• 대한화학회지
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• 제35권6호
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• pp.645-652
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• 1991

몇 가지 전이금속이온(Co(Ⅱ), Ni(Ⅱ), Cu(Ⅱ), Zn(Ⅱ)) 및 후전이금속이온(Cd(Ⅱ), Hg(Ⅱ), Pb(Ⅱ))과 $N_2O_3$계 거대고리 리간드인 1,15-diaza-3,4 : 12,13-dibenzo-5,8,11-trioxacyclooctadecane 사이에 형성되는 착물의 안정도 상수를 수용액에서 전위차 적정법으로 결정하였다. 각 착물의 안정도 상수$(logK_f)$는 $25^{\circ}$C에서 Co(Ⅱ): 3.83, Ni(Ⅱ) : 4.56, Cu(Ⅱ) : 7.74, Zn(Ⅱ) : 4.98, Cd(Ⅱ) : 3.91, Hg(II) : 14.87, Pb(Ⅱ) : 6.65이었다. 전이금속착물의 안정도 순위는 Williams-Irving 서열인 Co(Ⅱ) < Ni(Ⅱ) < Cu(Ⅱ) < Zn(Ⅱ)와 일치하였고, 후전이금속착물의 안정도는 Cd(Ⅱ) < Pb(Ⅱ) < Hg(Ⅱ)이 순위이었다. 한편 메탄올 용액에서 자외-가시선이온과 리간드가 1:1인 조성을 가졌으나, Ni(Ⅱ), 착물은 1:1과 1:2 두 가지 조성을 가질 수 있음을 알았으며, 또 디메틸술폭시드 용액에서 $^1H-$와 $^{13}C-$핵자기공명스펙트럼을 분석하여 후전이금속이온 착물은 주로 리간드의 질소원자가 결합에 기여함을 알았다. Cu(Ⅱ)와 Zn(Ⅱ)이 고체착물은 원소분석, 전기전도도, 자화율 측정, 자외-가시선 및 적외선 스펙트럼분석 등으로 Cu(Ⅱ) 착물은 일그러진 팔면체, 그리고 Zn(Ⅱ) 착물은 사면체 구조를 이루고 있는 것으로 예측되었다.

• 한국연초학회지
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• 제1권2호
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• pp.103-110
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• 1979

1978년 국내산 잎담배에 대하여 Ha,Mg,Fe,Ui, Cu, Mn, Zn의 함량을 조사연구하였다. 그 결과 Mg은 5370$\mu{g}/g-7640\mu{g}/g$으로 Burley>Flue-cured>Native의 순이었다. Mn과 Fe는 210$\mu{g}/g-1290\mu{g}/g$, 330$\mu{g}/g-590\mu{g}/g$으로 Burley >Flue -cured >Native의 순이었다.Zn는 50$\mu{g}/g-100\mu{g}/g$으로서 Native>Burley>Flue -cured의 순이었으며 Na, Ni, Cu는 세품종이 비슷하였으며, Na는 200~300$\mu{g}/g$,Ni는 $10\mu{g}/g$, Cu는 7~9$\mu{g}/g$이었다. 이들 무기성분의 함량과 등급과는 Na, Mg, Mn, Ni, Cu는 후옅 5, 3,1등의 순으로 감소하는 경향을 보이다가 박엽 1,3,5등의 순으로 점차로 증가하는 상향곡선으로 나타났다. 등급과 무기성분과의 상관관계는 Hicks, SC-72, Va 115세품종이 Mg와 0.l%수준에서 고도의 유의성이 있었다.

• 한국전기전자재료학회논문지
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• 제13권6호
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• pp.472-477
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• 2000

Oxides of the form Mn$_{4}$/O$_{4}$-CuO-Co$_{3}$/O$_{4}$-NiO-ZnO present properties that make them useful as power NTC thermistor for current limited. Electrical properties of Mn$_{3}$/O$_{4}$-CuO-Co$_{3}$/O$_{4}$-CuO-Co$_{3}$/O$_{4}$-NiO-ZnO power NTC thermistor such as I-V characteristics tim constant activation energy and heat dissipation coefficient measured as a function of temperature and composition. In Mn$_{4}$/O$_{4}$-CuO-Co$_{3}$/O$_{4}$-NiO-ZnO system with the 5wt% addition of Co$_{3}$/O$_{4}$ it can be seen that resistivity and B-constant were increased as the ratio of ZnO/Mn$_{3}$/O$_{4}$ was increased. Heat dissipation constant, I-V characteristics and time constant showed similar behaviour compared with those of conventional thermistors. In particular resistance change ratio ($\Delta$R) the important factor for reliability varied within $\pm$5% indicating the compositions of these products could be available for power thermistor.

• 자원리싸이클링
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• 제14권5호
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• pp.24-31
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• 2005

폐전자스크랩에서 유가금속을 회수하기 위하여 곰팡이균으로 Aspergillus niger를 이용한 Cu, Zn, Al, Co, Ni, Fe, Sn, Pb의 침출 거동을 조사하였다. Aspergillus niger는 전자스크랩의 존재 하에 배양이 가능하였고 신진대사 작용에 의해 유기산(구연산 및 옥살산)을 생성함으로써 폐전자스크랩에서 각 금속들을 침출시키는 것을 알 수 있었다. 예비실험으로 먼저 구연산 및 옥살산을 이용한 화학침출 실험으로부터 Cu, Zn, Al, Co, Fe, Sn, Pb의 침출거동을 조사하였다. Aspergillus niger를 이용한 미생물 침출 실험의 결과 전자스크랩의 농도가 50g/L인 경우 Cu 및 Co의 침출율은 95%이상이었고, Al, Zn, Pb 및 Sn의 경우는 15-35%의 침출율을 나타냈으며 Ni 및 Fe의 경우는 10%이하의 침출율을 보였다.

• 대한금속재료학회지
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• 제49권8호
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• pp.657-663
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• 2011

This study represents the results of the peel strength and surface morphology according to the preprocessing times of polyimide (PI) in a Cu/Ni/PI structure flexible copper clad laminate production process based on the polyimide. Field emission scanning electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to analyze the surface morphology, crystal structure, and interface binding structure of sputtered Ni, Cu, and electrodeposited copper foil layers. The surface roughness of Ni, Cu deposition layers and the crystal structure of electrodeposited Cu layers were varied according to the preprocessing times. In the RF plasma times that were varied by 100-600 seconds in a preprocessing process, the preprocessing applied by about 300-400 seconds showed a homogeneous surface morphology in the metal layers and that also represented high peel strength for the polyimide. Considering the effect of peel strength on plastic deformation, preprocessing times can reasonably be at about 400 seconds.

• 대한금속재료학회지
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• 제47권10호
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• pp.605-612
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• 2009

The suitability of twin roll strip casting for Ag-27.5%Cu-20.5%Zn-2.5%Mn-0.5%Ni brazing alloy (known as HS-49D) was examined in the present work and the mechanical properties and microstructure of the strip were also investigated. The effect of annealing heat treatment on the properties was also studied. The new manufacturing process has applications in the production of the brazing alloy. XRD and microstructural analyses of the Ag-27.5%Cu-20.5%Zn-2.5%Mn-0.5%Ni strip revealed a eutectic microstructure of an Ag-rich matrix (FCC) and a Cu-rich phase (FCC) regardless of heat treatment. The results of mechanical tests showed tensile strength of 434 MPa and 80% elongation for the twin roll casted strip. Tensile results showed decreasing strengths and increasing elongation with annealing heat treatment. Microstructural evolution and fractography were also investigated and related to the mechanical properties.

• 대한화학회지
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• 제33권5호
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• pp.510-515
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• 1989

테트라에틸렌펜타아민과 포름알데히드의 주형축합반응으로부터 새로운 펜타아자 거대두고리 리간드인 1,3,6,9,12-펜타아자비시클로[10,2,1]펜타데칸(D)의 니켈(II) 및 구리(II) 착화합물 $[Ni(D)]^{2+},\;[Cu(d)]6{2+}\;그리고\;[Cu(D)Cl]^+$를 합성하였다. 거대두고리 리간드인 D에는 한 개의 이미다졸리딘 고리가 있다. $[Ni(D)]^{2+}와 [Cu(D)]^{2+}$는 5-5-5-6 킬레이트고리 배열로 된 평면사각형 구조를 이루며, 5-배위 착이온인 $[Cu(D)Cl]^+$의 구조는 그의 전자스펙트럼으로 볼 때 사각피라미드일 것으로 보인다. 이들 니켈(II) 및 구리(II) 착화합물의 합성과 확인 그리고 분광학적인 특성과 화학적인 특성이 논의된다.

• International Journal of Railway
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• 제3권1호
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• pp.19-27
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• 2010

In the present study, the electrical sliding wear and corrosion resistance of pure copper (Cu) and six age-hardened copper alloys (CuCr, CuZr, CuCrZr, CuNiSiCr, CuBe and CuBeNi) were investigated by a pin-on-disc tribometer and electrochemical measurement. Various copper-based alloys in the form of cylindrical pin were forced to slide against a counterface stainless steel disc in air under unlubricated condition at a sliding velocity of 31 km/h under normal load up to 20 N with and without electric current. The worn surface of and wear debris from the specimens were studied by scanning electron microscopy. Both mechanical wear and electrical arc erosion were the wear mechanisms for the alloys worn at 50 A. Owing to its good electrical conductivity, high wear and corrosion resistance, CuCrZr is a promising candidate as the overhead catenary material for electric traction systems.

• 한국전기전자재료학회논문지
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• 제24권12호
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• pp.1010-1017
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• 2011

The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. When fabricated Ni/Cu plating metallization cell with a selective emitter structure, it has been shown that efficiencies of up to 18% have been achieved using this technology.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.663-663
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• 2013

We prepared Cu oxides, and Ni and Pd-TiO2@SiO2 core-shellnanostructures, and tested their CO oxidation performances by temperature-programmed mass spectrometry. We found the starting temperatures of CO oxidation are around $200^{\circ}C$ and $300^{\circ}C$ for Ni and Pd-TiO2@SiO2 nanostructures, respectively. Cu oxides are cubes with 50~200 nm with, prepared with different concentrations of NaOH and ascorbic acid. For the core-shell structures, we prepared 100 nm SiO2 spheres, first coated the surface with TiO2 precursor, and then coated with Ni and Pd. Their characteristics are further examined by scanning electron microscopy, optical microscope, FT-IR, and UV-Vis absorption spectroscopy.