to inequality constraints representing temperature limits imposed on cure media. Then, the optimization problem was solved to determine optimal condition of the supplied cure media for a tire using the complex algorithm along with a finite element model solver.