• Title/Summary/Keyword: CuNi

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The B2-B19-B19' Transformation in Ti-(45-x)Ni-5Cu-xMn (at%) (x = 0.5-2.0) Alloys

  • Jeon, Yeong-Min;Kim, Min-Gyun;Kim, Min-Su;Lee, Yong-Hee;Im, Yeon-Min;Nam, Tae-Hyun
    • Transactions on Electrical and Electronic Materials
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    • v.12 no.1
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    • pp.24-27
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    • 2011
  • Effect of substitution of Mn for Ni on transformation behavior, shape memory characteristics and superelasticity of Ti45Ni-5Cu alloy has been investigated by means of electrical resistivity measurements, X-ray diffraction, thermal cycling tests under constant load and tensile tests. The one-stage B2-B19' transformation occurred when Mn content was 0.5 at%, above which the two-stage B2-B19-B19' transformation occurred. A temperature range where the B19 martensite exists was expanded with increasing Mn content because decreasing rate of Ms (60 K / % Mn) was larger than that of Ms' (40 K / % Mn). Ti-(45-x)Ni-5Cu-xMn alloys were deformed in plastic manner with a fracture strain of 60 % ~ 32 % depending on Mn content. Clear superelasticity was found in fully annealed Ti-(45-x)Ni-5Cu-xMn alloys with Mn content more than 1.0 at%, which was ascribe to a solid solution hardening by substitution of Mn for Ni.

Magnetic Properties of NiZnCu Ferrite for Multilayer Chip Inductors (칩인덕터용 NiZnCu Ferrite의 자기적 특성 연구)

  • An, Sung-Yong;Moon, Byeong-Chol;Jung, Hyun-Chul;Jung, Hyun-Jin;Kim, Ic-Seob;Hahn, Jin-Woo;Wi, Sung-Kwon
    • Journal of the Korean Magnetics Society
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    • v.18 no.2
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    • pp.58-62
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    • 2008
  • $Ni_{0.4}Zn_{0.4}Cu_{0.2}Fe_2O_4$ ferrite was fabricated by solid stat reaction method and sol-gel method. Because of the drawbacks of each method, we combined these two methods together. We proposed and experimentally verified that nanocrystalline ferrite additive was effective on improving the densification behavior and magnetic properties of NiZnCu ferrites for multilayer chip inductors. The initial permeability of the toroidal core Sample with 20 wt% nanocrystalline ferrite increased from 78.1 to 178.2 as annealing temperature is increased from $880^{\circ}C$ to $920^{\circ}C$. The density, shrinkage and saturation magnetization were increased with increasing annealing temperature, which was attributed to the decrease of additive grain size and increase of sintering density.

Toxicity Evaluation of Metals and Metal-oxide Nanoparticles based on the Absorbance, Chlorophyll Content, and Cell Count of Chlorella vulgaris (Chlorella vulgaris의 흡광도, 클로로필 및 개체수 통합 영향에 근거한 중금속 및 나노입자 독성 조사)

  • Jang, Hyun Jin;Lee, Mun Hee;Lee, Eun Jin;Yang, Xin;Kong, In Chul
    • Clean Technology
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    • v.23 no.1
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    • pp.27-33
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    • 2017
  • In this study, toxicities of seven metals (Cu, Cd, Cr, As(III), As(V), Zn, Ni) and five metal oxide nanoparticles (NPs: CuO, ZnO, NiO, $TiO_2$, $Fe_2O_3$) were evaluated based on the growth of Chlorella vulgaris. Effect on algae growth was evaluated by integrating the results of absorption, chlorophyll content, and cell count. The toxicity rankings of metals was observed as Cr ($0.7mgL^{-1}$) > Cu ($1.7mgL^{-1}$) > Cd ($3.2mgL^{-1}$) > Zn ($3.9mgL^{-1}$) > Ni ($13.2mgL^{-1}$) > As(III) ($17.8mgL^{-1}$) ${\gg}$ As(V) (> $1000mgL^{-1}$). Slightly different orders and sensitivities of metal toxicity were examined depending on endpoints of algal growth. In case of NPs, regardless of endpoints, similar toxicity rankings of NPs ($TEC_{50}$) were observed, showing ZnO ($2.4mgL^{-1}$) > NiO ($21.1mgL^{-1}$) > CuO ($36.6mgL^{-1}$) > $TiO_2$ ($62.5mgL^{-1}$) > $Fe_2O_3$ ($82.7mgL^{-1}$). These results indicate that an integrating results of endpoints might be an effective strategy for the assessment of contaminants.

Assessment of Heavy Metal Pollution in Mangrove Sediments of Chuuk and Kosrae, Federated States of Micronesia (마이크로네시아 맹그로브 퇴적물 내 중금속 오염도 평가)

  • Ra, Kongtae;Lee, Charity M.;Noh, Jae-Hoon;Park, Heung-Sik;Kim, Eun-Soo;Kwon, Moon-Sang;Kim, Kyung-Tae
    • Ocean and Polar Research
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    • v.35 no.4
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    • pp.453-464
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    • 2013
  • Heavy metals in the mangrove sediments of Chuuk and Kosrae, Federated States of Micronesia were analyzed to examine the pollution levels of heavy metals using enrichment factor (EF) and pollution load index (PLI). The mean concentrations of Cr, Ni, Cu, Zn, As, Cd and Pb in surface mangrove sediments were 642, 125, 46.9, 149, 15.6, 0.14 and 8.55 ${\mu}g$, respectively. Kosrae mangrove sediments showed the highest concentrations of Cr and Ni while Chuuk contains more of other metals such as Cu, Zn, As, Cd and Pb. Compared to those from other mangrove regions of the world, Cr, Ni and As levels in mangrove sediments from Micronesia were at higher levels whereas Cu, Zn, Cd and Pb were at lower to median levels. In core sediment of Chuuk, metal concentrations in the upper part were higher than those in the lower part. Based on the EF and PLI values, As is evaluated as the heaviest contaminant in the surface sediment from Micronesia whilst other metals (Cr, Ni, Cu, Zn, Cd and Pb) are present at slightly lesser levels.

Spectroscopic, Thermal and Biological Studies on Newly Synthesized Cu(II), Ni(II) and Co(II) Complexes with 3-N-2-hydroxyethylamine Benzanthrone and 3-N-2-aminoethylamine Benzanthrone (3-N-2-hydroxyethylamine benzanthrone 및 3-N-2-aminoethylamine benzanthrone에 대한 Cu(II), Ni(II) 및 Co(II) 착물의 분광학, 열 및 생물학적 연구)

  • Refat, Moamen S.;Megahed, Adel S.;El-Deen, Ibrahim M.;Grabchev, Ivo;El-Ghol, Samir
    • Journal of the Korean Chemical Society
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    • v.55 no.1
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    • pp.28-37
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    • 2011
  • Spectroscopic (infrared, electronic and $1^H$-NMR), elemental analyses CHN, molar conductivity, thermogravimetric analyses (TGA/DTG) and biological studies, of both benzanthrone derivatives 3-N-2-hydroxy ethylamine benzanthrone (HEAB) and 3-N-2-amino ethylamine benzanthrone (AEAB) with Cu(II), Co(II) and Ni(II) chlorides were discussed herein. Based on the above studies, HEAB ligand was suggested to be coordinated to each metal ions via hydroxo and amino groups to form [Cu(HEAB)$(Cl)_2$].$2H_2O$, [Co(HEAB)$(Cl)_2(H_2O)_2$].$8H_2O$ and [Ni(HEAB)$(Cl)_2(H_2O)_2$].$7H_2O$ coordinated complex. On the other hand, AEAB has an octahedral coordinated feature with formulas [Cu(AEAB)$(Cl)_2(H_2O)_2$].$2H_2O$, [Co(AEAB)$(Cl)_2(H_2O)_2$].$4H_2O$ and [Ni(AEAB)$(Cl)_2(H_2O)_2$]. $6H_2O$. The molar conductance values at $25{\circ}C$ for all complexes in DMF are slightly higher than free ligands; this supported the presence of chloride ions inside the coordination sphere. Both benzanthrone ligands and their complexes have been screened against different kinds of bacteria.

The Processing control of NiCuZn Ferrite (I) - Mixing and Size Reduction of Raw Materials by Wet Ball Milling. (NiCuZn Ferrite의 제조공정 제어 (제1보) - 습식 볼밀링에 의한 다성분 원료의 혼합 및 분쇄 공정의 고찰)

  • 류병환;김선희;최경숙;고재천
    • Journal of the Korean Magnetics Society
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    • v.5 no.6
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    • pp.928-936
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    • 1995
  • In this research, the processing control of NiCuZn Ferrite has been developed. The mixing and the size reduction of raw materials have been proceeded. In order to produce NiCuZn Ferrite, highly concentrated slurry with fixed ratio and wet ball milling were used. First, the dispersion behavior of raw mixture at the region of pH4~pH11 has been studied. Using wet ball milling operation, the best conditions of mixing and size reduction have been determined. Further more, the most suitable conditions, such as, dispersant kind, dispersant amount, milling time, and slurry concentration have been studied. The poly acrylic ammonium salt (PAN) was chosen as a suitable dispersant to have effective dispersion in basic region. The slurry of raw mixture without dispersant, showed high viscosity and poor grindability. As 0.7 wt% of PAN was added, the concentrated slurry (up to 55 vol%) was possible, and showed well grindability. After 18 h ball milling of 30 vol% of mixture slurry with 0.7 wt% of PAN, the average particle size and specific surface area of raw mixture were $0.54\mu\textrm{m}$ and $12.92m^{2}/cc$, respectively. The ball milled raw mixture, calcined at $700^{\circ}C$ for 3h, was totally changed into NiCuZn Ferrite with spinel phase.

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Effect of CuO Addition on the Microstructural and Electrical Properties of Ni-Mn Oxide NTC Thermistor (Ni-Mn 산화물 NTC 서미스터의 미세구조와 전기적 특성에 미치는 CuO 첨가의 효과)

  • Kim, Kyeong-Min;Lee, Sung-Gap;Lee, Dong-Jin;Park, Mi-Ri
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.6
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    • pp.337-341
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    • 2016
  • In this study, $ Ni_{0.79}(Mn_{2.21-x}Cu_x)O_4$ (x=0~0.25) specimens were prepared by using a conventional mixed oxide method. All specimens were sintered in air at $1,200^{\circ}C$ for 12 h and cooled at a rate of $2^{\circ}C/min$ to $800^{\circ}C$, subsequently quenching to room temperature. We investigated the structural and electrical properties of $ Ni_{0.79}(Mn_{2.21-x}Cu_x)O_4$ specimens with variation of CuO amount for the application of NTC thermistors. As results of X-ray diffraction patterns, all specimens showed the formation of a complete solid solution with cubic spinel phase. The relationship between ln ${\rho}$ and the reciprocal of absolute temperature(1/T) for the NTC thermistors was shown linearity, which exhibited the typical NTC thermistor properties. With increasing the amount of CuO, resistivity at room temperature, B-value, and temperature coefficient resistance decreased.

Reliability of Sn-Ag-Cu Solder Joint on ENEPIG Surface Finish: 2. Effects of time of Pd activation (ENEPIG 표면처리에서의 Sn-Ag-Cu 솔더조인트 신뢰성: 2. Pd 촉매 시간의 영향)

  • Huh, Seok-Hwan;Lee, Ji-Hye;Ham, Suk-Jin
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.3
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    • pp.51-56
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    • 2014
  • The reliability of solder joint is significantly affected by the property of surface finish. This paper reports on a study of high speed shear energy and failure mode for Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with the time of Pd activation. The nodule size of electroless Ni-P deposit increased with increasing the time of Pd activation. The roughness (Ra) of electroless Ni-P deposit decreased with increasing the time of Pd activation. Then, with $HNO_3$ vapor, the quasi-brittle and brittle mode of SAC405 solder joint decreased with increasing the time of Pd activation. This results indicate that the increase in the Pd activation time for Electroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface finish play a critical role for improving the robustness of SAC405 solder joint.

Synthesis and Characteristic of Cu/YSZ Composite for High Temperature Electrolysis Cathode (고온수전해 수소극용 Cu/YSZ의 제조 및 특성)

  • Hong, Hyun-Seon;Kim, Jong-Min;Shin, Seock-Jae
    • 한국신재생에너지학회:학술대회논문집
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    • 2007.11a
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    • pp.101-104
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    • 2007
  • 700 $^{\circ}C$이상의 온도에서 실시되는 고온수전해는 다가오는 수소경제시대의 주요한 수소제조기 술로 주목되고 있다. 이 연구에서는 Ni보다 전기전도도가 우수하고 가격이 저렴한 Cu를 사용하여 고온수 전해 수소극용 Cu/YSZ 복합체를 기계적합금법에 의해 제조하여 미세구조를 관찰하였고 Cu/YSZ를 수소전극으로 한 반전지를 제조하여 수조제조 실험을 실시하였다. Cu/YSZ 복합체는 Cu와 YSZ를 6:4(vol%)의 조성비로 유성밀을 사용하여 400 rpm으로 24시간 동안 실시하여 제조하였다. 고에너지 볼밀 후 500 nm이하의 나노크기의 복합체가 제조되었으며 Cu입자에 YSZ가 고르게 분포되어 있었다. 수은압입법으로 측정한 기공률은 70%이고 기공크기는 평균 0.5 ${\mu}m$으로 미세한 기공으로 이루어져 있었다. 제조된 Cu/YSZ 복합체를 수소전극으로 한 반전지를 제조하여 수소제조 실험을 실시한 결과 Ni/YSZ 전극보다 수소제조 성능이 우수한 것으로 나타났다. Cu의 높은 열팽창계수와 낮은 녹는점을 보완하면 우수한 고온수전해용 전극재료로 사용될 것으로 판단된다.

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The Research of Solar Cells Applying Ni/Cu/Ag Contact for Low Cost & High Efficiency (태양전지의 저가격.고효율화를 위한 Ni/Cu/Ag 전극에 관한 연구)

  • Cho, Kyeong-Yeon;Lee, Ji-Hun;Lee, Soo-Hong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.444-445
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    • 2009
  • The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on $0.2\sim0.6\;{\Omega}{\cdot}cm$, $20\;\times\;20\;mm^2$, CZ(Czochralski) wafer.

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