• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.256-256
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• 2012

SoP용 재료에 응용하기 위하여 NiCuZn 페라이트계 이용한 이종접합의 관한연구를 하였다. NiCuZn 페라이트계와 유전체의 이종접합특성은 XRD, Dilatometer, LCR meter, FE-SEM, EDS 이용하여 물리 화학적 특성을 조사하였다. NiCuZn 페라이트계는 일반적인 세라믹 제조공정을 이용하여 분말을 제조하였으며, 이종접합은 모든 시편에서 잘 진행되었으며 일부 유전체의 이온들이 페라이트 쪽으로 확산이 진행되었으며 NCZF700계는 $900^{\circ}C$ 소결 시편에서 확산이 진행되지 않은 현상이 나타났다.

• Clean Technology
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• v.27 no.1
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• pp.69-78
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• 2021

Vegetable oils, such as palm oil and cashew nut shell liquid (CNSL), are used as major raw materials for bio-diesel in transportation and bio-heavy oil in power generation in South Korea. However, due to the high unsaturation degree caused by hydrocarbon double bonds and a high content of oxygen originating from the presence of carboxylic acid, the range of applications as fuel oil is limited. In this study, hydrotreating to saturate unsaturated hydrocarbons and remove oxygen in mixed bio-oil containing 1/1 v/v% palm oil and CNSL on monometallic catalysts (Ni and Cu) and bimetallic catalysts (Ni-Zn, Ni-Fe, Ni-Cu Ni-Co, Ni-Pd, and Ni-Pt) was perform under mild conditions (T = 250 ~ 400 ℃, P = 5 ~ 80 bar and LHSV = 1 h-1). The addition of noble metals and transition metals to Ni showed synergistic effects to improve both hydrogenation (HYD) and hydrodeoxygenation (HDO) activities. The most promising catalyst was Ni-Cu/��-Al2O3, and in the wide range of the Ni/Cu atomic ratio of 9/1~1/4, the conversion for HYD and HDO reactions of the catalysts were 90-93% and 95-99%, respectively. The tendency to exhibit almost constant reaction activity in these catalysts of different Ni/Cu atomic ratios implies a typical structure-insensitive reaction. The refined bio-oil produced by hydrotreating (HDY and HDO) had significantly lower iodine value, acid value, and kinetic viscosity than the raw bio-oil and the higher heating value (HHV) was increased by about 10%.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.47-52
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• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shuck test. $(Cu,Ni)_6/Sn_5$-type intermetallic compound of which thickness is about 5 $\mu\textrm{m}$ was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was fecund at the solder joint. The newly developed product was superior to conventional one in terms of productivity and reliability.

• Advances in materials Research
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• v.1 no.1
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• pp.83-92
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• 2012

The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from $135^{\circ}C$ to $165^{\circ}C$. The UBM structures were examined: 5-${\mu}m$-Cu/3-${\mu}m$-Ni and $5{\mu}m$ Cu. Experimental results show that the solder joint with the Cu/Ni UBM has a longer electromigration lifetime than the solder joint with the Cu UBM. Three important parameters were analyzed to explain the difference in failure time, including maximum current density, hot-spot temperature, and electromigration activation energy. The simulation and experimental results illustrate that the addition 3-${\mu}m$-Ni layer is able to reduce the maximum current density and hot-spot temperature in solder, resulting in a longer electromigration lifetime. In addition, the Ni layer changes the electromigration failure mode. With the $5{\mu}m$ Cu UBM, dissolution of Cu layer and formation of $Cu_6Sn_5$ intermetallic compounds are responsible for the electromigration failure in the joint. Yet, the failure mode changes to void formation in the interface of $Ni_3Sn_4$ and the solder for the joint with the Cu/Ni UBM. The measured activation energy is 0.85 eV and 1.06 eV for the joint with the Cu/Ni and the Cu UBM, respectively.

• Proceedings of the Korean Society of Marine Engineers Conference
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• 2002.05a
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• pp.147-152
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• 2002

This paper was studied on corrosion of heat exchanger tube for absorption refrigeration machine. In the 62 % lithium bromide solution at $60^{\circ}C$, polarization test of Cu, Al-brass, 10 % cupro nickel(90-10 % Cu-Ni) and 30 % cupronickel(70-30 % Cu-Ni) tube was carried out. And polarization behavior, polarization resistance characteristics, open circuit potential, anodic polarization of heat exchanger tube for absorption refrigeration machine were considered. The main results are as following: The open circuit potential of Al-brass tube becomes less noble than that of Cu tube, corrosion current density of that becomes lower than Cu tube. The open circuit potential of cupronickel tube is more noble than that of Cu tube, corrosion current density of that is controlled than Cu tube. The passivation critical current of 30 % Cu-Ni tube is lower than that of 10 % Cu-Ni tube, potential of passive region of that is more wide than 10 % Cu-Ni tube.

• Journal of the Korean Chemical Society
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• v.48 no.2
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• pp.215-219
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• 2004

• Journal of Technologic Dentistry
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• v.23 no.1
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• pp.9-19
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• 2001

Microstructure and phase transformation of Ti-Ni-Cu alloy powders produced by using attrition milling method were studied. Mixed powders of Ti-(50-X)Ni-XCu ($X=0{\sim}20$ at%) in composition range were mechanically alloyed for maximum 20 hours by using SUS 1/4" ball in argon atmosphere. Ball to powder ratio was 50: 1 and impeller speed was 350rpm. Mechanically alloyed with attrition millimg method. powder was heat treated at the temperature up to $850^{\circ}C$ for 1 hour in the $10^{-6}$ torr vacuum. Ti-Ni-Cu alloy powders have been fabricated by attrition milling method. and then phase transformation behaviours and microstructual properties of the alloy powders were investigated to assist in improving the the high damping capacity of Ti-Ni-Cu shape memory alloy powders. The results obtained are as follows: 1. After heat treating of fully mechanically alloyed powder at $850^{\circ}C$ for 1hour. most of the B2 and B 19' phases was formed and $TiNi_3$ were coexisted. 2. The B 19' martensite were formed in Ti-Ni-Cu alloy powders whose Cu-content is less than 5a/o. where as the B19 martensite in those whose Cu-content is more than 10at%. 3. The powders of as-milled Ti-Ni-Cu alloys whose Cu-contents is less than 5at% are amorphous. whereas those of as-milled Ti-Ni-Cu alloys whose Cu-content is more than 10at% are crystalline. This means that Cu addition tends to suppress amorphization of Ti-Ni alloy powders.

• Journal of Welding and Joining
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• v.20 no.1
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• pp.97-102
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• 2002

The growth kinetics of intermetallic compound layers formed between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad by solid stateisothermal aging were examined. The interfacial reaction between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad was investigated at 70, 120, 150, $170^{\circ}C$ for various times. The intermetallic compound layer was composed of two phase: $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the solder and $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the copper and on solder/Ni pad the intermetallic compound layer was $Ni_3Sn_4$. Because the values of time exponent(n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energy for layer growth of total Cu-Sn($Cu_6Sn_5 + Cu_6Sn$), $Cu_6Sn_5$, $Cu_3Sn$ and $Ni_3Sn_4$ intermetallic compound were 64.82kJ/mol, 48.53kJ/mol, 89.06kJ/mol and 71.08kJ/mol, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.41-46
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• 2005

A systematic investigation of shear testing was conducted to find a relationship between Ni-Sn intermetallic spatting and the brittle fracture observed in electroless Ni(P)/solder interconnection. Brittle fracture was found in the solder joints made of Sn-3.5Ag, while only ductile fracture was observed in a Cu-containing solder (Sn-3.0Ag-0.5Cu). For Sn-3.0Ag-0.5Cu joints, $(Ni,Cu)_3Sn_4$ and/or $(Cu,Ni)_6Sn_5$ compound were formed at the interface without spatting from the Ni(P) film. For Sn-3.5Ag, $Ni_3Sn_4$ compound was formed and brittle fracture occurred in solder pads where $Ni_3Sn_4$ had spalled. From the analysis of fractured surfaces, it was found that the brittle fracture occurs through the $Ni_3SnP$ layer formed between $Ni_3Sn_4$ intermetallic layer and the Ni(P) film. Since the $Ni_3SnP$ layer is getting thicker during/ after $Ni_3Sn_4$ spatting, suppression of $Ni_3Sn_4$ spatting is crucial to ensure the reliability of Ni(P)/solder system.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.265-269
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• 2003

Sn(또는 SnAg)/Ni(P)와 Sn/Cu 계의 열사이클동안 형성되는 금속간화합물에 의해 유기되는 응력의 변화를 in-situ로 관찰하였다. Sn(또는 SnAg)/Ni(11.7P) 박막은 계면반응으로 인해 $Ni_3P$와 $Ni_3Sn_4$ 상이 형성되고 이때 인장응력이 발생하였으며, 한편, Sn(또는 SnAg)/Ni(3P) 박막의 계면반응에 의해서는 동일한 $Ni_3P$와 $Ni_3Sn_4$ 상이 형성됨에도 불구하고 압축응력이 발생하였다. SmAg를 사용할 때 형성되는 $Ag_3Sn$이 응력에 미치는 영향은 거의 없었다. Sn/Cu 박막의 경우는 계면반응 초기에는 인장응력이 발생하였고 어느 정도 이상 반응이 진전됨에 따라 압축응력이 발생하였고 최종적으로 $Cu_3Sn$ 상이 형성되었다. 초기의 인장응력은 계면에서 원자들의 intermixing 베 의한 것이고 압축응력은 Sn 방향으로 일방향 성장하는 금속간화합물 형성에 기인한다.