• Bulletin of the Korean Chemical Society
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• v.18 no.8
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• pp.850-856
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• 1997

A series of tetradentate Schiff-base ligands; 1,3-bis(salicylideneimino) propane, 1,4-bis(salicylideneimino)butane, and 1,5-bis(salicylideneimino)pentane, and their Cu(Ⅱ) and Ni(Ⅱ) complexes have been synthesized. The properties of ligands and complexes have been characterized by elemental analysis, IR, NMR, UV-Vis spectra, molar conductance, and thermogravimetric anaylsis. The mole ratio of Schiff base to metal at complexes was found to be 1 : 1. All complexes were four-coordinated configuration and non-ionic compound. The electrochemical redox processes of the ligands and their complexes in DMF solution containing 0.1 M TEAP as supporting electrolyte have been investigated by cyclic voltammetry, chronoamperometry, differential pulse voltammetry at glassy carbon electrode, and by controlled potential coulometry at platinum gauze electrode. The redox process of the ligands was highly irreversible, whereas redox process of Cu(Ⅱ) and Ni(Ⅱ) complexes was observed as one electron transfer process of quasi-reversible and diffusion-controlled reaction. Also the electrochemical redox potentials of complexes were affected by chelate ring size of ligands. The diffusion coefficients of Cu(Ⅱ) and Ni(Ⅱ) complexes in DMF solution were determined to be 4.2-6.6×10-6 cm2/sec. Also the exchange rate constants were determined to be 3.6-9.7×10-2 cm/sec.

• Progress in Superconductivity and Cryogenics
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• v.10 no.1
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• pp.24-27
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• 2008

For the development of superconducting fault current limiters(SFCLs) having large current capacity, we fabricated an SFCL element that consists of Bi-2212 superconductor and Cu-Ni alloy tubes. First, Ag was plated on the surface of the Bi-2212 for the enhancement of soldering process. On the Ag-plated Bi-2212 tube, a Cu-Ni alloy tube was soldered using optimized solders and soldering conditions. The BSCCO/Cu-Ni composite was processed mechanically to have a helical shape for the improvement of the SFCL characteristics. The total current path of the SFCL element was 1330 mm long with 12 turns, and had critical current of 340 A at 77 K. Finally, we carried out the fault test using the fabricated SFCL element. It showed successful current limiting performance under the fault condition of 50 $V_{rms}$ and 5.5 kA. From the results, the rated voltage of the SFCL element was decided to be 0.4 V/cm, and the power capacity was 12 kVA at 77 K. The fabrication process of the SFCL and the fault test results will be presented.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.04a
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• pp.70-71
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• 2006

• Korean Journal of Materials Research
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• v.7 no.9
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• pp.781-788
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• 1997

Cu/EMC 계면 접착력에 미치는 산화의 규명하기 위해 리드프레임의 저온 산화에 대하여 조사하였다. 이전의 보고와 달리, 저온에서도 Cu$_{2}$O위에 CuO산화물이 형성되어 Cu/Cu$_{2}$O(NiO)/Cu(NiO)/air의 산화층 구조를 나타내었다. Cu/EMC 계면 접착력은 산화가 진행됨에 따라 산화 초기에 급격히 증가하다 최대값에 이르고, 이후의 계속적인 산화로 감소하는 양상을 보였다. 접착력은 산화 온도나 리드프레임의 종류보다 산화막의 두께에 밀접한 상관 관계를 나타내었다. 최대 계면 접착력이 얻어지는 산화막의 두께는 리드프레임의 종류보다 산화막의 두께에 밀접한 상관 관계를 나타내었다. 최대 계면 접착력이 얻어지는 산화막의 두께는 리드프레임의 종류와 무관하게 대략 20nm 와 30nm 사이에 존재하였다. 산화 초기의 접착력 증가는 산화로 인한 EMC에 대한 젖음성의 증가와 기계적 고착 효과의 증가에 기인하였다. 리드프레임과 EMC의 파괴 표면에 대한 AES, XPS 분석으로 부터, 산화막의 두께가 얇을 때에는 Cu$_{2}$O//CuO의 계면 파괴 + EMC 자체 파괴가 복합적으로 발생함을 알 수 있었다. 반면에 과도한 산화로 낮을 접착력을 나타내는 시편은 Cu/Cu$_{2}$/O 계면의 파괴를 나타냈다.

• Journal of Magnetics
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• v.13 no.2
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• pp.76-80
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• 2008

This study examined the magnetic properties of ultrathin Fe/Ni films on a Cu(001) surface using the full potential linearized augmented plane wave (FLAPW) method. The magnetic moment of Fe/Ni films was found to be insensitive to strain. Nevertheless, strain had a significant influence on the magnetization direction. For example, Fe/Ni films showed a thickness-dependent spin reorientation transition in the presence of strain, while the Fe/Ni films grown pseudomorphically on Cu(001) always showed perpendicular magnetization. In addition, the theoretically calculated X-ray magnetic circular dichroism (XMCD) was examined.

• Journal of Powder Materials
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• v.8 no.1
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• pp.42-49
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• 2001

Ti-50Ni(at%) and Ti-40Ni-10Cu(at%) alloy powders have been fabricated by ball milling method, and their microstructure and phase transformation behavior were investigated by means of scanning electron microscopy/energy dispersive spectrometry, differential scanning calorimetry (DSC), X-ray diffractions and transmission electron microscopy. In order to investigate the effect of ball milling conditions on transformation behavior, ball milling speed and time were varied. Ti-50Ni alloy powders fabricated with the milling speed more than 250 rpm were amorphous, while those done with the milling speed of 100rpm were crystalline. In contrast to Ti-50Ni alloy powders, Ti-40Ni-10Cu alloy powders were crystalline, irrespective of ball milling conditions. DSC peaks corresponding to martensitic transformation were almost discernable in alloy powders fabricated with the milling speed more than 250 rpm, while those were seen clearly in alloy powders fabricated with the milling speed of 100 rpm. This was attributed to the fact that a strain energy introduced during ball milling suppressed martensitic transformation.

• Korean Journal of Environmental Agriculture
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• v.35 no.1
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• pp.79-86
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• 2016

BACKGROUND: This study was initiated to quantitatively evaluate the effects of five heavy metals on the growth and P removal efficiencies of Alcaligenes sp., known as the Phosphorus Accumulating Organisms (PAOs). It was cultivated in the batch system with five heavy metals, such as Cd, Cu, Zn, Pb and Ni, added in single and binary mixtures, respectively.METHODS AND RESULTS: IC₅₀ (half of inhibition concentration of bacterial growth) and EC₅₀ (half of effective concentration of phosphorus removal Efficiencies) were used to quantitatively evaluate the effects of heavy metals on the growth and phosphorus removal Efficiencies of Alcaligenes sp. In addition, Additive Index Value (A.I.V.) method was used to evaluate the interactive effects between Alcaligenes sp. and heavy metals. As a result, as the five heavy metals were singly added to Alcaligenes sp., the greatest inhibitory effects on the growth and P removal efficiencies of each bacteria was observed in the cadmium (Cd). In the binary mixture treatments of heavy metals, the treatments of lowest IC₅₀ and EC₅₀ were the Cd + Cu treatment. Based on the IC₅₀ and EC₅₀ of the binary mixtures of heavy metals treatments, most interactive effects between the heavy metals were found to be antagonistic.CONCLUSION: Based on the results obtained from this study, it appears that they could provide the basic information about the toxic effects of the respective treatments of single and binary mixtures of heavy metals on the growth and P removal efficiencies of Alcaligenes sp. through further study about the characterization of functional proteins involved in toxic effects of heavy metals.

• Korean Journal of Ecology and Environment
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• v.53 no.1
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• pp.91-101
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• 2020

Stormwater runoff is known as a major non-point water pollution source that transports heavy metals, which have accumulated in road surface, to stream and coastal area. Dissolved and particulate metals in stormwater runoffs have been investigated to understand the outflow characteristics of heavy metals during rainfall events and to identify their pollution sources. The concentration of dissolved Co and Ni decreased after the outflow with high concentrations at the beginning of the rainfall, and other metals showed different characteristics depending on the rainfall and rate of discharge. Particulate metals showed a similar trend with the temporal variation of suspended solids concentration in stormwater runoffs. The results of geo-accumulation index (I_geo) indicated that the stormwater runoffs from industrial region were very highly polluted with Cu, Zn and Cd. As a result of comparing the metal concentrations of <125 ㎛ for road dust near the study area, Cu, Zn and Cd were originated from inside of metal manufacturing facilities rather than traffic activities at road surface and these metals accumulated on the surface area of facilities were transported to the water environments during stormwater event. The average discharged amounts of heavy metals for one rainfall event were Cr 128 g, Co 12.35 g, Ni 98.5 g, Cu 607.5 g, Zn 8,429.5 g, As 6.95 g, Cd 3.7 g, Pb 251.75 g, indicating that metal runoff loads in the stormwater runoffs are closely related to surrounding industry types.

• Korean Journal of Environmental Agriculture
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• v.22 no.2
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• pp.118-123
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• 2003

This study was carried out to examine the heavy metal concentrations in soils under roadside trees and tree ring layers, and to investigate the relationship between heavy metal concentrations and tree ring growth of roadside trees in Seoul. Soil samples at $0{\sim}20\;cm$ depth and tree line were collected from Platanus occidentalis and Ginkgo biloba at nine streets, and pH and heavy Metal concentrations were analyzed. Soil pH ranged from 6.62 to 8.01 and soil heavy metal concentrations under roadside trees were higher (Zn 109.03, Pb 26.49 and Cu 44.98 mg/kg) compared with those of the referred forest soils. Soils at Cheonggye2ga street showed the highest heavy metal concentrations, and seemed to be related to heavy traffic and dense hardware stores. Tree ring width significantly decreased from 1979 through 2000 for both species. There were positive correlations between Cr, Pb and Cu concentrations in soils and tree ring layers for P. occidentalis and Ni for G. biloba. However, there were negative correlations between Cr concentration in tree ring layers and tree ring width for P. occidentalis, and Ni and Cu for G. biloba. Also there were no significant correlations between climatic factors in Seoul and tree ring width.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.81-88
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• 2019

In this study, the effects of graphene oxide (GO) addition on electromigration (EM) lifetime of Sn-3.0Ag-0.5Cu Pb-free solder joint between a ball grid array (BGA) package and printed circuit board (PCB) were investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of package side finished with electroplated Ni/Au, while $Cu_6Sn_5$ IMC was formed at the interface of OSP-treated PCB side. Mean time to failure of solder joint without GO solder joint under $130^{\circ}C$ with a current density of $1.0{\times}10^3A/cm^2$ was 189.9 hrs and that with GO was 367.1 hrs. EM open failure was occurred at the interface of PCB side with smaller pad diameter than that of package side due to Cu consumption by electrons flow. Meanwhile, we observed that the added GO was distributed at the interface between $Cu_6Sn_5$ IMC and solder. Therefore, we assumed that EM reliability of solder joint with GO was superior to that of without GO by suppressing the Cu diffusion at current crowding regions.