• Journal of Powder Materials
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• v.13 no.5 s.58
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• pp.351-359
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• 2006

Ni based($Ni_{57}Zr_{20}Ti_{18}Si_2Sn_3$) bulk metallic glass(BMG) powders were produced by a gas atomization process, and ductile Cu powders were mixed using a spray drying process. The Ni-based amorphous powder and Cu mixed Ni composite powders were compacted by a spark plasma sintering (SPS) processes into cylindrical shape. The relative density varied with the used SPS mold materials such as graphite, hardened steel and WC-Co hard metal. The relative density increased from 87% to 98% when the sintering temperature increased up to $460^{\circ}C$ in the WC-Co hard metal mold.

• Journal of Korea Foundry Society
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• v.28 no.1
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• pp.31-36
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• 2008

Ti-Ni-Cu alloys are very attractive shape memory alloys for applications as actuators because of a large transformation elongation and a small transformation hysteresis. Rapidly solidified Ti-Ni alloy ribbons have been known to have the shape memory effect and superelasticity superior to the alloy ingots fabricated by conventional casting. In this study, solidification structures and shape memory characteristics of $Ti-Ni_{30}-Cu_{20}$ alloy ribbons prepared by melt spinning were investigated by means of DSC and XRD. Operating parameters to fabricate the amorphous ribbons were the wheel velocity of 55 m/s and the melt spinning temperature of $1500^{\circ}C$. The crystallization temperature was measured to be $440^{\circ}C$. The crystallized ribbons exhibited very fine microstructure after annealing at $440^{\circ}C$ for 10 minutes and $460^{\circ}C$ for 5 minutes and was deformed up to about 6.8% and 6.23% in ductile manner, respectively. Stress-strain curve of the ribbon exhibited a flat stress-plateau at 64 MPa and this is associated with the stress-induced a B2-B19 martensitic transformation. During cycle deformation with the applied stress of 220 MPa, transformation hysteresis and elongation associated with the B2-B19 transformation were observed to be $4.3^{\circ}C$ and 3.6%.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.273.1-273.1
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• 2014

Graphene, a two dimensional plane structure of $sp^2$ bonding, has been promised for a new material in many scientific fields such as physics, chemistry, and so on due to the unique properties. Chemical vapor deposition (CVD) method using transitional metals as a catalyst can synthesize large scale graphene with high quality and transfer on other substrates. However, it is difficult to control the number of graphene layers. Therefore, it is important to manipulate the number of graphene layers. In this work, homogeneous solid solution of Cu and Ni was used to control the number of graphene layers. Each films with different thickness ratio of Cu and Ni were deposited on $SiO_2/Si$ substrate. After annealing, it was confirmed that the thickness ratio accords with the composition ratio by X-ray diffraction (XRD). The synthesized graphene from CVD was analyzed via raman spectroscopy, UV-vis spectroscopy, and 4-point probe to evaluate the properties. Therefore, the number of graphene layers at the same growth condition was controlled, and the correlation between mole fraction of Ni and the number of graphene layers was investigated.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.1-6
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• 2017

The effect of metal turnover (MTO) of electroless Ni plating bath on the brittle fracture behavior of electroless nickel electroless palladium immersion gold (ENEPIG)/Sn-3.0wt%Ag-0.5wt%Cu(SAC305) solder joint was evaluated in this study. The MTOs of the electroless Ni for the ENEPIG surface finish were 0 and 3. As the MTO increased, the interfacial IMC thickness increased. The brittle fracture behavior of the ENEPIG/SAC305 solder joint was evaluated with high speed shear (HSS) test. The HSS strength decreased with increasing the MTO of the electroless Ni bath. The brittle fracture increased with increasing the shear speed of the HSS test. The percentage of the brittle fracture for the 3 MTO sample was much higher than that for the 0 MTO sample.

• Journal of Plant Biology
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• v.16 no.3_4
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• pp.40-44
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• 1973

Hawkeye(Fe-chlorosis resistant) and PI 54619-5-1(Fe-chlorosis sensitive) soybeans were grown with and without DPTA(diethylene triamine pentaacetic acid) in Yolo loam soil. The major purpose of the study was to compare leaf-stem distribution of microelements for different treatments which increase concentrations of microelements in plants to evaluate the role of the chelating agent in increasing translocation of the microelements. Plant responses and yields were recorded and Fe, Mn, Zn, Cu, Al, Co, N, Sn, Pb and Mo contents of leaves and stems were determined by emission spectrography. Sulfur(soil pH4) increased leaf concentrations of Mn, Zn, Cu, CO, Ni, Sn and Pb. DTPA, particularly at 50ppm in soil, increased leaf concentrations of Fe, Mn, Zn, Cu, Co, Ni and Mo. It increased Ti in leaves for the PI 54619-5-1 soybeans only. DTPA increased the ratios of the concentration in leaves to that in stems for Fe, Zn, Cu, Al, Ti, CO, Ni and Mo. Sulfur which increased the microelement concentration in both leaves and stems did not have this effect. DTPA increased the ratio at soil pH 6 and 8.5 in leaves to that in stems of the bush bean plants for Fe, Zn, Cu, Ni, but to a lesser extent in bush beans than in soybeans. PI 54619-5-1 soybeans tended to contain less of most of the metals than did Hawkeye soybeans.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.259-262
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• 1999

In this study, we investigated magnetic Properties of N $i_{0.2-x}$C $u_{x}$Z $n_{0.305}$F $e_{0.495}$ (x=0 ~0.2) ferrites. As the increased, the density and shrinkage increased until 5.3g/㎤, 20% respects, but the absorption decreased rate until 0.01%. As a results of the density, absorption rate, and shrinkage rate, the grain growth progressed rapidly in x=0.125 at 105$0^{\circ}C$, x=0.075 at 115$0^{\circ}C$, and x=0.025 at 115$0^{\circ}C$ for 3hours. As the CuO concentration increased, initial permeability increased at sintered 105$0^{\circ}C$ and 115$0^{\circ}C$ for 3 hours, but decreased at 125$0^{\circ}C$ for 3 hoers. The complex permeability as a function of frequency were high values at sintered 105$0^{\circ}C$ for 3 hours in x=0.005, 0.075.5.5.5.

• Transactions of the Korean hydrogen and new energy society
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• v.30 no.3
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• pp.209-219
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• 2019

Methanol is a liquid fuel which could also be produced from renewable energy sources and has appreciably high energy density. In this work, we investigated the application of $Ce_{0.9}Gd_{0.1}O_{2-x}$ supported Cu and Ni catalysts for hydrogen production via methanol steam reforming. Catalysts were synthesized by solution combustion synthesis. The prepared catalysts with various active materials and Cu loading amounts were tested in a reactor at $200-300^{\circ}C$, 0-5 barg range and steam to methanol molar ratio was 1.5. The catalytic properties of Cu and Ni were compared, and the catalytic performance was shown to depend on the amounts of metal loading and operating conditions such as reaction temperature and pressure.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.60-67
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• 2014

The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• Journal of the Korean Chemical Society
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• v.35 no.5
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• pp.527-533
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• 1991

Template condensation reactions of formaldehyde with appropriate tetramines and diamines in the presence of N(II) or Cu(II) ion produce square planar complexes of hexaaza macrotricyclic and macrotetracyclic ligands $[M(L)]^{2+}$(M = Ni(II) or Cu(II); L = 4-methyl-1,3,6,8,11,14-hexaazatricyclo[12,2,1,$1^{8,11}$]octadecane(C), 1,3,10,12,15,18-hexaazatetracyclo[16,2,1,$1^{12,15},0^{4,9}]$docosane(D) 4-methyl-1,3,6,8,12,15-hexaazatricyclo[13,3,1,$1^{8,12}$]eicosane(F), or 1,3,10,12,16,19-hexaazatetracyclo[l7,3,1,$1^{12,16},0^{4,9}]$tetracosane(G). These complexes contain two 1,3-diazacyclopentane or 1,3-diazacyclohexane rings in the six-membered chelate rings. The complexes of C and F contain one methyl group and those of D and G one cyclohexane ring in the five-membered chelate ring. Synthesis and characterization of the Ni(II) and Cu(II) complexes are presented. The effects of the ligand structure on the equilibrium $[Ni(L)]^{2+}2H_2O{\rightleftharpoons}[Ni(L)(H_2O)_2]^{2+}$ in aqueous solutions are described.